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Journal ArticleDOI

Preyield Plastic Deformation in Copper Polycrystals

01 Apr 1969-Journal of Applied Physics (American Institute of Physics)-Vol. 40, Iss: 5, pp 2280-2286
TL;DR: In this article, the dislocation loops generated by the first few active sources on both primary and secondary slip systems generally traversed the entire cross section of the grain and the external surface was found to be a preferential site for dislocation multiplication even when grown in segments.
Abstract: Preyield dislocation motion and multiplication were studied in large‐grained polycrystalline OFHC copper by the etch‐pit technique. Specimens were loaded in compression and dislocation arrangements were observed in both the stressed and unstressed conditions. The dislocation loops generated by the first few active sources on both primary and secondary slip systems generally traversed the entire cross section of the grain. The observations were consistent with the idea that jog density is an important factor in determining the mobility of a dislocation segment. The external surface was found to be a preferential site for dislocation multiplication even when grown in segments, where they cut the surface, were immobile, and stress concentrations were carefully avoided. It is suggested that the rapid increase in length per unit volume of moving dislocation line that is associated with macroscopic yield requires motion of dislocation segments of high jog density.

Summary (1 min read)

INTRODUCTION

  • It is well known that high sensitivity strain measurements or dislocation.
  • D1s lbt'at ion motion and multiplication . . 8 JIluch before'yielding.
  • Copper ,single crystals with eXtremely low dislocation density.
  • In the present investigation an attempt has been m~de to get some additional ~information on these aspects by studying, using the etch pit technique, dislocation behavior in the very early deformation stages of large grained copper polycrystals.

II. EXPERH1E1'TAL PROCEDURE

  • Since dislocations in copper can be revealed by etching cmly vThen a 10'lT index ple.ne is parallel to the surface of observation special experimental techniques ;-rere needed to prepare specimens that had one or more surface grair1s in an etchable orientation.
  • Since most reliable etchants have been devebped only for planes of the, [ill} type in copper,9 experiments .. {ere ai::ls:i at obtaining a specimen in ''i'lhich at least one, grain ';.:ould have a [Ill} plane pa:::-allel to the surface.
  • \-;hen interior grains .lere to be exarrined after" defol'l!l2,ti0.
  • Yi the removal of the necess~rily large amcl1.:nts of IT'.2.teyial . . -3- UCRL-18524 from the surface without introd~cing any mechanical damage was accdmplished 11 in a modified polishing apparatus using a solution of 1: 1 nitric acid followed by the chemical polishing solution . , ..

III. RESULTS AND DISCUSSION

  • The rectystallized grains had a relatively high perfection with dislocation densities always less than 104jcm2 and frequently of the order of 10 3 /cm 2 Dislocations were quite uniformly distributed and there were usually no sub-boundaries.
  • When a new surface is exposed by exten,sive polishing just before application of a load, as has been done in previous experiments, some of the most mobile dislocations with lo~ jog densities will also intersect the surface at small angles so as to be able to shorten their length by conservative motion.
  • When a stress is app~ied some of these should start to mthe authors even at the smallest st:resses but multiplication should not take place.
  • Atentati ve mechanism that can explain this observation is as follows.
  • The tripole will be unstable unless the number of jogs on the initial segment was very small.

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Lawrence Berkeley National Laboratory
Recent Work
Title
PRE-YIELD PLASTIC DEFORMATION IN COPPER POLYCRYSTALS
Permalink
https://escholarship.org/uc/item/67x0w0zd
Authors
Vellaikal, Gopinathan
Washburn, Jack.
Publication Date
1968-11-01
eScholarship.org Powered by the California Digital Library
University of California

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UCRL-18524
PRE-YIELD PLASTIC DEFORMATION
IN COPPER
I?(}t;YC~YSTALS
Gopinathan Vellaikal and Jack Washburn
November 1968
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Ext
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RADIATION
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DISCLAIMER
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as
an account
of
work sponsored by the United States
Government. While this document is believed
to
contain
COlTect
information, neither the
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of
California, nor any
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Gopinathan
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PRE-YIELD
PLASTIC
DEFORMATION
IN
COPPER
POLYCRYSTALS
Gopinethan
Vellaikal
'and
~ack
Washburn
Inorganic
,Materials
Research
Division,
Lawrence
Radiatioll
Laboratory,
Department
of
Mineral
Technology,
College
01'
Engineering,
oL,the
iUniversity
of
California,
Berkeley,
California
ABSTRACT'
Pre-yield
dislocation
motion
and
multiplication
were
studied
in
large
gr,~aned
polycrystalline
copper
by
the
etch
pit
technique.
Specimens
were
loade'd
in,
compression
and
dislocation
arrangements
were
observed
in
both
'~
,
the
stressed
and
unstressed
conditions.
The
dislocation
lpops
generated
by
the
first
few
active
sources
on
both
primary
and
secondary
slip
systems
'generally
t,raversed
th~':'entire
cross
section
of
the
grain.
The
observa-
tions
were
consistent
with
the
idea
that
,jog
density
is
an
important
factor
in
determining'
the
mobility
of
~
dislocation
segment.
The
external
surface
was
found
to
be
a
preferential
site
for
dislocation
multiplication
even
when grown
in
segments,
where
they
cut
the
surface,
were
inunobile
,
'and'stress
concentrations
were
carefully
avoided.
It
is
,suggested
that
the
rapid
in,crease
in
length
per
unit
volume
of
mov.;i.ng
dislocation
line
that
is
associated
with
macroscopic
yield
requires
motion
of
dislcc
ation
segments
of
high
jog
density.

