Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
11 Jul 2018-Journal of Electronic Packaging (American Society of Mechanical Engineers)-Vol. 140, Iss: 4, pp 040801
About: This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.
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TL;DR: The multidisciplinary optimization of microchannel layout in a multipass heat sink by topology optimization focuses on manipulating fin geometries of heat sinks in turbulence region, which allows more complex and higher velocity flow and therefore results in better heat sink performance.
11 citations
TL;DR: In this paper , a comprehensive review of double-sided cooled power module technology for automotive power modules is presented and their path into commercial vehicles is evaluated, including technical details and innovative features of state-of-the-art automotive power module from research institutes and major industry manufacturers.
Abstract: Power modules are core components of inverters in electric vehicles and their packaging technology has a critical impact on system performance and reliability. Conventional single sided cooled power modules have been one of the most common package structures for automotive applications. However, this design limits the performance of IGBT and future SiC power module due to parasitic inductance and heat dissipation issues. Power module packaging technologies have been experiencing extensive changes as the performance expectations of the power semiconductor has increased. Over the past few decades, methods of double-sided cooling have attracted increased interest to enhance the power density of the inverter and effectively reduce their cost. This paper presents a comprehensive review of double-sided cooled packaging technology for automotive power modules. Technical details and innovative features of state-of-the-art automotive power modules from research institutes and major industry manufacturers are reviewed and their path into commercial vehicles is evaluated.
11 citations
TL;DR: This study will benchmark state of the art silicon and SiC technologies used in commercial traction inverters for their within-package first-level interconnect methods, module architecture, and integration with cooling structure.
Abstract:
Silicon carbide (SiC) wide bandgap power electronics are being applied in hybrid electric vehicle (HEV) and electrical vehicles (EV). The Department of Energy (DOE) has set target performance goals for 2025 to promote EV and HEV as a means of carbon emission reduction and long-term sustainability. Challenges include higher expectations on power density, performance, efficiency, thermal management, compactness, cost, and reliability. This study will benchmark state of the art silicon and SiC technologies. Power modules used in commercial traction inverters are analyzed for their within-package first-level interconnect methods, module architecture, and integration with cooling structure. A few power module package architectures from both industry-adopted standards and proposed patented technologies are compared in modularity and scalability for integration into inverters. The current trends of power module architectures and their integration into inverter are also discussed. The development of an eco-system to support the wide bandgap semiconductors-based power electronics is highlighted as an ongoing challenge.
11 citations
TL;DR: In this paper, the porosity of cuboid and cylinder scaffolds is investigated and the effective thermal conductivity (keff) for cuboid structures decreases by 50-75 % with the filament separation and shows anisotropic characteristics.
Abstract: The improvement of heat dissipation in electronic and energy devices is a challenge that can be addressed through the use of highly porous materials. Presently, the additive manufacturing of 3D aluminum nitride is described, and different lattice patterns with porosities in the range 45–64 % are achieved by direct ink writing. All the structures are robust and the effective thermal conductivity (keff) for cuboid structures decreases by 50–75 % with the filament separation and shows anisotropic characteristics, since keff along the longitudinal axis of the scaffold is up to six times greater than for the transversal one. Heat transfer during free cooling experiments for cuboid and cylinder scaffolds, after rapid heating at temperatures above 1000 °C, takes place by radiation for temperatures >500 °C and by convection through the complete cooling process. The heat dissipation time constants of both processes decrease almost linearly with the designed scaffold parameters of porosity and rod separation.
10 citations
TL;DR: In this paper , the authors review thermal management strategies for major power electronics components in electric vehicles as well as their failure modes since high temperatures can be detrimental to the performance of power electronics.
Abstract: The design of the thermal management solution has a significant impact on the reliability and power density of power electronics. As the electric vehicle industry moves towards increasing the efficiency and output power, the cooling system must effectively remove the excess heat dissipated in power electronics. The main heat-generating components are the semiconductor switches, but other components, such as bus bars and power capacitors also dissipate heat and require cooling. Currently, indirect, direct, and double-sided cooling methods are the most common in electric vehicles and account for 14-33% of the total volume of traction inverters. However, power electronic packaging sizes are expected to decrease, while the heat dissipation continues to increase, hence advanced cooling technologies are being investigated. This paper aims to review the thermal management strategies for major power electronics components in electric vehicles as well as their failure modes since high temperatures can be detrimental to the performance of power electronics. Cooling designs that are currently implemented in electric vehicles and future cooling trends for the next generation of power electronics are reviewed as well.
10 citations
References
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TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Abstract: The problem of achieving compact, high-performance forced liquid cooling of planar integrated circuits has been investigated. The convective heat-transfer coefficient h between the substrate and the coolant was found to be the primary impediment to achieving low thermal resistance. For laminar flow in confined channels, h scales inversely with channel width, making microscopic channels desirable. The coolant viscosity determines the minimum practical channel width. The use of high-aspect ratio channels to increase surface area will, to an extent, further reduce thermal resistance. Based on these considerations, a new, very compact, water-cooled integral heat sink for silicon integrated circuits has been designed and tested. At a power density of 790 W/cm2, a maximum substrate temperature rise of 71°C above the input water temperature was measured, in good agreement with theory. By allowing such high power densities, the heat sink may greatly enhance the feasibility of ultrahigh-speed VLSI circuits.
4,214 citations
TL;DR: In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Abstract: Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.
1,648 citations
TL;DR: In this article, the performance of a few graphene layer n ∼ 4, with a thickness of ∼ 2 nm, was investigated for epoxy composites and it was shown that the G4 GNPs provide a thermal conductivity enhancement of more than 3000% (loading of ∼25 vol %).
Abstract: Natural graphite was intercalated, thermally exfoliated, and dispersed in acetone to prepare graphite nanoplatelets (GNPs, Gn) of controlled aspect ratio. Thermal conductivity measurements indicate that few graphene layer Gn, where n ∼ 4, with a thickness of ∼2 nm function as a very efficient filler for epoxy composites. When embedded in an epoxy matrix, the G4 GNPs provide a thermal conductivity enhancement of more than 3000% (loading of ∼25 vol %), and a thermal conductivity κ = 6.44 W/mK, which surpasses the performance of conventional fillers that require a loading of ∼70 vol % to achieve these values. We attribute the outstanding thermal properties of this material to a favorable combination of the high aspect ratio, two-dimensional geometry, stiffness, and low thermal interface resistance of the GNPs.
981 citations
TL;DR: In this article, the effects of the channel size on the flow patterns and heat transfer and pressure drop performance are reviewed in small hydraulic diameter channels, and the fundamental questions related to the presence of nucleate boiling and characteristics of flow boiling in microchannels and minichannels in comparison to that in the conventional channel sizes (3 mm and above) are addressed.
840 citations
TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.
Abstract: This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.
824 citations