Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
11 Jul 2018-Journal of Electronic Packaging (American Society of Mechanical Engineers)-Vol. 140, Iss: 4, pp 040801
About: This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.
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01 Nov 2019
TL;DR: In this paper, a high power UV Chip on Board (COB) based LED module was simulated using ABAQUS software and the Heat Transfer Module to check how much thermal conductivity reduce caused by nanosilver sinter die attach process.
Abstract: The industrial market has been growing for high-power ultraviolet (UV) LEDs in curing, water purifying, and other applications that required high light output. As a rule of thumb, LED lumen output usually drops 0.3–0.5% for each 1°C increase in temperature while operating within the typical working temperature range. Such requirements for high-power UV LED modules indicate that innovative materials and processes for module packaging are needed to reduce thermal conductivity and to ensure high reliability.In this work, UVA (wavelengths between 365–405nm) LEDs were chosen, since the increasing usage in curing equipment for drying paints, adhesives, and other curable materials. In order to reduce the thermal conductivity of UVA LED packages, a high power UV Chip on Board (COB) based LED module was simulated. Compared with traditional modules using silver-filled adhesive and metal-core printed circuit boards(MCPCB) substrate, the novel high power UV COB based module was using nano-silver material for die attach process. Such silver sintering method is emerging for high power electronics applications. Such substrate is then sintered on copper heatsink which is covered by a thin layer of graphene, for better thermal management. Such novel structure was investigated using ABAQUS software and the Heat Transfer Module. The simulation is intended to first check how much thermal conductivity reduce caused by nanosilver sinter die attach process. Secondly, the simulation will also investigate the graphene influence on the copper heatsink. Results from the simulation will show the typical structural function of a 200W LED module with reduced thermal resistance up to 7%. The module temperature with edge-to-center temperature difference will also be checked as a standard to compare the heat dissipation capacity. Besides, the simulation will provide temperatures in various parts of the LED module in steady-state conditions, as an indication for reliability.
6 citations
15 Mar 2020
TL;DR: In this paper, thermally annealed pyrolytic graphite (TPG) is analyzed and compared with conventional materials used in power modules for thermal management Fundamental properties of TPG are explained and compared compared with commonly used materials in power module heat spreaders and substrates.
Abstract: Next generation power modules demand increased heat extraction capability along with reduced weight and volume In this paper, thermally annealed pyrolytic graphite (TPG) is analyzed and compared with conventional materials used in power modules for thermal management Fundamental properties of TPG are explained and compared with commonly used materials in power module heat spreaders and substrates The encapsulated TPG based heat spreader is manufactured and compared with bulk copper in simulation and experimental based analysis The results show that encapsulated TPG based heat spreader achieves more than 50% reduction in thermal resistance along with 48% reduction in weight in the heat spreader layer
4 citations
Cites background from "Review of Thermal Packaging Technol..."
...of next generation power electronic systems, especially in application domains such as electric vehicles and more electric aircrafts [4]....
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TL;DR: In this article, the performance of planar planar copper-sinter paste interconnects in a power module was evaluated using finite element analysis, and it was shown that the full area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages.
Abstract: Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages.
4 citations
01 Jun 2021
TL;DR: Copper-graphene foams are explored as a new class of porous, high-performance materials for advanced thermal management in high power applications as discussed by the authors, which can provide a possible route for material-driven innovation and development in packaging with improved properties addressing industry needs.
Abstract: Copper-graphene foams are explored as a new class of porous, high-performance materials for advanced thermal management in high power applications. Due to the continuous demand for enhanced performance and miniaturization in power electronics, such as for automotive drive inverters, this trend has led to high-power densification and package designs with increasing thermal densities - unavoidable increases in operating temperatures and consequent drops in device and system level reliability. Furthermore, the emergence of advanced high-frequency wide-bandgap devices and their fast adoption in power electronics is further aggravating this trend, with larger amounts of heat generated in smaller localized areas. Thermal management has become a critical challenge, such that it is often the limiting factor in system performance and reliability. Towards addressing this bottleneck, a number of advanced package-integrated cooling solutions including vapor chambers for heat spreading and micro-cooling chips for near-junction heat removal have been proposed and demonstrated. To further miniaturize these thermal structures and extend their application to higher thermal densities in packages, more performance improvements are necessary, achieved through innovations in materials such as the use of open-cell conductive foams. Copper foams with different cell sizes and compression levels were evaluated and characterized for the impact of different microstructures. They were coated with graphene by chemical vapor deposition, showing significant improvements in thermal properties. Copper-graphene foams can provide a possible route for material-driven innovation and development in packaging with improved properties addressing industry needs.
4 citations
01 Sep 2019
TL;DR: In this paper, the influence of the previous pulses is removed from all short pulses and averaging is possible without reaching thermal equilibrium, where several short deterministic pulses are applied to the semiconductor before standard TTA.
Abstract: Transient thermal analysis (TTA) with the measurement of the single pulse thermal impedance (Z th (t)) is a standard method to verify the thermal integrity of power semiconductors modules. For best evaluation of measured data, the signal to noise ratio (SNR) should be as high as possible. Especially in the early time domain, it is difficult to achieve high SNR because of the required high bandwidth. Most common way to increase SNR is averaging over several TTA measurement repetitions. Since the semiconductor module therefore has to reach thermal equilibrium, this solution is very time consuming. This paper introduces a new averaging algorithm for TTA, wherein several short deterministic pulses are applied to the semiconductor before standard TTA. Over superposition, the influence of the previous pulses is removed from all short pulses and averaging is possible without reaching thermal equilibrium. Result is a standard single pulse Z th (t) and not a duty cycle form of it. The algorithm is tested by simulations and experimentally using automotive LEDs to verify feasibility and demonstrate benefit. Thereby a SNR increase equivalent to 33 repetitions in standard TTA was reached.
4 citations
Cites background from "Review of Thermal Packaging Technol..."
...Through the increasing power density due to miniaturization and the new wide band technologies the importance of this failures will increase in the next years [2]....
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References
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TL;DR: In this article, the performance of a few graphene layer n ∼ 4, with a thickness of ∼ 2 nm, was investigated for epoxy composites and it was shown that the G4 GNPs provide a thermal conductivity enhancement of more than 3000% (loading of ∼25 vol %).
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TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.
Abstract: This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.
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