Journal ArticleDOI
Solid phase welding of alloy AA6061 and SiCp reinforced alloy AA6061 at intermediate temperature
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This article is published in Materials Science Forum.The article was published on 1997-12-01. It has received 10 citations till now. The article focuses on the topics: 6111 aluminium alloy & 5052 aluminium alloy.read more
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Journal ArticleDOI
Interface evolution and bond strength when diffusion bonding materials with stable oxide films
TL;DR: In this paper, the effects of stable surface oxides on the interface morphologies and strength of aluminium diffusion bonds are reviewed and compared for both solid-state diffusion bonding and conventional transient liquid-phase diffusion bonding.
DissertationDOI
Diffusion bonding aluminium alloys and composites : new approaches and modelling
Shirzadi Ghoshouni,Amir Abbas +1 more
TL;DR: In this article, the authors presented a new joining technique for advanced aluminium alloys and composites, which was based on applying isostatic pressure (rather than conventional uniaxial compression), and bonds were fabricated with shear strengths as high as 242 MPa which is 92% of the shear strength of the parent material.
Journal ArticleDOI
Interface structure changes during vibration liquid phase bonding of SiCp/A356 composites in air
TL;DR: In this paper, a vibration liquid phase bonding for SiCp/A356 composites in air was investigated, where the residual liquid filler metal layer in the joint is squeezed out, and mix with the base metal, the primary Zn-Al-Cu hyper-eutectic in the joints transforms into Al-rich Al-base solid solution (α-Al), a composite bond reinforced by original and broken-up SiC particle forms.
Journal ArticleDOI
Modelling behaviour of oxide film during vibration diffusion bonding of SiCp/A356 composite in air
TL;DR: In this article, the surface of specimens to be bonded was treated with and without vibration under the bonding condition, and it was found by atomic force microscopy analysis that some of the oxide film could be broken down when ridges on the surface were ground down.
Journal ArticleDOI
Recent advances in solid-state bonding of aluminium alloys (Report 4)
TL;DR: In this paper, the authors describe the diffusion of atoms present between the surfaces being bonded, involving base metals being brought into close contact and pressure being applied to a degree as far as possible avoiding plastic deformation under temperature conditions below the base metal melting point.