Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
11 Jul 2018-Journal of Electronic Packaging (American Society of Mechanical Engineers)-Vol. 140, Iss: 4, pp 040801
About: This article is published in Journal of Electronic Packaging.The article was published on 2018-07-11. It has received 74 citations till now. The article focuses on the topics: Traction (orthopedics) & Power electronics.
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TL;DR: An independent review of the state-of-the-art traction inverter designs from several production vehicles across multiple manufacturers is presented, highlighting wide bandgap devices and trends in device packaging.
Abstract: Traction inverters are crucial components of modern electrified automotive powertrains. Advances in power electronics have enabled lower cost inverters with high reliability, efficiency, and power density, suitable for mass market consumer automotive applications. This paper presents an independent review of the state-of-the-art traction inverter designs from several production vehicles across multiple manufacturers. Future trends in inverter design are identified based on industry examples and academic research. Wide bandgap devices and trends in device packaging are discussed along with active gate driver implementations, current and future trends in system integration, and advanced manufacturing techniques.
173 citations
Cites background from "Review of Thermal Packaging Technol..."
...Jet impingement and spray cooling have also received significant research attention [100], along with microchannel heatsinks and heatpipes....
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TL;DR: The standard power module structure is reviewed, the reasons why novel packaging technologies should be developed are described, and the packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail.
Abstract: Power module packaging technologies have been experiencing extensive changes as the novel silicon carbide (SiC) power devices with superior performance become commercially available. This article presents an overview of power module packaging technologies in this transition, with an emphasis on the challenges that current standard packaging face, requirements that future power module packaging needs to fulfill, and recent advances on packaging technologies. The standard power module structure, which is a widely used current practice to package SiC devices, is reviewed, and the reasons why novel packaging technologies should be developed are described in this article. The packaging challenges associated with high-speed switching, thermal management, high-temperature operation, and high-voltage isolation are explained in detail. Recent advances on technologies, which try to address the limitations of standard packaging, both in packaging elements and package structure are summarized. The trend toward novel soft-switching power converters gave rise to problems regarding package designs of unconventional module configuration. Potential applications areas, such as aerospace applications, introduce low-temperature challenges to SiC packaging. Key issues in these emerging areas are highlighted.
168 citations
Cites background from "Review of Thermal Packaging Technol..."
...4) Advanced cooling approaches, such as jet impingement, spray, and microchannels [31], need to be incorporated to enhance the heat removal capability....
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08 Jan 2021
TL;DR: The electric drive technology trends for passenger electric and hybrid EVs with commercially available solutions in terms of materials, electric machine and inverter designs, maximum speed, component cooling, power density, and performance are discussed.
Abstract: The transition to electric road transport technologies requires electric traction drive systems to offer improved performances and capabilities, such as fuel efficiency (in terms of MPGe, i.e., miles per gallon of gasoline-equivalent), extended range, and fast-charging options. The enhanced electrification and transformed mobility are translating to a demand for higher power and more efficient electric traction drive systems that lead to better fuel economy for a given battery charge. To accelerate the mass-market adoption of electrified transportation, the U.S. Department of Energy (DOE), in collaboration with the automotive industry, has announced the technical targets for light-duty electric vehicles (EVs) for 2025. This article discusses the electric drive technology trends for passenger electric and hybrid EVs with commercially available solutions in terms of materials, electric machine and inverter designs, maximum speed, component cooling, power density, and performance. The emerging materials and technologies for power electronics and electric motors are presented, identifying the challenges and opportunities for even more aggressive designs to meet the need for next-generation EVs. Some innovative drive and motor designs with the potential to meet the DOE 2025 targets are also discussed.
164 citations
Cites background from "Review of Thermal Packaging Technol..."
...The commercial SiC dies are rated up to 175 ◦C to eliminate reliability issues observed at the gate interface and body diode at elevated temperatures [23]....
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TL;DR: This paper presents a comprehensive review of the automotive power module packaging technologies and concludes that a preferable overall performance could be achieved by combining multiple technologies.
Abstract: Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies.
62 citations
Cites background from "Review of Thermal Packaging Technol..."
...In terms of automotive applications, [5], [16], [17] introduced a few renowned power...
