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Journal ArticleDOI

Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors

25 Nov 2004-Nature (Nature Publishing Group)-Vol. 432, Iss: 7016, pp 488-492
TL;DR: A novel semiconducting material is proposed—namely, a transparent amorphous oxide semiconductor from the In-Ga-Zn-O system (a-IGZO)—for the active channel in transparent thin-film transistors (TTFTs), which are fabricated on polyethylene terephthalate sheets and exhibit saturation mobilities and device characteristics are stable during repetitive bending of the TTFT sheet.
Abstract: Transparent electronic devices formed on flexible substrates are expected to meet emerging technological demands where silicon-based electronics cannot provide a solution. Examples of active flexible applications include paper displays and wearable computers1. So far, mainly flexible devices based on hydrogenated amorphous silicon (a-Si:H)2,3,4,5 and organic semiconductors2,6,7,8,9,10 have been investigated. However, the performance of these devices has been insufficient for use as transistors in practical computers and current-driven organic light-emitting diode displays. Fabricating high-performance devices is challenging, owing to a trade-off between processing temperature and device performance. Here, we propose to solve this problem by using a novel semiconducting material—namely, a transparent amorphous oxide semiconductor from the In-Ga-Zn-O system (a-IGZO)—for the active channel in transparent thin-film transistors (TTFTs). The a-IGZO is deposited on polyethylene terephthalate at room temperature and exhibits Hall effect mobilities exceeding 10 cm2 V-1 s-1, which is an order of magnitude larger than for hydrogenated amorphous silicon. TTFTs fabricated on polyethylene terephthalate sheets exhibit saturation mobilities of 6–9 cm2 V-1 s-1, and device characteristics are stable during repetitive bending of the TTFT sheet.
Citations
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Journal ArticleDOI
TL;DR: In this article, the status of zinc oxide as a semiconductor is discussed and the role of impurities and defects in the electrical conductivity of ZnO is discussed, as well as the possible causes of unintentional n-type conductivity.
Abstract: In the past ten years we have witnessed a revival of, and subsequent rapid expansion in, the research on zinc oxide (ZnO) as a semiconductor. Being initially considered as a substrate for GaN and related alloys, the availability of high-quality large bulk single crystals, the strong luminescence demonstrated in optically pumped lasers and the prospects of gaining control over its electrical conductivity have led a large number of groups to turn their research for electronic and photonic devices to ZnO in its own right. The high electron mobility, high thermal conductivity, wide and direct band gap and large exciton binding energy make ZnO suitable for a wide range of devices, including transparent thin-film transistors, photodetectors, light-emitting diodes and laser diodes that operate in the blue and ultraviolet region of the spectrum. In spite of the recent rapid developments, controlling the electrical conductivity of ZnO has remained a major challenge. While a number of research groups have reported achieving p-type ZnO, there are still problems concerning the reproducibility of the results and the stability of the p-type conductivity. Even the cause of the commonly observed unintentional n-type conductivity in as-grown ZnO is still under debate. One approach to address these issues consists of growing high-quality single crystalline bulk and thin films in which the concentrations of impurities and intrinsic defects are controlled. In this review we discuss the status of ZnO as a semiconductor. We first discuss the growth of bulk and epitaxial films, growth conditions and their influence on the incorporation of native defects and impurities. We then present the theory of doping and native defects in ZnO based on density-functional calculations, discussing the stability and electronic structure of native point defects and impurities and their influence on the electrical conductivity and optical properties of ZnO. We pay special attention to the possible causes of the unintentional n-type conductivity, emphasize the role of impurities, critically review the current status of p-type doping and address possible routes to controlling the electrical conductivity in ZnO. Finally, we discuss band-gap engineering using MgZnO and CdZnO alloys.

3,291 citations

Journal ArticleDOI
TL;DR: A review of electronic devices based on two-dimensional materials, outlining their potential as a technological option beyond scaled complementary metal-oxide-semiconductor switches and the performance limits and advantages, when exploited for both digital and analog applications.
Abstract: The compelling demand for higher performance and lower power consumption in electronic systems is the main driving force of the electronics industry's quest for devices and/or architectures based on new materials. Here, we provide a review of electronic devices based on two-dimensional materials, outlining their potential as a technological option beyond scaled complementary metal-oxide-semiconductor switches. We focus on the performance limits and advantages of these materials and associated technologies, when exploited for both digital and analog applications, focusing on the main figures of merit needed to meet industry requirements. We also discuss the use of two-dimensional materials as an enabling factor for flexible electronics and provide our perspectives on future developments.

