scispace - formally typeset
Search or ask a question
Journal ArticleDOI

Prognostics implementation of electronics under vibration loading

01 Dec 2007-Microelectronics Reliability (Pergamon)-Vol. 47, Iss: 12, pp 1849-1856
TL;DR: A methodology for monitoring, recording, and analyzing the life-cycle vibration loads for remaining-life prognostics of electronics and verified by the real-time to failure of the components by checking the components’ resistance data.
About: This article is published in Microelectronics Reliability.The article was published on 2007-12-01. It has received 110 citations till now. The article focuses on the topics: Prognostics & Strain gauge.
Citations
More filters
Book
01 Jan 2008
TL;DR: In this paper, a physics of failure (PoF) based approach is proposed for the prediction of the future state of reliability of a system under its actual application conditions, which integrates sensor data with models that enable in situ assessment of the deviation or degradation of a product from an expected normal operating condition.
Abstract: Reliability is the ability of a product or system to perform as intended (i.e., without failure and within specified performance limits) for a specified time, in its life-cycle environment. Commonly used electronics reliability prediction methods (e.g., Mil-HDBK-217, 217-PLUS, PRISM, Telcordia, FIDES) based on handbook methods have been shown to be misleading and provide erroneous life predictions. The use of stress and damage models permits a far superior accounting of the reliability and the physics of failure (PoF); however, sufficient knowledge of the actual operating and environmental application conditions of the product is still required. This article presents a PoF-based prognostics and health management approach for effective reliability prediction. PoF is an approach that utilizes knowledge of a product's life-cycle loading and failure mechanisms to perform reliability modeling, design, and assessment. This method permits the assessment of the reliability of a system under its actual application conditions. It integrates sensor data with models that enable in situ assessment of the deviation or degradation of a product from an expected normal operating condition and the prediction of the future state of reliability. This article presents a formal implementation procedure, which includes failure modes, mechanisms, and effects analysis, data reduction and feature extraction from the life-cycle loads, damage accumulation, and assessment of uncertainty. Applications of PoF-based prognostics and health management are also discussed. Keywords: reliability; prognostics; physics of failure; design-for-reliability; reliability prediction

677 citations

Journal ArticleDOI
TL;DR: In this article, a new method for state of health (SOH) and remaining useful life (RUL) estimations for lithium-ion batteries using Dempster-Shafer theory (DST) and the Bayesian Monte Carlo (BMC) method is proposed.

586 citations

Proceedings ArticleDOI
12 Dec 2008
TL;DR: The metrics that are already used for prognostics in a variety of domains including medicine, nuclear, automotive, aerospace, and electronics are surveyed and differences and similarities between these domains and health maintenance have been analyzed to help understand what performance evaluation methods may or may not be borrowed.
Abstract: Prognostics is an emerging concept in condition based maintenance (CBM) of critical systems. Along with developing the fundamentals of being able to confidently predict Remaining Useful Life (RUL), the technology calls for fielded applications as it inches towards maturation. This requires a stringent performance evaluation so that the significance of the concept can be fully exploited. Currently, prognostics concepts lack standard definitions and suffer from ambiguous and inconsistent interpretations. This lack of standards is in part due to the varied end-user requirements for different applications, time scales, available information, domain dynamics, etc. to name a few issues. Instead, the research community has used a variety of metrics based largely on convenience with respect to their respective requirements. Very little attention has been focused on establishing a common ground to compare different efforts. This paper surveys the metrics that are already used for prognostics in a variety of domains including medicine, nuclear, automotive, aerospace, and electronics. It also considers other domains that involve prediction-related tasks, such as weather and finance. Differences and similarities between these domains and health maintenance have been analyzed to help understand what performance evaluation methods may or may not be borrowed. Further, these metrics have been categorized in several ways that may be useful in deciding upon a suitable subset for a specific application. Some important prognostic concepts have been defined using a notational framework that enables interpretation of different metrics coherently. Last, but not the least, a list of metrics has been suggested to assess critical aspects of RUL predictions before they are fielded in real applications.

456 citations

Proceedings ArticleDOI
15 Mar 2006
TL;DR: In this article, damage pre-cursors based residual life computation approach for various package elements to prognosticate electronic systems prior to appearance of any macro-indicators of damage has been presented.
Abstract: In this paper, damage pre-cursors based residual life computation approach for various package elements to prognosticate electronic systems prior to appearance of any macro-indicators of damage has been presented. In order to implement the system-health monitoring system, precursor variables or leading indicators-of-failure have been identified for various package elements and failure mechanisms. Model-algorithms have been developed to correlate precursors with impending failure for computation of residual life. Package elements investigated include, first-level interconnects, dielectrics, chip interconnects, underfills and semiconductors. Examples of damage proxies include, phase growth rate of solder interconnects, intermetallics, normal stress at chip interface, and interfacial shear stress

331 citations

Journal ArticleDOI
TL;DR: A fusion prognostics approach is presented, which combines or “fuses together” the model-based and data-driven approaches, to enable markedly better prognosis of remaining useful life.

319 citations


Cites methods from "Prognostics implementation of elect..."