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...the passivation layer to further insulate different conduction zones within the module, and more importantly, protect the module from the environment [16]....
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TL;DR: The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology, as well as MEMS devices.
Abstract: The significant advance of power electronics in today's market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the high junction temperature, low power losses, and excellent thermal stability, and thus are attractive to converters and MEMS devices applied in a high-temperature environment. This paper conducts an overview of high-temperature power electronics, with a focus on high-temperature converters and MEMS devices. The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology. Then, the research and development directions of SiC-based high-temperature converters in the fields of motor drives, rectifier units, DC-DC converters are discussed, as well as MEMS devices. Finally, the existing technical challenges facing high-temperature power electronics are identified, including gate drives, current measurement, parameters matching between each component, and packaging technology.
53 citations
References
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TL;DR: The current state of wide bandgap device technology is reviewed and its impact on power electronic system miniaturization for a wide variety of voltage levels is described in this article, followed by an outline of the applications that stand to be impacted.
Abstract: The current state of wide bandgap device technology is reviewed and its impact on power electronic system miniaturization for a wide variety of voltage levels is described. A synopsis of recent complementary technological developments in passives, integrated driver, and protection circuitry and electronic packaging are described, followed by an outline of the applications that stand to be impacted. A glimpse into the future based on the current technological trends is offered.
192 citations
TL;DR: In this paper, the authors describe recent efforts in development and characterization of nanostructured thermal interface materials (TIMs) and identify possible future research directions, as well as some possible future directions for using these materials as TIMs.
168 citations
28 May 2008
TL;DR: In this article, the thermal performance of thermal interface materials and phase change materials and thermoplastics was investigated in the context of automotive power electronics cooling, and the results indicated that the thermal resistance of the TIM layer has a dramatic effect on the maximum temperature in the IGBT package.
Abstract: In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat sink. This grease layer has the highest thermal resistance of any layer in the package. Reducing the thermal resistance of this thermal interface material (TIM) can help achieve the FreedomCAR program goals of using a glycol water mixture at 105degC or even air cooling. It is desirable to keep the maximum temperature of the conventional silicon die below 125degC, trench insulated gate bipolar transistors (IGBTs) below 150degC, and silicon carbide-based devices below 200degC. Using improved thermal interface materials enables the realization of these goals and the dissipation of high heat fluxes. The ability to dissipate high heat fluxes in turn enables a reduction in die size, cost, weight, and volume. This paper describes our progress in characterizing the thermal performance of some conventional and novel thermal interface materials. We acquired, modified, and improved an apparatus based on the ASTM D5470 test method and measured the thermal resistance of various conventional greases. We also measured the performance of select phase-change materials and thermoplastics through the ASTM steady-state and the transient laser flash approaches, and compared the two methodologies. These experimental results for thermal resistance are cast in the context of automotive power electronics cooling. Results from numerical finite element modeling indicate that the thermal resistance of the TIM layer has a dramatic effect on the maximum temperature in the IGBT package.
163 citations
TL;DR: In this article, a periodic unit cell with a random close-packed structure was created using a packing algorithm that treated the micro filler as spheres and analyzed the effect of microstructure of micro fillers.
Abstract: Thermal conductivity of polymer composites with nano and micro fillers has been investigated numerically and experimentally. The nano fillers used were multi-walled carbon nanotubes (MWNTs) and alumina nanoparticles, and the spherical alumina particles were selected as the micro fillers. A periodic unit cell with a random close-packed structure was created using a packing algorithm that treat the micro filler as spheres. Finite element analyses were also performed to predict the potential of nano fillers to enhance thermal conductivity of the composites and to analyze the effect of microstructure of micro fillers. Additionally, the polymer composites with nano and micro fillers were made and the thermal conductivity of the composites were measured. The results showed that the addition of MWNTs to the matrix lead to a large increase in thermal conductivity of the composites. The proposed thermal model predicted a thermal conductivity in good agreement with experiment.
160 citations
TL;DR: The failure modes of power electronics devices especially IGBTs are reviewed and a FEM analysis of a multilayered IGBT packaging module under cyclic thermal loading is presented.
139 citations