Journal ArticleDOI
Review of Heat Transfer Technologies in Electronic Equipment
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This article is published in Journal of Electronic Packaging.The article was published on 1995-12-01. It has received 229 citations till now. The article focuses on the topics: Reliability (semiconductor) & Electronics.read more
Citations
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Developments in organic solid–liquid phase change materials and their applications in thermal energy storage
R.K. Sharma,Poo Balan Ganesan,V.V. Tyagi,Hendrik Simon Cornelis Metselaar,Shanti C. Sandaran +4 more
TL;DR: In this paper, a review of organic phase change materials (PCMs) is presented, focusing on three aspects: the materials, encapsulation and applications of organic PCMs, and providing an insight on the recent developments in applications of these materials.
Journal ArticleDOI
A review on the enhancement of figure of merit from bulk to nano-thermoelectric materials
Hilaal Alam,Seeram Ramakrishna +1 more
TL;DR: In this article, a review of thermoelectric concepts and challenges in enhancing the figure of merits is presented, and various approaches adopted in bulk materials, complex structures and the recent nanostructures to circumvent the interdependency of parameters in achieving higher ZT are discussed.
Journal ArticleDOI
Review on thermal management systems using phase change materials for electronic components, Li-ion batteries and photovoltaic modules
Ziye Ling,Zhengguo Zhang,Guoquan Shi,Xiaoming Fang,Lei Wang,Xuenong Gao,Yutang Fang,Tao Xu,Shuangfeng Wang,Xiaohong Liu +9 more
TL;DR: In this paper, a thermal management system based on phase change materials (PCMs) is discussed. But, the performance of the PCM-based thermal management systems for each kind of electronic components, Li-ion batteries and photovoltaic (PV) cells is not discussed.
Journal ArticleDOI
Analysis of three-dimensional heat transfer in micro-channel heat sinks
Weilin Qu,Issam Mudawar +1 more
TL;DR: In this article, the authors analyzed the three-dimensional fluid flow and heat transfer in a rectangular micro-channel heat sink using water as the cooling fluid and developed a numerical code based on the finite difference method and the SIMPLE algorithm to solve the governing equations.
Journal ArticleDOI
Microjet cooling devices for thermal management of electronics
TL;DR: In this article, the applicability of miniaturized synthetic jet (microjet) technology to the area of thermal management of microelectronic devices is discussed along with characterization of excitation elements and the turbulent synthetic jets produced thereby.
References
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Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Measurement of friction factors for the flow of gases in very fine channels used for microminiature Joule-Thomson refrigerators
Wu Peiyi,W.A. Little +1 more
TL;DR: In this article, the friction factors for the flow of gases in the fine channels used for microminiature Joule-Thomson refrigerators have been measured using a photolithographic technique.
Journal ArticleDOI
High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks
Morris B. Bowers,Issam Mudawar +1 more
TL;DR: In this article, an experimental study of pressure drop and CHF in mini-channel (D = 2.54 mm ) and micro-channel heat sinks of 1 cm heated length was performed using R-113.
Journal ArticleDOI
Experimental Investigation on Liquid Forced-Convection Heat-Transfer Through Microchannels
B. X. Wang,Xiaofeng Peng +1 more
TL;DR: In this paper, the authors investigated the single-phase forced-flow convection of water or methanol flowing through microchannels with rectangular cross-section and found that the fully developed turbulent convection regime was initiated at about Re = 1000-1500.
Book
Thermal Analysis and Control of Electronic Equipment
Allan D. Kraus,Avram Bar-Cohen +1 more
TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