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SemiConductor Wafer Bonding: Science and Technology
Q.-Y Tong,Ulrich Gösele +1 more
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TLDR
In this paper, the authors present the basic interactions between flat surfaces, including the influence of Particles, Surface Steps, and Cavities, and thermal treatment of Bonded Wafer Pairs.Abstract:
Basics of Interactions Between Flat Surfaces. Influence of Particles, Surface Steps, and Cavities. Surface Preparation and Room-Temperature Wafer Bonding. Thermal Treatment of Bonded Wafer Pairs. Thinning Procedures. Electrical Properties of Bonding Interfaces. Stresses in Bonded Wafers. Bonding of Dissimilar Materials. Bonding of Structured Wafers. Mainstream Applications. Emerging and Future Applications. Index.read more
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