Semiconductor Manufacturers' Efforts to Improve Trust in the Electronic Part Supply Chain
Citations
514 citations
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...3) Device Aging Models/Sensors: IC lifetime is influenced by a variety of phenomena [11], [42], [107], [108], such as negative temperature bias instability (NBTI), hot carrier injection, and electromagnetic migration....
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424 citations
Cites background from "Semiconductor Manufacturers' Effort..."
...Similarly, part authentication tools [22] consist of providing an encrypted number for each device by a radio-frequency identification (RFID) tag in production....
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172 citations
Cites background from "Semiconductor Manufacturers' Effort..."
...The other important factor to consider is stability of PUF responses and its vulnerability to operational and temperature conditions....
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107 citations
Cites background from "Semiconductor Manufacturers' Effort..."
...Mislabeled chips can be detected by visual inspection, depackaging, or X-ray photography of the packages [65]....
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...2), and sensors to determine IC aging are the used at the design phase to enable counterfeit detection [64, 61, 65]....
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99 citations
References
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