Polarization effects, surface states, and the source of electrons in AlGaN/GaN heterostructure field effect transistors
TL;DR: In this paper, the origin of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructure field effect transistors is examined theoretically and experimentally.
Abstract: The origin of the two-dimensional electron gas (2DEG) in AlGaN/GaN heterostructure field effect transistors is examined theoretically and experimentally. Based on an analysis of the electrostatics, surface states are identified as an important source of electrons. The role of the polarization-induced dipole is also clarified. Experimental Hall data for nominally undoped Al0.34Ga0.66N/GaN structures indicate that ∼1.65 eV surface donors are the actual source of the electrons in the 2DEG, which forms only when the barrier thickness exceeds 35 A.
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TL;DR: In this article, the authors show that the cause of current collapse is a charging up of a second virtual gate, physically located in the gate drain access region, thus acting as a negatively charged virtual gate.
Abstract: GaN based HFETs are of tremendous interest in applications requiring high power at microwave frequencies. Although excellent current-voltage (I-V) characteristics and record high output power densities at microwave frequencies have been achieved, the origin of the 2DEG and the factors limiting the output power and reliability of the devices under high power operation remain uncertain. Drain current collapse has been the major obstacle in the development of reliable high power devices. We show that the cause of current collapse is a charging up of a second virtual gate, physically located in the gate drain access region. Due to the large bias voltages present on the device during a microwave power measurement, surface states in the vicinity of the gate trap electrons, thus acting as a negatively charged virtual gate. The maximum current available from a device during a microwave power measurement is limited by the discharging of this virtual gate. Passivated devices located adjacent to unpassivated devices on the same wafer show almost no current collapse, thus demonstrating that proper surface passivation prevents the formation of the virtual gate. The possible mechanisms by which a surface passivant reduces current collapse and the factors affecting reliability and stability of such a passivant are discussed.
1,334 citations
TL;DR: In this paper, the authors provide a snapshot of the current state of droop research, reviews currently discussed droop mechanisms, contextualizes them, and proposes a simple yet unified model for the LED efficiency droop.
Abstract: Nitride-based light-emitting diodes (LEDs) suffer from a reduction (droop) of the internal quantum efficiency with increasing injection current. This droop phenomenon is currently the subject of intense research worldwide, as it delays general lighting applications of GaN-based LEDs. Several explanations of the efficiency droop have been proposed in recent years, but none is widely accepted. This feature article provides a snapshot of the present state of droop research, reviews currently discussed droop mechanisms, contextualizes them, and proposes a simple yet unified model for the LED efficiency droop.
Illustration of LED efficiency droop (details in Fig. 13).
778 citations
TL;DR: In this article, a recessed-gate structure was proposed to realize normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications.
Abstract: A recessed-gate structure has been studied with a view to realizing normally off operation of high-voltage AlGaN/GaN high-electron mobility transistors (HEMTs) for power electronics applications. The recessed-gate structure is very attractive for realizing normally off high-voltage AlGaN/GaN HEMTs because the gate threshold voltage can be controlled by the etching depth of the recess without significant increase in on-resistance characteristics. With this structure the threshold voltage can be increased with the reduction of two-dimensional electron gas (2DEG) density only under the gate electrode without reduction of 2DEG density in the other channel regions such as the channel between drain and gate. The threshold-voltage increase was experimentally demonstrated. The threshold voltage of fabricated recessed-gate device increased to -0.14 V while the threshold voltage without the recessed-gate structure was about -4 V. The specific on-resistance of the device was maintained as low as 4 m/spl Omega//spl middot/cm/sup 2/ and the breakdown voltage was 435 V. The on-resistance and the breakdown voltage tradeoff characteristics were the same as those of normally on devices. From the viewpoint of device design, the on-resistance for the normally off device was modeled using the relationship between the AlGaN layer thickness under the gate electrode and the 2DEG density. It is found that the MIS gate structure and the recess etching without the offset region between recess edge and gate electrode will further improve the on-resistance. The simulation results show the possibility of the on-resistance below 1 m/spl Omega//spl middot/cm/sup 2/ for normally off AlGaN/GaN HEMTs operating at several hundred volts with threshold voltage up to +1 V.
516 citations
Cites background from "Polarization effects, surface state..."
...The relation between and is given by [16]...
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TL;DR: In this article, the GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows the high threshold voltage, whereas the low on-state resistance is maintained by the 2D electron gas remaining in the channel except for the recessed gate region.
Abstract: This letter reports normally-off operation of an AlGaN/GaN recessed MIS-gate heterostructure field-effect transistor with a high threshold voltage. The GaN-based recessed MIS-gate structure in conjunction with negative polarization charges under the gate allows us to achieve the high threshold voltage, whereas the low on-state resistance is maintained by the 2-D electron gas remaining in the channel except for the recessed MIS-gate region. The fabricated device exhibits a threshold voltage as high as 5.2 V with a maximum field-effect mobility of 120 cm2/Vmiddots, a maximum drain current of over 200 mA/mm, and a breakdown voltage of 400 V.
383 citations
Cites background from "Polarization effects, surface state..."