2,531 citations

Journal ArticleDOI
TL;DR: The recent progress in n- and p-type oxide based thin-film transistors (TFT) is reviewed, with special emphasis on solution-processed andp-type, and the major milestones already achieved with this emerging and very promising technology are summarizeed.
Abstract: Transparent electronics is today one of the most advanced topics for a wide range of device applications. The key components are wide bandgap semiconductors, where oxides of different origins play an important role, not only as passive component but also as active component, similar to what is observed in conventional semiconductors like silicon. Transparent electronics has gained special attention during the last few years and is today established as one of the most promising technologies for leading the next generation of flat panel display due to its excellent electronic performance. In this paper the recent progress in n- and p-type oxide based thin-film transistors (TFT) is reviewed, with special emphasis on solution-processed and p-type, and the major milestones already achieved with this emerging and very promising technology are summarizeed. After a short introduction where the main advantages of these semiconductors are presented, as well as the industry expectations, the beautiful history of TFTs is revisited, including the main landmarks in the last 80 years, finishing by referring to some papers that have played an important role in shaping transparent electronics. Then, an overview is presented of state of the art n-type TFTs processed by physical vapour deposition methods, and finally one of the most exciting, promising, and low cost but powerful technologies is discussed: solution-processed oxide TFTs. Moreover, a more detailed focus analysis will be given concerning p-type oxide TFTs, mainly centred on two of the most promising semiconductor candidates: copper oxide and tin oxide. The most recent data related to the production of complementary metal oxide semiconductor (CMOS) devices based on n- and p-type oxide TFT is also be presented. The last topic of this review is devoted to some emerging applications, finalizing with the main conclusions. Related work that originated at CENIMAT|I3N during the last six years is included in more detail, which has led to the fabrication of high performance n- and p-type oxide transistors as well as the fabrication of CMOS devices with and on paper.

2,440 citations

Journal ArticleDOI
31 Jan 2014-ACS Nano
TL;DR: By critically assessing and comparing the performance of these devices with competing technologies, the merits and shortcomings of this emerging class of electronic materials are identified, thereby providing a roadmap for future development.
Abstract: With advances in exfoliation and synthetic techniques, atomically thin films of semiconducting transition metal dichalcogenides have recently been isolated and characterized. Their two-dimensional structure, coupled with a direct band gap in the visible portion of the electromagnetic spectrum, suggests suitability for digital electronics and optoelectronics. Toward that end, several classes of high-performance devices have been reported along with significant progress in understanding their physical properties. Here, we present a review of the architecture, operating principles, and physics of electronic and optoelectronic devices based on ultrathin transition metal dichalcogenide semiconductors. By critically assessing and comparing the performance of these devices with competing technologies, the merits and shortcomings of this emerging class of electronic materials are identified, thereby providing a roadmap for future development.

2,219 citations

Journal ArticleDOI
TL;DR: In this article, the authors compared carbon nanotube, metal nanowire networks, and regular metal grids with the usual transparent conductive oxides for optically transparent electrode applications.
Abstract: Increasing demand for raw materials means that alternatives to indium-tin oxide are desired for optically transparent electrode applications. Carbon nanotube, metal nanowire networks and regular metal grids have been investigated as possible options. In this review, these materials and recently rediscovered graphene are compared with the usual transparent conductive oxides.

1,697 citations

References
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Journal ArticleDOI
01 Oct 1997-Nature
TL;DR: In this article, an invisible thin-film p-type conductor with a conductivity approaching that needed for real applications has been presented, but only now is there an invisible n-type conductor that can be used in real applications.
Abstract: Imagine the applications that invisible electronic circuits, including active components such as diodes and transistors, might have To make them, we need invisible conductors of two types _ some in which the charge carriers are electrons (n-type), and others in which they are holes (p-type) Invisible n-type conductors have been relatively easy to make, but only now is there an invisible thin-film p-type conductor with a conductivity approaching that needed for real applications

305 citations

Journal ArticleDOI
TL;DR: The nonlinear vibrational properties of a periodic micromechanical oscillator array have been measured and a driver-induced locking effect is observed to eternalize some of these intrinsic localized modes so that their amplitudes become fixed and the modes become spatially pinned.
Abstract: The nonlinear vibrational properties of a periodic micromechanical oscillator array have been measured. For sufficiently large amplitude of the driver, the optic mode of the di-element cantilever array becomes unstable and breaks up into excitations ranging over only a few cells. A driver-induced locking effect is observed to eternalize some of these intrinsic localized modes so that their amplitudes become fixed and the modes become spatially pinned.

303 citations

Journal ArticleDOI
TL;DR: In this paper, the growth and properties of both epitaxial and amorphous films of Gd2O3 (κ=14) and Y2O 3 (κ = 18) as the alternative gate dielectrics for Si were presented.
Abstract: We present the materials growth and properties of both epitaxial and amorphous films of Gd2O3 (κ=14) and Y2O3 (κ=18) as the alternative gate dielectrics for Si. The rare earth oxide films were prepared by ultrahigh vacuum vapor deposition from an oxide source. The use of vicinal Si (100) substrates is key to the growth of (110) oriented, single domain films in the Mn2O3 structure. Compared to SiO2 gate oxide, the crystalline Gd2O3 and Y2O3 oxide films show a reduction of electrical leakage at 1 V by four orders of magnitude over an equivalent oxide thickness range of 10–20 A. The leakage of amorphous Y2O3 films is about six orders of magnitude better than SiO2 due to a smooth morphology and abrupt interface with Si. The absence of SiO2 segregation at the dielectric/Si interface is established from infrared absorption spectroscopy and scanning transmission electron microscopy. The amorphous Gd2O3 and Y2O3 films withstand the high temperature anneals to 850 °C and remain electrically and chemically intact.