  • ...Other applications in electronics where data-driven approaches have been used for RUL estimation include global positioning systems [40]; avionics [41]; power electronics devices (IGBTs) used in avionics [42]; and aircraft electrical power systems [43,44]....

    [...]

References
More filters
Book
02 Sep 2008
TL;DR: The state-of-the-art in the area of electronics prognostics and health management can be found in this article, where four current approaches include built-in-test (BIT), use of fuses and canary devices, monitoring and reasoning of failure precursors, and modeling accumulated damage based on measured life-cycle loads.
Abstract: There has been a growing interest in monitoring the ongoing "health" of products and systems in order to predict failures and provide warning to avoid catastrophic failure. Here, health is defined as the extent of degradation or deviation from an expected normal condition. While the application of health monitoring, also referred to as prognostics, is well established for assessment of mechanical systems, this is not the case for electronic systems. However, electronic systems are integral to the functionality of most systems today, and their reliability is often critical for system reliability. This paper presents the state-of-practice and the current state-of-research in the area of electronics prognostics and health management. Four current approaches include built-in-test (BIT), use of fuses and canary devices, monitoring and reasoning of failure precursors, and modeling accumulated damage based on measured life-cycle loads. Examples are provided for these different approaches, and the implementation challenges are discussed.

725 citations

Book
01 Jan 1973
TL;DR: Vibrations of simple electronic systems lumped masses for electronic assemblies beam structures for electronic subassemblies electronic components, frames, and rings printed-circuit boards and flat plates preventing sinusoidal vibration failures understanding random vibration designing for shock environments designing electronic boxes vibration fixtures and vibration testing fatigue in electronic structures as mentioned in this paper.
Abstract: Vibrations of simple electronic systems lumped masses for electronic assemblies beam structures for electronic subassemblies electronic components, frames, and rings printed-circuit boards and flat plates preventing sinusoidal vibration failures understanding random vibration designing for shock environments designing electronic boxes vibration fixtures and vibration testing fatigue in electronic structures.

523 citations


"Prognostics implementation of elect..." refers background in this paper

  • ...The largest displacement occurred in the middle of the board and was found...

    [...]

  • ...It integrates sensor data with models that enable in-situ assessment of the deviation or degradation of a product from an expected normal operating condition (i.e., the system’s ‘‘health’’) and also predict the future state of reliability based on current and historic conditions....

    [...]

Proceedings ArticleDOI
15 Mar 2006
TL;DR: In this article, damage pre-cursors based residual life computation approach for various package elements to prognosticate electronic systems prior to appearance of any macro-indicators of damage has been presented.
Abstract: In this paper, damage pre-cursors based residual life computation approach for various package elements to prognosticate electronic systems prior to appearance of any macro-indicators of damage has been presented. In order to implement the system-health monitoring system, precursor variables or leading indicators-of-failure have been identified for various package elements and failure mechanisms. Model-algorithms have been developed to correlate precursors with impending failure for computation of residual life. Package elements investigated include, first-level interconnects, dielectrics, chip interconnects, underfills and semiconductors. Examples of damage proxies include, phase growth rate of solder interconnects, intermetallics, normal stress at chip interface, and interfacial shear stress

331 citations


"Prognostics implementation of elect..." refers methods in this paper

  • ...The interconnect strain values are then used in a vibration failure fatigue model for damage assessment....

    [...]

Journal ArticleDOI
TL;DR: In this paper, a physics-of-failure-based methodology for determining the damage or life consumption in a product is presented, where a data recorder has been used to monitor the temperature and vibration loads on a printed circuit board placed under the hood of a car.
Abstract: Failures in electronic products are often attributable to various combinations, intensities, and durations of environmental loads, such as temperature, humidity, vibration, and radiation. For many of the failure mechanisms in electronic products, there are models that relate environmental loads to the time to failure of the product. Thus, by monitoring the environment of a product over its life cycle, it may be possible to determine the amount of damage induced by various loads and predict when the product might fail. This paper describes the development of a physics-of-failure-based methodology for determining the damage or life consumption in a product. As a demonstration of the methodology, a data recorder has been used to monitor the temperature and vibration loads on a printed circuit board placed under the hood of a car. The data collected by the recorder has been used to determine the life consumption in the solder joints of the printed circuit board due to temperature and vibration loading. The calculated remaining life has then been compared with temperature cycling test results on the board to assess the validity of the approach.

167 citations


Additional excerpts

  • ...All rights reserved....

    [...]

01 Jan 2006
TL;DR: An approach for recording in-situ monitored loads in a condensed form without sacrificing the load information required for subsequent prognostic assessments is presented.
Abstract: Environmental and usage loads experienced by a product in the field can be monitored in-situ and used with prognostic models to assess and predict the reliability of the product. This paper presents an approach for recording in-situ monitored loads in a condensed form without sacrificing the load information required for subsequent prognostic assessments. The approach involves optimally binning data in a manner that provides the best estimate of the underlying probability density function of the load parameter. The load distributions were developed using non-parametric histogram and kernel density estimation methods. The use of the proposed binning and density estimation techniques with a prognostic methodology were demonstrated on an electronic assembly.

42 citations