Proceedings ArticleDOI
Robust optimization of serial link system for signal integrity and power integrity
Jai Narayan Tripathi,Raj Kumar Nagpal,Rakesh Malik +2 more
- pp 1-8
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TLDR
System level model has been created for USB HSLINK taking into account the external parameters like board, package, measurement environment which influence the performance of the channel.Abstract:
Signal Integrity (SI) and Power Integrity (PI) are the most critical issues for higher operational speeds in semiconductor industry. This work identifies and optimizes the parameters of board, package and termination environment, influencing the signal integrity and power integrity of serial link. System level model has been created for USB HSLINK taking into account the external parameters like board, package, measurement environment which influence the performance of the channel. Parameters variations appearing from manufactura-bility constraints, material property constraints, design tolerance etc affecting the serial link performance has been optimized using Taguchi method based on statistical co-analysis. Using the Taguchi statistical techniques, sensitivity analysis on parameter variations affecting HSLINK performance is analyzed and optimized for desired performance.read more
Citations
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Statistics : based on Schaum's outline of theory and problems of statistics
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Maintaining Power Integrity by damping the cavity-mode anti-resonances' peaks on a power plane by Particle Swarm Optimization
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Robust Optimization and Reflection Gain Enhancement of Serial Link System for Signal Integrity and Power Integrity
TL;DR: A model is developed to optimize the performance of high speed serial link in terms of jitter and amplitude performance and Taguchi array optimization has been applied during the optimization process.
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Data transfer via a data and power connection
TL;DR: In this paper, a method of data transfer via a data and power connection includes determining whether a data transmission error is detected via the data and Power Connection (PC) is detected.
References
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Proceedings ArticleDOI
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