Journal ArticleDOI
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
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This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.read more
Citations
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Journal ArticleDOI
Automotive Traction Inverters: Current Status and Future Trends
TL;DR: An independent review of the state-of-the-art traction inverter designs from several production vehicles across multiple manufacturers is presented, highlighting wide bandgap devices and trends in device packaging.
Journal ArticleDOI
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
TL;DR: The standard power module structure is reviewed, the reasons why novel packaging technologies should be developed are described, and the packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail.
Journal ArticleDOI
Electric Drive Technology Trends, Challenges, and Opportunities for Future Electric Vehicles
Iqbal Husain,Burak Ozpineci,Sariful Islam,Emre Gurpinar,Gui-Jia Su,Wensong Yu,Shajjad Chowdhury,Lincoln Xue,Dhrubo Rahman,Raj Sahu +9 more
TL;DR: The electric drive technology trends for passenger electric and hybrid EVs with commercially available solutions in terms of materials, electric machine and inverter designs, maximum speed, component cooling, power density, and performance are discussed.
Journal ArticleDOI
Automotive Power Module Packaging: Current Status and Future Trends
TL;DR: This paper presents a comprehensive review of the automotive power module packaging technologies and concludes that a preferable overall performance could be achieved by combining multiple technologies.
Journal ArticleDOI
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review
TL;DR: The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology, as well as MEMS devices.
References
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Journal ArticleDOI
Spray Cooling of High Aspect Ratio Open Microchannels
TL;DR: In this article, spray cooling of high-aspect-ratio open microchannels was explored, which substantially increases the total surface area and allows more residence time for the incoming liquid to be heated by the wall.
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Effects of Extreme Temperature Swings ( $-\hbox{55}\ ^{\circ}\hbox{C}$ to 250 $^{\circ}\hbox{C}$ ) on Silicon Nitride Active Metal Brazing Substrates
TL;DR: In this paper, the effects of extreme temperature swings on silicon nitride active metal brazing (AMB) substrates were investigated to evaluate their applicability to harsh environment, and their high resistance to the peeling off of copper layers was confirmed.
Journal ArticleDOI
Trends in automotive power semiconductor packaging
TL;DR: An overview of the current available technologies is given and Fuji’s new package solution ideas are presented to make use of a junction temperature above 200°C possible while reliability and cost performance have increased.
Assessment of Thermal Control Technologies for Cooling Electric Vehicle Power Electronics
TL;DR: NREL is assessing thermal control technologies to improve the thermal performance of power electronics devices for electric vehicles, while reducing the cost, weight, and volume of the system as discussed by the authors, which is the most relevant work to ours.
Proceedings ArticleDOI
Direct-immersion cooling for high power electronic chips
TL;DR: In this article, the suitability of various direct-immersion cooling techniques for dissipating high heat fluxes from isolated chips and multichip modules is assessed with respect to such considerations as chip junction temperature, cooling uniformity, and critical heat flux (CHF).