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Proceedings ArticleDOI

Reliability of High Temperature Inverters for HEV

F. Renken1, G. Ehbauer1, V. Karrer1, R. Knorr1, S. Ramminger2, Norbert Seliger2, Eckhard Prof. Wolfgang2 
02 Apr 2007-pp 563-568
TL;DR: In this paper, the crack propagation speed of bond and solder joint connections is calculated on the basis of the power electronics for a hybrid drive system, and the simulation results show that the reliability of these connections is improved with higher complexity.
Abstract: The requirements for the reliability of electronic circuits becomes constantly higher. Therefore, in particular, the strongly growing automotive industry will be influenced, where the number of electronic circuits and the installed power is constantly increasing. Meanwhile for example a hybrid vehicle can be powered by an electrical system with more than 100 kW. The increasing power density of these circuits and the use of the components at higher ambient temperatures lead to the fact that the electronic components will heat up more and more. Additionally the further integration of electronic components requires a higher reliability of single semiconductors. With higher complexity it is more and more a challenge to prove the total reliability of these circuits by accelerated tests. Siemens has been working on the reliability of high temperature applications for years. This article describes a simulation concept, which calculates the crack propagation speed of bond and solder joint connections. Input parameters for the simulation are: Material properties, geometry and different stress types as current loads or temperature. This procedure is demonstrated on the basis of the power electronics for a hybrid drive system.
Citations
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Journal ArticleDOI
TL;DR: An extensive review on essential components used in HEVs such as their architectures with advantages and disadvantages, choice of bidirectional converter to obtain high efficiency, combining ultracapacitor with battery to extend the battery life, traction motors’ role and their suitability for a particular application are presented.
Abstract: The rapid consumption of fossil fuel and increased environmental damage caused by it have given a strong impetus to the growth and development of fuel-efficient vehicles. Hybrid electric vehicles (HEVs) have evolved from their inchoate state and are proving to be a promising solution to the serious existential problem posed to the planet earth. Not only do HEVs provide better fuel economy and lower emissions satisfying environmental legislations, but also they dampen the effect of rising fuel prices on consumers. HEVs combine the drive powers of an internal combustion engine and an electrical machine. The main components of HEVs are energy storage system, motor, bidirectional converter and maximum power point trackers (MPPT, in case of solar-powered HEVs). The performance of HEVs greatly depends on these components and its architecture. This paper presents an extensive review on essential components used in HEVs such as their architectures with advantages and disadvantages, choice of bidirectional converter to obtain high efficiency, combining ultracapacitor with battery to extend the battery life, traction motors’ role and their suitability for a particular application. Inclusion of photovoltaic cell in HEVs is a fairly new concept and has been discussed in detail. Various MPPT techniques used for solar-driven HEVs are also discussed in this paper with their suitability.

170 citations

Kolar, Biela, Waffler, Friedli, Badstuebner 
01 Jan 2010
TL;DR: An objective Technology Node of a system is obtained, whereby physical limits are implicitly taken into account and the sensitivity of the system performance with regard to the technological base can be calculated directly and the internal interdependence of Performance Indices directly studied.
Abstract: In 2003 the Roadmapping Initiative of the European Center of Power Electronics (ECPE) has been started based on a future vision of society in 2020 in order to define the future role of power electronics, and to identify technological barriers and prepare new technologies well in time. In the framework of this initiative a new mathematically supported approach for the roadmapping in power electronics has been developed. As described in this paper the procedure relies on a comprehensive mathematical modeling and subsequent multi-objective optimization of a converter system. The relationship between the technological base and the performance of the system then exists as a mathematical representation, whose optimization assures the best possible exploitation of the available degrees of freedom and technologies. Thus an objective Technology Node of a system is obtained, whereby physical limits are implicitly taken into account. Furthermore, the sensitivity of the system performance with regard to the technological base can be calculated directly and the internal interdependence of Performance Indices directly studied. Accordingly, the improvement in performance achievable by improvements in the technology base can be tested and assessed in advance. Moreover, different system concepts, i.e. circuit topologies, control procedures, etc. can be evaluated and directly compared with regard to achievable efficiency, power density and costs in the form of the associated Pareto Front which defines the boundary of the Feasible Performance Space. If the target performance lies outside the Pareto Envelope of known system concepts and state-of-the-art technologies, a new technology must be employed. The necessity of a technological leap, i.e. the introduction of a Disruptive Technology can thus be recognized at an early stage. This offers an excellent basis for effective roadmapping for various main application areas in power electronics.

