Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
TL;DR: In this article, the authors discuss the materials, applications and recent advances of electrically conductive adhesives as an environmental friendly solder replacement in the electronic packaging industry, and discuss the potential of ECAs to replace tin-lead metal solders in all applications.
Abstract: Tin–lead solder alloys are widely used in the electronic industry. They serve as interconnects that provide the conductive path required to achieve connection from one circuit element to another. There are increasing concerns with the use of tin–lead alloy solders in recognition of hazards of using lead. Lead-free solders and electrically conductive adhesives (ECAs) have been considered as the most promising alternatives of tin-lead solder. ECAs consist of a polymeric resin (such as, an epoxy, a silicone, or a polyimide) that provides physical and mechanical properties such as adhesion, mechanical strength, impact strength, and a metal filler (such as, silver, gold, nickel or copper) that conducts electricity. ECAs offer numerous advantages over conventional solder technology, such as environmental friendliness, mild processing conditions (enabling the use of heat-sensitive and low-cost components and substrates), fewer processing steps (reducing processing cost), low stress on the substrates, and fine pitch interconnect capability (enabling the miniaturization of electronic devices). Therefore, conductive adhesives have been used in liquid crystal display (LCD) and smart card applications as an interconnect material and in flip–chip assembly, chip scale package (CSP) and ball grid array (BGA) applications in replacement of solder. However, no currently commercialized ECAs can replace tin–lead metal solders in all applications due to some challenging issues such as lower electrical conductivity, conductivity fatigue (decreased conductivity at elevated temperature and humidity aging or normal use condition) in reliability testing, limited current-carrying capability, and poor impact strength. Considerable research has been conducted recently to study and optimize the performance of ECAs, such as electrical, mechanical and thermal behaviors improvement as well as reliability enhancement under various conditions. This review article will discuss the materials, applications and recent advances of electrically conductive adhesives as an environmental friendly solder replacement in the electronic packaging industry.
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TL;DR: This literature work seeks to review the numerous research attempts thus far for high temperature die attach materials on wide band gap materials of silicon carbide, gallium nitride and diamond, document their successes, concerns and application possibilities, all of which are essential for highTemperature reliability.
Abstract: The need for high power density and high temperature capabilities in today's electronic devices continues to grow. More robust devices with reliable and stable functioning capabilities are needed, for example in aerospace and automotive industries as well as sensor technology. These devices need to perform under extreme temperature conditions, and not show any deterioration in terms of switching speeds, junction temperatures, and power density, and so on. While the bulk of research is performed to source and manufacture these high temperature devices, the device interconnect technology remains under high focus for packaging. The die attach material has to withstand high temperatures generated during device functioning and also cope with external conditions which will directly determine how well the device performs in the field. This literature work seeks to review the numerous research attempts thus far for high temperature die attach materials on wide band gap materials of silicon carbide, gallium nitride and diamond, document their successes, concerns and application possibilities, all of which are essential for high temperature reliability.
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TL;DR: The state-of-the-art multifunctional epoxy nanocomposites with magnetic, electrically conductive, thermally conductive and flame retardant properties of the past few years are reviewed in this article.
Abstract: Epoxy is a crucial engineered thermosetting polymer with wide industrial applications in adhesive, electronics, aerospace and marine systems In this review, basic knowledge of epoxy resins and the challenge for the preparation of epoxy nanocomposites are summarized The state-of-art multifunctional epoxy nanocomposites with magnetic, electrically conductive, thermally conductive, and flame retardant properties of the past few years are critically reviewed with detailed examples The applications of epoxy nanocomposites in aerospace, automotives, anti-corrosive coatings, and high voltage fields are briefly summarized This knowledge will have great impact on the field and will facilitate researchers in seeking new functions and applications of epoxy resins in the future
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TL;DR: This article aims to present a review of challenges and issues faced by Asian countries in managing their e-waste in a sustainable way.
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Book•
01 Jan 2003
TL;DR: In this article, the authors present a survey of the properties of polymers and their application in the field of chemical engineering, including the following: Coextrusion, Injection Molding, Flexible Packaging, Fibers, Polymer-Clay, and Plasticizers.