...duce high-density and high-mobility 2-D electron gas (2DEG) [3], [4], which effectively decreases the ON-state resistance and, thus, reduces the loss of power transistors....
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TL;DR: In this paper, the authors investigated drain current dispersion effects in AlGaN-GaN HEMTs by means of pulsed, transient, and small-signal measurements.
Abstract: Drain current dispersion effects are investigated in AlGaN-GaN HEMTs by means of pulsed, transient, and small-signal measurements. Gate- and drain-lag effects characterized by time constants in the order of 10/sup -5/-10/sup -4/ s cause dispersion between dc and pulsed output characteristics when the gate or the drain voltage are pulsed. An activation energy of 0.3 eV is extracted from temperature-dependent gate-lag measurements. We show that two-dimensional numerical device simulations accounting only for polarization charges and donor-like traps at the ungated AlGaN surface can quantitatively reproduce all dispersion effects observed experimentally in the different pulsing modes, provided that the measured activation energy is adopted as the energetic distance of surface traps from the valence-band edge. Within this hypothesis, simulations show that surface traps behave as hole traps during transients, interacting with holes attracted at the AlGaN surface by the negative polarization charge.
316 citations
Cites background from "Polarization effects, surface state..."
...As pointed out in [14], overall charge neutrality within the AlGaN–GaN structure requires the two-dimensional (2–D) electron gas (2DEG) at the AlGaN–GaN heterointerface to be balanced, at equilibrium, by an equal, positive charge in...
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References
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TL;DR: In this paper, the spontaneous polarization, dynamical Born charges, and piezoelectric constants of the III-V nitrides AlN, GaN, and InN are studied ab initio using the Berry-phase approach to polarization in solids.
Abstract: The spontaneous polarization, dynamical Born charges, and piezoelectric constants of the III-V nitrides AlN, GaN, and InN are studied ab initio using the Berry-phase approach to polarization in solids. The piezoelectric constants are found to be up to ten times larger than in conventional III-V and II-VI semiconductor compounds, and comparable to those of ZnO. Further properties at variance with those of conventional III-V compounds are the sign of the piezoelectric constants (positive as in II-VI compounds) and the very large spontaneous polarization.
2,785 citations
TL;DR: In this article, the authors investigated the role of spontaneous and piezoelectric polarization on the carrier confinement at GaN/AlGaN and AlGaN/GaN interfaces.
Abstract: Carrier concentration profiles of two-dimensional electron gases are investigated in wurtzite, Ga-face AlxGa1−xN/GaN/AlxGa1−xN and N-face GaN/AlxGa1−xN/GaN heterostructures used for the fabrication of field effect transistors. Analysis of the measured electron distributions in heterostructures with AlGaN barrier layers of different Al concentrations (0.15
2,581 citations
TL;DR: In this article, the influence of piezoelectric fields on luminescence properties of GaInN strained quantum wells was studied and it was shown that an electric field of 1.08 MV/cm is induced by the piezolectric effect in strained Ga0.87In0.13N grown on GaN.
Abstract: We have studied the influence of piezoelectric fields on luminescence properties of GaInN strained quantum wells. Our calculation suggests that an electric field of 1.08 MV/cm is induced by the piezoelectric effect in strained Ga0.87In0.13N grown on GaN. The photoluminescence peak energy of the Ga0.87In0.13N strained quantum wells showed blue shift with increasing excitation intensity. Moreover, the well-width dependence of its luminescence peak energy was well explained when the piezoelectric fields were taken into account. These results clearly showed that the piezoelectric field induced the quantum-confined Stark effect.
1,105 citations
TL;DR: In this paper, the valence band discontinuities at various wurtzite GaN, AlN, and InN heterojunctions were measured by means of x-ray photoemission spectroscopy.
Abstract: The valence‐band discontinuities at various wurtzite GaN, AlN, and InN heterojunctions were measured by means of x‐ray photoemission spectroscopy. A significant forward–backward asymmetry was observed in the InN/GaN–GaN/InN and InN/AlN–AlN/InN heterojunctions. The asymmetry was understood as a piezoelectric strain effect. We report the valence band discontinuities for InN/GaN=1.05±0.25 eV, GaN/AlN=0.70±0.24 eV, and InN/AlN=1.81±0.20 eV, all in the standard type I lineup. These values obey transitivity to within the experimental accuracy. Tables of photoemission core level binding energies are reported for wurtzite GaN, AlN, and InN.
639 citations
TL;DR: In this article, the authors reported record high breakdown voltages up to 340 and 230 V realized on unintentionally doped (1.5 μm gate length) and Si doped(1 μm/GaN modulation doped field effect transistors (MODFETs), respectively.
Abstract: We report record high breakdown voltages up to 340 and 230 V realized on unintentionally doped (1.5 μm gate length) and Si doped (1 μm gate length) AlGaN/GaN modulation doped field effect transistors (MODFETs), respectively. The devices also have large transconductances up to 140 mS/mm and a full channel current of 150–400 mA/mm. The Si doped MODFET sample demonstrated a very high room temperature mobility of 1500 cm2/Vs. With these specifications, GaN field effect transistors as microwave power devices are practical.
342 citations