Recombinant Waveguide Power Divider
Citations
95 citations
Cites background from "Recombinant Waveguide Power Divider..."
...tolerance is required to fabricate the components and overall cost limits their applications at millimeter wave [13]–[17]....
[...]
79 citations
Cites background or methods from "Recombinant Waveguide Power Divider..."
...SIW components such as antennas [15], [27]–[32], filters [33], [34], diplexers [33], [35],...
[...]
...Three-way power dividers were used in some RF systems, and some previous works have been focused on this topic [32], [40]–[44]....
[...]
...In [32], recombinant topology was utilized to design in-phase power dividers...
[...]
73 citations
21 citations
Cites background from "Recombinant Waveguide Power Divider..."
...This power divider is based on the concept of a straight Y-junction with bifurcation such as the integrated structures introduced in [24]–[26]....
[...]
14 citations
Cites background from "Recombinant Waveguide Power Divider..."
...The advantage compared to microstrip and Substrate Integrated Waveguide (SIW) technologies is that this gap waveguide technology can keep a planar profile as well as being low loss [4-6]....
[...]
References
[...]
2,353 citations
"Recombinant Waveguide Power Divider..." refers background in this paper
...Markowitz [15] has formulated a model by restricting its validity to a waveguide width of less than a wavelength in the substrate ....
[...]
1,095 citations
"Recombinant Waveguide Power Divider..." refers background in this paper
...I. INTRODUCTION I N A radar front-end development, the antenna has alwaysbeen one of the critical components that determine the performance of the entire system [1]–[5]....
[...]
498 citations
187 citations
"Recombinant Waveguide Power Divider..." refers background in this paper
...1-by-8 and 1-by-16 dividers were proposed in [7], based on unequal T-junction power splitters presented in [12]....
[...]
160 citations
"Recombinant Waveguide Power Divider..." refers background in this paper
...Digital Object Identifier 10.1109/TMTT.2013.2283195 alternative, offering low manufacturing cost, high integration density, and more compact design [6]–[8]....
[...]