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Preventing Thermal Cycling and Vibration Failures in Electronic Equipment
22 Jun 2001-
TL;DR: In this paper, the authors estimate Fatigue Life in Thermal Cycling and Vibration Environments, and combine Fatigue Damage for Random Vibrration and Thermal Cycling in Surface-Mounted Components.
Abstract: Preface. Symbols. Physics of Failure In Electronic Systems. Thermal Expansion Displacements, Forces, and Stresses. Vibration of Beams and Other Simple Structures. Vibration of Printed Circuit Boards and Flat Plates. Estimating Fatigue Life in Thermal Cycling and Vibration Environments. Octave Rule, Snubbers, Dampers, and Isolation for Preventing Vibration Damage to Electronic Systems. Displacements, Forces, and Stresses in Axial Leaded Component Wires Due to Thermal Expansions. Designing Electronic Equipment for Sinusoidal Vibration. Assessment of Random Vibration on Electronic Design. Combining Fatigue Damage for Random Vibration and Thermal Cycling. Thermal Cycling Failures in Surface-Mounted Components. Stresses and Fatigue Life in Component Lead Wires and Solder Joints Due to Dynamic Forces and PCB Displacements. Fatigue Life of Long Components, Tall Components, and Small Components Mounted on PCBs. Wear and Interface Surface Fretting Corrosion in Electrical Connectors. Case Histories of Failures and Failure Analyses. Bibliography. Index.
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TL;DR: An assessment methodology based on vibration tests and finite element analysis (FEA) to predict the fatigue life of electronic components under random vibration loading and the calculated fatigue life based on the rainflow cycle counting results, the S–N curve, and the modified Miner’s rule agreed with actual testing results.
117 citations
TL;DR: In this paper, the authors explore the recent developments of the x-ray microdiffraction technique illustrated with its advanced applications in microelectronic devices and solar photovoltaic systems.
Abstract: Synchrotron x-ray microdiffraction (\(\upmu \hbox {XRD}\)) allows characterization of a crystalline material in small, localized volumes. Phase composition, crystal orientation and strain can all be probed in few-second time scales. Crystalline changes over a large areas can be also probed in a reasonable amount of time with submicron spatial resolution. However, despite all the listed capabilities, \(\upmu \hbox {XRD}\) is mostly used to study pure materials but its application in actual device characterization is rather limited. This article will explore the recent developments of the \(\upmu \hbox {XRD}\) technique illustrated with its advanced applications in microelectronic devices and solar photovoltaic systems. Application of \(\upmu \hbox {XRD}\) in microelectronics will be illustrated by studying stress and microstructure evolution in Cu TSV (through silicon via) during and after annealing. The approach allowing study of the microstructural evolution in the solder joint of crystalline Si solar cells due to thermal cycling will be also demonstrated.
45 citations
Cites background from "Preventing Thermal Cycling and Vibr..."
...Solder joint cracking is one of the major failure mechanisms in microelectronic packages and crystalline silicon photovoltaic modules [Steinberg (2001)-Wendt et al. (2009)]....
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27 May 2008
TL;DR: A nonlinear cumulative damage model was developed to account for the sequence effect of thermal cycling and vibration loading of a ceramic column grid array (CCGA) electronic component as discussed by the authors, which has the potential for application for other electronic packages.
Abstract: During operation, microelectronic packages are subjected to a combination of thermal cycling, power cycling, and dynamic mechanical loading such as shock and vibration. Although microelectronic packages are subjected to a combination of loading conditions, the vast body of existing literature has focused on understanding the reliability of microelectronic packages typically under one loading condition. Assessing solder joint reliability under loading conditions is especially important for harsh environments such as space, automobile, and military applications. The work presented here is directed towards testing and predicting solder joint reliability under multiple loading conditions in a ceramic column grid array (CCGA) electronic package. In this work, the sequence effect on solder joint reliability of a CCGA component under sequential accelerated thermal cycling tests (ATC) and vibration was investigated. A nonlinear cumulative damage model was developed to account for the sequence effect of thermal cycling and vibration loading of a CCGA electronic component. The methodology, developed in this work, is generic in nature and has the potential for application for other electronic packages.
36 citations
Cites methods from "Preventing Thermal Cycling and Vibr..."
...[7] and Steinberg [4] have used it for predicting fatigue life of electronic components under thermal and vibration loading; and Chih-Kuang and Hsuan-Yu [8] have used it to study the sequence effect of high-low vs low-high stresses on the creep fatigue life of SAC solder....
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TL;DR: In this article, the authors developed a rapid assessment methodology that can determine the solder joint fatigue life of ball grid array (BGA) and chip scale packages (CSP) under vibration loading.
Abstract: Vibration loading has become very important in the reliability assessment of modern electronic systems. The objective of this paper is to develop a rapid assessment methodology that can determine the solder joint fatigue life of ball grid array (BGA) and chip scale packages (CSP) under vibration loading. The current challenge is how to execute the vibration fatigue life analysis rapidly and accurately. The approach in this paper will involve global (entire printed wiring board (PWB)) and local (particular component of interest) modeling approaches. In the global model approach, the vibration response of the PWB will be determined. This global model will give us the response of the PWB at specific component locations of interest. This response is then fed into a local stress analysis for accurate assessment of the critical stresses in the solder joints of interest. The stresses are then fed into a fatigue damage model to predict the life. The goal is to retain as much accuracy and physical insight as possible while retaining computation efficiency.
27 citations
01 Jun 2010
TL;DR: In this article, a finite element-based fatigue life prediction approach is proposed to determine the solder joint fatigue life of electronic components under random vibration loading, which is based on experiments and finite element analysis (FEA).
Abstract: This work develops an assessment methodology based on experiments and finite element analysis (FEA) to determine the solder joint fatigue life of electronic components under random vibration loading. Specially designed PCB with Ball Grid Array (BGA) packages attached was mounted to the Electro dynamic shaker and was applied to different random vibration excitations at the supports. Meanwhile, an event detector monitored the resistance of the daisy chained circuits and recorded the failure time of the electronic components. In addition accelerometers and dynamic signal analyzer were utilized to record the time history data of both the shaker input and the PCB's response, and to obtain the transmissibility function of the test vehicles. This finite element based fatigue life prediction approach consists of two steps: The first step aims at characterizing fatigue properties of the solder joint by generating its own S-N (stress-life) curve. A sinusoidal vibration over a limited frequency band centered at the test vehicle's 1st natural frequency was applied and the time to failure was recorded. The resulting stress was obtained from the FE model through harmonic analysis in ANSYS. Spectrum analysis specified for random vibration, as the second step, was performed numerically in ANSYS to obtain the response Power Spectral Density (PSD) of the critical solder ball. The volume averaged Von Mises stress PSD was calculated out of the FEA results and then was transformed into time history data through inverse Fourier transform. Rainflow cycle counting was used to estimate cumulative damage of the critical solder joint. The calculated fatigue life based on the Rainflow cycle counting results, the S-N curve, and the modified Miner's rule agreed with actual testing results.
26 citations