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TL;DR: In this paper, the dislocation density and distribution induced by tensile deformation in single crystals of silicon, aluminum and gold and by tension-compression cycling in aluminum single crystals and Al 2024-T3 alloys were studied by X-ray double-crystal diffractometry.
Abstract: The dislocation density and distribution induced by tensile deformation in single crystals of silicon, aluminum and gold and by tension-compression cycling in aluminum single crystals and Al 2024-T3 alloys were studied by X-ray double-crystal diffractometry. The measurements of dislocation density were made at various depths from the surface by removing surface layers incrementally. In this way, a propensity for work hardening in the surface layers compared to the bulk material was demonstrated for both tensiledeformed and fatigue-cycled metals. Analysis of the cycled Al 2024 alloy as a function of the fraction of fatigue life showed that the dislocation density in the surface layer increased rapidly early in the fatigue life and maintained virtually a plateau value from 20 to 90 pct of the life. Beyond 90 pct the dislocation density increased rapidly again to a critical value at failure. Evaluation of the dislocation distribution in depth showed that the excess dislocation density in the bulk material increased more gradually during the life. Using deeply penetrating molybdenumK α radiation, capable of analyzing grains representative of the bulk region, the accrued damage and the onset of fatigue failure could be predicted nondestructively for 2024 Al, cycled with constant stress as well as with variable stress amplitude. The dislocation structure produced in the bulk by prior cycling was unstable when the work-hardened surface layer was removed. It is proposed that the deformation response of the bulk material is controlled by the accumulation of dislocations and associated stresses in the surface layer.

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References
More filters
Journal ArticleDOI
TL;DR: A modification of an etch discovered by Lovell and Wernick has been shown to be a reliable means of revealing dislocations as etch pits on (111) faces of copper crystals as mentioned in this paper.
Abstract: A modification of an etch discovered by Lovell and Wernick has been shown to be a reliable means of revealing dislocations as etch pits on (111) faces of copper crystals. The etch has been employed to study dislocation distributions in as‐grown, annealed, and deformed crystals.A high‐temperature anneal is found to lower the dislocation density of melt‐grown crystals. A ``double‐etch'' technique is employed to observe the motion of dislocations, and to show that the dislocations initially present in these crystals are mobile at low stresses. Subboundaries are numerous in these crystals and are found capable of hindering dislocation movement. Observations of the dislocation structure of crystals deformed in bending and in tension are reported, including the appearance of ``glide polygonization'' after room‐temperature deformation.

119 citations

Journal ArticleDOI
TL;DR: In this paper, Zylindrische Zugproben aus vielkristallinem Kupfer wurden bei 78°K verformt and anschlieβend zur Stabilisierung der Versetzungsanordnung mit schnellen Neutronen bestrahlt (99,999% Cu, Probendurchmesser 5 mm, Dehnungen ϵ zwischen 0,2% and 3,2%).

94 citations

Journal ArticleDOI
TL;DR: In this article, the dislocation density and arrangement in the crystals were determined before, during, and after the deformations using an etch pit technique, and the yield stress was determined by the stress necessary to break the gliding dislocations through impurity atom barriers.
Abstract: 99.999% copper crystals were deformed in tension using an Instron tensile tester, and the dislocation density and arrangement in the crystals were determined before, during, and after the deformations using an etch pit technique. For crystals of low initial dislocation density, it was found that a large amount of dislocation multiplication occurred prior to yielding. Experimental relationships of dislocation density versus applied stress and versus shear strain were determined. It was found that the yield stress was not related to the initial dislocation density or arrangement. The yield stress was postulated to be determined by the stress necessary to break the gliding dislocations through impurity atom barriers in the crystal.

79 citations

Journal ArticleDOI
TL;DR: The characteristic motion of dislocations in copper single crystals of low dislocation density has been studied by etch pitting, especially near yield stress Dislocations are presumed to be locked at each position in as-annealed crystals as mentioned in this paper.
Abstract: The characteristic motion of dislocations in copper single crystals of low dislocation density has been studied by etch pitting, especially near yield stress Dislocations are presumed to be locked at each position in as-annealed crystals The motion of dislocations due to the application of stress is composed of three processes: (1) unlocking from the as-annealed position, (2) moving at a high speed, eg 400 cm/sec at a stress of 22 g/mm 2 , and (3) stopping at a certain final position depending on the stress level below yield stress It is considered tentatively that the locking is due to discrete pinning by impurity atoms, and the main obstacles to the dislocation motion are thought to be other locked dislocations From quantitative studies of each process a possible mechanism of yielding of copper crystals is suggested

74 citations

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TL;DR: In this article, an acid saw and an acid polisher were used for cutting and polishing copper crystals, and evidence was presented that the cutting did not introduce dislocations into the crystals.
Abstract: An acid saw and an acid polisher for cutting and polishing copper crystals are described. Evidence is presented that the cutting and polishing do not introduce dislocations into the crystals. Using these techniques, copper crystals with a dislocation density of 5×103/cm2 have been prepared.

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