Abstract: VOLUME 1. Acetylenic Polymers, Substituted. Acrylamide Polymers. Acrylic (and Methacrylic) Acid Polymers. Acrylic Ester Polymers. Acrylonitrile and Acrylonitrile Polymers. Acrylonitrile-Butadiene-Styrene Polymers. Additives. Adhesion. Adhesive Compounds. Aging, Physical. Alkyd Resins. Am,ino Resins and Plastics. Antifoaming Agents. Atomic Force Microscopy. Biotechnology Applications. Bloack Copolymers. Bloack Copolymers, Ternary Triblock. Blow Molding. Chitin and Chitosan. Chromatography, Affinity. Chromatography, HPLC. Chromatography, Size Exclusion. Coating Methods, Survey. Coatings. VOLUME 2 Coextrusion. Colorants. Coloring Processes. Composites, Fabrication. Conformation and Configuration. Critical Phase Polymerizations. Cyclohexanedimethanol Polyesters. Dendronized Polymers. Dental Applications. Diacethylene and Triacethylene Polymers. Elasticity, Rubber-Like. Electronic Packaging. Electrooptical Applications. Engineering, Thermoplastics, Overview. Enzymatic Polymerization. Ethylene Polymers, Chlorosulfonated. Ethylene Polymers, HDPE. Ethylene Polymers, LDPE. Ehtylene Polymers, LLDPE. Ethylene-Acrylic Elastomers. Ethylene-Norbornene Copolymers. Extrusion. Films, Orientation. Fluorocarbon Elastomers. Fractography. Fracture. Glass Transition. Hardness. Hydrogels. Hyperbranched Polymers. VOLUME 3 Injection Molding. Inorganic Polymers. Laser Light Scattering. Light-Emiting Diodes. Lignin. Liquid Crystalline Polymers, Main-Chain. Liquid Crystalline Thermosets. Mass Spectrometry. Membrane Technology. Methacrylic Ester Polymers. Micromechanical Properties. Modeling of Polymer Processing and Properties. Nanocomposites, Polymer-Clay. Packaging, Flexible. Perfluorinated Polymers, Perfluorinated Ethylene-Propylene Copolymers. Perfluorinated Polymers Polytetrafluoroethylene. Perfluorinated Polymers Tetrafluoroethylene-Ethylene Copolymers. Perfluorinated Polymers, Tetrafluoroethylene-Perfluorinated Copolymers. Perfluorinated Polymers. Tetrafluoroethylene-Perfluorovinyl Ether Copolymers. Phosgene. Phosphorus-Containing Polymers and Oligomers. Piezoelectric Polymers. Plasticizers. Poly(3-Hydroxyalkanoates). Poly(Trimethylene Terephthalate). Polyamides, Atomatic. Polyamides, Fibers. Polyamides, Plastics. Polycyanoacrylates. Polyesters, Fibers. Polyketones. Polynucleotides. Polysulfides. VOLUME 4 Polysulfones. Polyurethanes. Pressure-Sensitive Adhesive. Reinforcement. Release Agents. Shape-Memory Polymers. Single-Site Catalysis. Stabilization. Styrene-Butadiene Rubber (SBR). Styrene Polymers. Sulfur-Containing Polymers. Surface Properties. Syndiotactic Polystyrene. Vinyl Fluoride Polymers (PVF). Vinylidene Chloride Polymers. Vinylidene Fluoride Polymers. Viscoelasticity. Weathering.
3,190 citations
TL;DR: The most widely used Pb-free solders have the eutectic composition as mentioned in this paper, which has been identified as a major factor affecting alloy selection, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation.
Abstract: Practically all microelectronic assemblies in use today utilize Pb–Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb–Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable “Pb-free” solders an important issue for microelectronics assembly. Approximately 70 Pb-free solder alloy compositions have been proposed thus far. There is a general lack of engineering information, and there is also significant disparity in the information available on these alloys. The issues involved can be divided into two broad categories: manufacturing and reliability/performance. A major factor affecting alloy selection is the melting point of the alloy, since this will have a major impact on the other polymeric materials used in microelectronic assembly and encapsulation. Other important manufacturing issues are cost, availability, and wetting characteristics. Reliability related properties include mechanical strength, fatigue resistance, coefficient of thermal expansion and intermetallic compound formation. The data available in the open literature have been reviewed and are summarized in this paper. Where data were not available, such as for corrosion and oxidation resistance, chemical thermodynamics was used to develop this information. While a formal alloy selection decision analysis methodology has not been developed, less formal approaches indicate that Sn-rich alloys will be the Pb-free solder alloys of choice, with three to four alloys being identified for each of the different applications. Research on this topic continues at the present time at a vigorous pace, in view of the imminence of the issue.
1,786 citations
Book•
01 Aug 1982TL;DR: In this article, a novel organosilane coupling agent is described and its use as an adhesion promoter in mineral-filled unsaturated polymer systems is described, where the coupling agent comprises the reaction product of an isocyanatoalkyl ester of acrylic or methacrylic acid with an aminoorganosilanes.
Abstract: A novel organosilane coupling agent is disclosed and its use as an adhesion promoter in mineral-filled unsaturated polymer systems is described. Additionally, use of the organosilane as a primer for various substrates is presented. The coupling agent comprises the reaction product of an isocyanatoalkyl ester of acrylic or methacrylic acid with an aminoorganosilane. The organosilane so formed links the acryloxyalkyl or methacryloxyalkyl functionality to an alkylene, or aminoalkylene, group on the silicon atom through a urea group. Use of the organosilane as a coupling agent in a mineral-filled unsaturated polymer results in superior resistance to moisture, particularly when the polymer is selected from the group of corrosion resistant unsaturated polyesters.
1,522 citations
Patent•
16 Sep 1974TL;DR: In this article, a carboxylic acid anhydride was used as a coupling agent for glass fibers to resinous plastics, including thermoplastics and thermosetting resins and the elastomeric materials.
Abstract: The silane coupling agents are prepared by reaction of the mercapto silane with a carboxylic acid anhydride whereby the mercapto group adds across the double bond of the anhydride. The compounds can be converted to the corresponding diacid by reaction with water, and are useful as coupling agents for bonding glass fibers to resinous plastics, including thermoplastics and thermosetting resins and the elastomeric materials.
1,331 citations