146 citations

Johann W. Kolar1, Jurgen Biela1, S. Waffler1, Thomas Friedli1, U. Badstuebner1 
16 Mar 2010
TL;DR: In this article, a mathematical approach for road mapping in power electronics has been developed, which relies on a comprehensive mathematical modeling and subsequent multi-objective optimization of a converter system, whose optimization assures the best possible exploitation of the available degrees of freedom and technologies.
Abstract: In 2003 the Roadmapping Initiative of the European Center of Power Electronics (ECPE) has been started based on a future vision of society in 2020 in order to define the future role of power electronics, and to identify technological barriers and prepare new technologies well in time. In the framework of this initiative a new mathematically supported approach for the roadmapping in power electronics has been developed. As described in this paper the procedure relies on a comprehensive mathematical modeling and subsequent multi-objective optimization of a converter system. The relationship between the technological base and the performance of the system then exists as a mathematical representation, whose optimization assures the best possible exploitation of the available degrees of freedom and technologies. Thus an objective Technology Node of a system is obtained, whereby physical limits are implicitly taken into account. Furthermore, the sensitivity of the system performance with regard to the technological base can be calculated directly and the internal interdependence of Performance Indices directly studied. Accordingly, the improvement in performance achievable by improvements in the technology base can be tested and assessed in advance. Moreover, different system concepts, i.e. circuit topologies, control procedures, etc. can be evaluated and directly compared with regard to achievable efficiency, power density and costs in the form of the associated Pareto Front which defines the boundary of the Feasible Performance Space. If the target performance lies outside the Pareto Envelope of known system concepts and state-of-the-art technologies, a new technology must be employed. The necessity of a technological leap, i.e. the introduction of a Disruptive Technology can thus be recognized at an early stage. This offers an excellent basis for effective roadmapping for various main application areas in power electronics.

122 citations

Journal ArticleDOI
TL;DR: A mission-profile-dependent simulation model based on MATLAB for quantitatively assessing the reliability of the electric drivetrain of HEVs takes into consideration the variable driving scenarios, dormant mode, electrical stresses, and thermal stresses and verified the benefits of two proposed control strategies in terms of power losses and reliability.
Abstract: The reliability prediction of hybrid electric vehicles (HEVs) is of paramount importance for planning, design, control, and operation management of vehicles, since it can provide an objective criterion for comparative evaluation of various configurations and topologies and can be used as an effective tool to improve the design and control of the overall system. This paper presents a mission-profile-dependent simulation model based on MATLAB for quantitatively assessing the reliability of the electric drivetrain of HEVs. This model takes into consideration the variable driving scenarios, dormant mode, electrical stresses, and thermal stresses. Therefore, more reliable and accurate prediction of system reliability has been achieved. The methodology is explained in detail, and the results of reliability assessment based on a series HEV are presented. Based on reliability analysis, two control strategies are proposed to increase the mean time to failure of HEV powertrains: 1) variable dc-link voltage control and 2) hybrid discontinuous pulsewidth modulation scheme. These novel control schemes reduce the power losses and thermal stresses of power converters, and consequently, enhance system reliability. Numerical simulation results verify the benefits of two proposed control strategies in terms of power losses and reliability.

48 citations


Cites methods from "Reliability of High Temperature Inv..."

  • ...A test bench implemented with various driving cycles to verify the reliability of new prototypes of inverters for electric motors in hybrid vehicles is presented in [6]....

    [...]

Proceedings ArticleDOI
01 Nov 2008
TL;DR: In this article, different gate drive topologies for SiC JFETs with respect to high temperature operation capability, limitations, dynamic performance and circuit complexity are discussed, and an experimental performance comparison of edge-triggered and phase-difference HT drivers with a conventional room temperature jFET gate driver is given.
Abstract: Volume and weight limitations for components in hybrid electrical vehicle (HEV) propulsion systems demand highly-compact and highly-efficient power electronics The application of silicon carbide (SiC) semiconductor technology in conjunction with high temperature (HT) operation allows the power density of the DC-DC converters and inverters to be increased Elevated ambient temperatures of above 200degC also affects the gate drives attached to the power semiconductors This paper focuses on the selection of HT components and discusses different gate drive topologies for SiC JFETs with respect to HT operation capability, limitations, dynamic performance and circuit complexity An experimental performance comparison of edge-triggered and phase-difference HT drivers with a conventional room temperature JFET gate driver is given The proposed edge-triggered gate driver offers high switching speeds and a cost effective implementation Switching tests at 200degC approve an excellent performance at high temperature and a low temperature drift of the driver output voltage

42 citations


Cites background from "Reliability of High Temperature Inv..."