302 citations


"Room-temperature fabrication of tra..." refers result in this paper

  • ...The measured dielectric constant of the Y 2 O 3 gate insulator was ∼16 e 0 (where e 0 is the dielectric constant of vacuum), which is close to that reported for crystalline Y 2 O 3 (∼ 18 e 0...

    [...]

Journal ArticleDOI
J. M. Shaw1, Paul Seidler1
TL;DR: The increased resolution capability of photoresists combined with optical tool enhancements has enabled the fabrication of 1.2 million transistors/cm with feature sizes of 180 nm, significantly smaller than the 248-nm exposure wavelength of the current optical exposure tool—an achievement that was not considered possible a few years ago.
Abstract: For the past forty years inorganic silicon and gallium arsenide semiconductors, silicon dioxide insulators, and metals such as aluminum and copper have been the backbone of the semiconductor industry. However, there has been a growing research effort in “organic electronics” to improve the semiconducting, conducting, and lightemitting properties of organics (polymers, oligomers) and hybrids (organic–inorganic composites) through novel synthesis and self-assembly techniques. Performance improvements, coupled with the ability to process these “active” materials at low temperatures over large areas on materials such as plastic or paper, may provide unique technologies and generate new applications and form factors to address the growing needs for pervasive computing and enhanced connectivity. If we review the growth of the electronics industry, it is clear that innovative organic materials have been essential to the unparalleled performance increase in semiconductors, storage, and displays at the consistently lower costs that we see today. However, the majority of these organic materials are either used as sacrificial stencils (photoresists) or passive insulators and take no active role in the electronic functioning of a device. They do not conduct current to act as switches or wires, and they do not emit light. For semiconductors, two major classes of passive organic materials have made possible the current cost/performance ratio of logic chips: photoresists and insulators. Photoresists are the key materials that define chip circuitry and enable the constant shrinking of device dimensions [1–3]. In the late 1960s, photoresist materials limited the obtainable resolution of the optical tools to ;5.0 mm (;500 transistors/cm). As optical tools continued to improve, owing to unique lens design and light sources, new resists had to be developed to continue lithographic scaling. Chemists created unique photosensitive polymers to satisfy the resolution, sensitivity, and processing needs of each successive chip generation, and now photoresist materials improve the resolution that could normally be provided on an optical exposure tool. The increased resolution capability of photoresists combined with optical tool enhancements has enabled the fabrication of 1.2 million transistors/cm with feature sizes of 180 nm, significantly smaller than the 248-nm exposure wavelength of the current optical exposure tool—an achievement that was not considered possible a few years ago. Polymeric insulators have also been essential to the performance and reliability of semiconductor devices. They were first used in the packaging of semiconductor chips, where low-cost epoxy materials found applications as insulation for wiring in the fabrication of printed wiring boards and as encapsulants to provide support/protection and hence reliability for the chips [4, 5]. Although the first polymeric dielectrics were used in the packaging of chips, IBM recently introduced a polymer that replaces the silicon dioxide dielectric typically used on-chip throughout the industry as an insulator. The seven levels of metal wiring required to connect the millions of transistors on a chip can significantly affect chip performance because of signal propagation delay and crosstalk between wiring. Improvement in interconnect performance requires reduction of the resistance (R) and capacitance (C). IBM was the first to use copper to replace aluminum wiring as a low-resistivity metal, and the first to use a low-k

286 citations

Journal ArticleDOI
TL;DR: In this paper, the experimental observation of intrinsic dynamically localized vibrational states in crystals of the highly nonlinear halide-bridged mixed-valence transition metal complex was reported, where these states are identified by the distinctive structure and strong redshifts they impose upon the overtone resonance Raman spectra.
Abstract: We report the experimental observation of intrinsic dynamically localized vibrational states in crystals of the highly nonlinear halide-bridged mixed-valence transition metal complex ${[\mathrm{Pt}(\mathrm{en}{)}_{2}][\mathrm{Pt}(\mathrm{en}{)}_{2}{\mathrm{Cl}}_{2}]({\mathrm{ClO}}_{4}{)}_{4}}$, where $\mathrm{en}\phantom{\rule{0ex}{0ex}}=\phantom{\rule{0ex}{0ex}}\mathrm{ethylenediamine}$. These states are identified by the distinctive structure and strong redshifts they impose upon the overtone resonance Raman spectra. Quantitative modeling of the observed redshifts is presented based on a nonadiabatic coupled electron-lattice model that self-consistently predicts strong nonlinearity and highly localized multiquanta bound states.

240 citations