Static and dynamic thermal behavior of IGBT power modules

TLDR: In this paper, the thermal analysis for a 1200A, 3300V IGBT module has been reported at two levels such as a module and a system level, where the thermal behavior of the IGBT was investigated and analyzed through 3Dimensional Finite Element Methoel (3D-FEM), SOLIDIS-1SE ancl ANSYS 5.4 in the static and dynamic conditions.

Abstract: The trend in power electronics continues towards greater packaging density, speed and high power dissipation. This technology trend resulted in increased operating temperatures, which have in turn lead to an increase 01' the failure rate aud a reduction 01' the reliability, Thus, thermal simulations are playing an essential role in the design 01' high power systems such as vehicles, ships, space crafts, etc, In this thesis, thermal analysis for a 1200A, 3300V IGBT module has been announced at two levels such as a module and a system level. For the module level analysis, the thermal behavior 01' the IGBT module was investigated and analyzed through 3-Dimensional Finite Element Methoel (3D-FEM), SOLIDIS-1SE ancl ANSYS 5.4 in the static and dynamic conditions. For the system level analysis, the total system that consists 01' the IGBT module and a water-cooled heat sink is analyzed in two stages because 01' limited computer rnemory and long solution times. First, by using a Computational Fluid Dynamics (CFD) simulator 1.0 predict the water flow features, the heat sink is modeled. Next, the results 01' the heat sink was applied 1.0 the heat coneluction simulator as boundary conditions. The numerical results 01' the total system are accurate. '1'0 verify the simulation results, measurernent system coupled with infrared system and electrical method has been constructed. Static and dynamic thermal characteristics are measurecl uncler the cyclic self heating conditions. These measurements are cornpared with the simulation results 01' the IGBT module and the total system.