  • ...I. INTRODUCTION High temperatures in the propulsion system of Hybrid Electrical Vehicles (HEV) provide a harsh environment for power electronic systems such as DC-DC converters and inverters....

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  • ...In comparison to silicon, SiC has a larger band gap and thus allows higher junction temperature operation, which minimizes heat sink volume or provides the possibility to integrate the power electronics with the engine and the engine coolant of a HEV [2]....

    [...]

References
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Journal ArticleDOI
TL;DR: In this article, the initiation and growth of cracks in the wire bond using finite element analysis was investigated for high voltage and high current power modules, which are key components for traction applications.

81 citations


"Reliability of High Temperature Inv..." refers methods in this paper

  • ...During this test, byswitching the current on andoffthepowersemiconductor the temperature atthep-njunction isvaried [ 8 ,9].The numberofthecycles uptothebondfailure ispresented dependent onthetemperature swing atthep-njunction of thesemiconductor chip....

    [...]

  • ...Fig. 8 .Cracks inbond- (left) andinsolder connection (right)...

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Journal ArticleDOI

50 citations


"Reliability of High Temperature Inv..." refers background in this paper

  • ...Trend of converter power density for different applications [3]...

    [...]

Proceedings ArticleDOI
F. Renken1, R. Knorr1
01 Jan 2005
TL;DR: In this article, the requirements on the electronics and the necessary development for these environmental conditions are described, and the requirements of hybrid drive components for high operating temperature and variable mounting spaces are discussed.
Abstract: Hybrid drives can substantially reduce the fuel consumption and the emissions of a motor vehicle and additionally increase the traveling comfort and the driving dynamics. Key components of these drives are an electrical machine and an inverter, which consists of many electronic elements. The electronics have to be operated at moderate temperatures, in order to use the full potential of a hybrid drive. For this reason today the inverter normally is arranged separately from the electrical machine into a separate housing. Advancements of the electronic elements in the last years make solutions tangible, which can also provide high power with high environmental and coolant temperatures and are able to work reliably over the specified life time of a motor vehicle. Furthermore, electronics for high operating temperature make variable mounting spaces possible, so the modularity of the hybrid components can be increased and the systems can be assembled in a more compact manner. In this document the requirements on the electronics and the necessary development for these environmental conditions are described

18 citations


"Reliability of High Temperature Inv..." refers methods in this paper

  • ...Thereby it is possible to use the transmission of the gearbox for example in the start phase of the combustion engine [4, 5]....

    [...]

Journal ArticleDOI
Norbert Seliger1, Eckhard Prof. Wolfgang1, Guy Lefranc1, H. Berg, Thomas Licht 

17 citations


"Reliability of High Temperature Inv..." refers background in this paper

  • ...Photo of an inverter power part for mild hybrid drive systems [12]...

    [...]

  • ...Multiple-chip substrate of a half bridge [12]...

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  • ...Principle assembly of an inverter power part [12]...

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Journal ArticleDOI
Michael Bielefeld1, Norbert Bieler1
01 Sep 2005
TL;DR: In this paper, the ersten beiden Ausbaustufen dieser Hybrid-Toolbox sind auf dem Hintergrund praktischer Projekterfahrung mit Fahrzeugherstellern bereits realisiert und in Demo-Fahrzeugen umgesetzt.
Abstract: Um die grose Varianz bei Hybrid-Auslegungen moglichst anwendungsorientiert abdecken zu konnen, hat sich die Siemens VDO Automotive AG fur ein System mit einem Baukasten von Modulen fur Hybrid-Konzepte entschieden. Die ersten beiden Ausbaustufen dieser Hybrid-Toolbox sind auf dem Hintergrund praktischer Projekterfahrung mit Fahrzeugherstellern bereits realisiert und in Demo-Fahrzeugen umgesetzt. Der vorliegende Beitrag berichtet uber den aktuellen Stand der Entwicklung und gibt einen Ausblick auf die nachsten Entwicklungsschritte.

7 citations