Journal ArticleDOI
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
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This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.read more
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Journal ArticleDOI
Thermal Management of Electrified Vehicles—A Review
TL;DR: In this paper , the authors provide an organic review of the current aspects of thermal management from a system engineering perspective, starting from the definition of the requirements and targets of the thermal management system, each vehicle subsystem is analyzed and related to the whole system.
Journal ArticleDOI
Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation
Ales Chvala,Robert Szobolovszký,Jaroslav Kováč,M. Florovic,Juraj Marek,Ľuboš Černaj,Daniel Donoval,Christian Dua,Sylvain Delage,Jean-Claude Jacquet +9 more
TL;DR: In this article, several methods suitable for real time on-chip temperature measurements of power AlGaN/GaN-based high-electron mobility transistor (HEMT) grown on a SiC substrate are presented.
Journal ArticleDOI
Thermal Management of High-Power Switching Transistors Using Thick CVD-Grown Graphene Nanomaterial
TL;DR: In this article, a new type of chemical vapor deposition (CVD)-grown thick graphene network with in-plane thermal conductivity of 1100 W/mK on ceramic substrates for thermal management of power switching devices was demonstrated on a 10-Ω resistor module and a 1.2kV SiC mosfet package module.
Proceedings ArticleDOI
Overview of Current Thermal Management of Automotive Power Electronics for Traction Purposes and Future Directions
TL;DR: In this paper , the authors review the thermal management strategies for major PE components in EVs as well as their failure modes since high temperatures can be detrimental to the performance of PEs and present the cooling designs that are currently implemented in EVs and future cooling trends for the next generation PEs.
Journal ArticleDOI
Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger
Omri Tayyara,Carlos Da Silva,Miad Nasr,Amir Assadi,Kshitij Gupta,Olivier Trescases,Cristina H. Amon +6 more
TL;DR: In this paper, the authors investigate the interplay between the cooling architecture and the printed circuit board (PCB) layout, and the corresponding impact on the heat dissipation and parasitic inductance.
References
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High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
A Survey of Wide Bandgap Power Semiconductor Devices
TL;DR: In this article, a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation is presented.
Journal ArticleDOI
Graphite Nanoplatelet−Epoxy Composite Thermal Interface Materials
TL;DR: In this article, the performance of a few graphene layer n ∼ 4, with a thickness of ∼ 2 nm, was investigated for epoxy composites and it was shown that the G4 GNPs provide a thermal conductivity enhancement of more than 3000% (loading of ∼25 vol %).
Journal ArticleDOI
Fundamental issues related to flow boiling in minichannels and microchannels
TL;DR: In this article, the effects of the channel size on the flow patterns and heat transfer and pressure drop performance are reviewed in small hydraulic diameter channels, and the fundamental questions related to the presence of nucleate boiling and characteristics of flow boiling in microchannels and minichannels in comparison to that in the conventional channel sizes (3 mm and above) are addressed.
Journal ArticleDOI
Assessment of high-heat-flux thermal management schemes
TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.