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Sensitivity enhancement of polysilicon piezo-resistive pressure sensors with phosphorous diffused resistors

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TLDR
In this article, the phosphorus diffusion source is used instead of boron dopant for realizing the piezo-resistors, and the results obtained in our laboratory have clearly demonstrated that by optimizing the phosphorous diffusion temperature and duration, it is possible to achieve sensitivities in excess of 20mV /Bar for bridge input voltage of 10V, with linearity within 1% over a differential pressure range up to 10Bar (10 6Pascal), and burst pressure of 50 Bar as compared to the 10mV/Bar sensitivity obtained with Boron doped poly
Abstract
It is generally accepted that the piezo-resistive coefficient in single crystal silicon is higher when P-type impurities such as boron are used for doping the resistors. In this paper we demonstrate that the sensitivity of polycrystalline silicon piezo-resistive pressure sensors can be enhanced considerably when phosphorus diffusion source is used instead of boron dopant for realizing the piezo-resistors. Pressure sensors have been designed and fabricated with the polycrystalline piezo-resistors connected in the form of a Wheatstone bridge and laid out on thermal oxide grown on membranes obtained with a Silicon On Insulator (SOI) approach. The SOI wafers required for this purpose have been realized in-house by Silicon Fusion Bonding (SFB) and etch back technique in our laboratory. This approach provides excellent isolation between the resistors and enables zero temperature coefficient of the polysilicon resistor. The results obtained in our laboratory have clearly demonstrated that by optimizing the phosphorus diffusion temperature and duration, it is possible to achieve sensitivities in excess of 20mV /Bar for bridge input voltage of 10V, with linearity within 1% over a differential pressure range up to 10Bar (10 6Pascal), and burst pressure in excess of 50 Bar as compared to the 10mV /Bar sensitivity obtained with boron doped polysilicon piezo-resistors. This enhancement is attributed to grain boundary passivation by phosphorous atoms.

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Journal ArticleDOI

Erratum to: Design principles and considerations for the `ideal' silicon piezoresistive pressure sensor: a focused review

TL;DR: In this paper, a review and analysis of various design considerations and principles for silicon piezoresistive pressure sensors is presented, and the effect of these considerations on the sensor output taking help of various CAD tools.
Journal ArticleDOI

Polysilicon thin film piezoresistive pressure microsensor: design, fabrication and characterization

TL;DR: In this paper, a polysilicon piezoresistive pressure sensor with wet bulk micromachined diaphragm was designed and tested with pressure load for determining the static and temperature characteristics of the sensor in the pressure range of 0 −30 Bar.
Journal ArticleDOI

Computer aided modelling and diaphragm design approach for high sensitivity silicon-on-insulator pressure sensors

TL;DR: In this article, a modified analytical model for describing the load-deflection performance of SOI composite diaphragm is presented, which is able to predict the deflection accurately when compared with deflection obtained by IntelliSuite FEA.
Journal ArticleDOI

Piezoresistive sensitivity, linearity and resistance time drift of polysilicon nanofilms with different deposition temperatures.

TL;DR: The optimal deposition temperature for the improvement of film performance and reliability is about 620 °C and the high temperature annealing is not very effective in improving the piezoresistive performance of PSNFs deposited at lower temperatures.

MEMS Piezoresistive Pressure Sensor: A Survey

TL;DR: A survey of piezoresistive pressure sensor including their pressure sensing mechanism, evolution, materials, design considerations, performance parameter that to be considered and the fabrication process used can be found in this paper.
References
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BookDOI

Polycrystalline Silicon for Integrated Circuits and Displays

TL;DR: Polycrystalline Silicon for Integrated Circuits and Displays, Second Edition as mentioned in this paper presents much of the available knowledge about polysilicon, and it represents an effort to interrelate the deposition, properties, and applications of poly-silicon.
Journal ArticleDOI

Piezoresistive pressure sensors based on polycrystalline silicon

TL;DR: The theoretical interpretation and models of the piezoresistivity in poly-Si and experimental results are presented in this paper, where the calculation of the longitudinal and transverse gauge factors and their correlation with the crystallographic structure of the polySi film are discussed.
Journal ArticleDOI

Temperature sensitivity in silicon piezoresistive pressure transducers

TL;DR: In this article, various mechanisms responsible for temperature sensitivity in silicon piezoresistive pressure sensors are described, including resistor match, oxide stress and junction leakage current playing relatively minor roles over the -40 to + 180°C temperature range.
Journal ArticleDOI

Temperature-independent pressure sensors using polycrystalline silicon strain gauges

TL;DR: In this paper, the sheet resistance and piezoresistive effect (k-factor) and their temperature coefficients for LPCVD-polysilicon films are examined as a function of the boron concentration and the averaged grain size.
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