Study of an Air Cooling Scheme for 3-D Packaging
01 Mar 1994-Journal of Electronic Packaging (American Society of Mechanical Engineers)-Vol. 116, Iss: 1, pp 30-36
About: This article is published in Journal of Electronic Packaging.The article was published on 1994-03-01. It has received 6 citations till now. The article focuses on the topics: Passive cooling & Air cooling.
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44 citations
TL;DR: In this paper, a three dimensional heat and fluid flow analysis of two Plastic Leaded Chip Carrier (PLCC) packages mounted in tandem arrangement on a Printed Circuit Board (PCB) exposed to the free stream velocity is presented.
21 citations
01 Aug 1998
TL;DR: In this paper, a set of simplified equations for the thermal design of natural air-cooled electronic equipment casings has been proposed, which satisfied the demand of practical air cooling systems, since it took account of factors such as the stack effect, the air flow resistance and the heat transfer due to natural convection.
Abstract: This paper describes a practical thermal design approach to natural air-cooled electronic equipment casings. A set of simplified equations for the thermal design of natural air-cooled electronic equipment casings has been proposed. The proposed set of equations satisfied the demand of practical air-cooling systems, since it takes account of factors such as the stack effect, the air flow resistance and the heat transfer due to natural convection. The effects of the outlet area and the location of the main power supply unit on the natural cooling capability of electronic equipment casings were studied using a set of equations. The results have shown that a uniform temperature distribution could be achieved when the main power supply unit was placed at the bottom of the casing. It has also been suggested that the value of the heat removed from the casing surface could be more significant than that from the outlet vent in the thermal design of natural air-cooled electronic equipment casings.
7 citations
TL;DR: In this paper, the PQ curves of a wire-rod EHD pump with respect to the number of the corona and the collector electrodes were analyzed and shown to be sensitive to the voltage of corona current.
Abstract: Forced convection is the most common thermal management practice and is usually implemented by airflow-generating devices, such as rotary fans. Working based on electrohydrodynamics (EHDs), EHD pumps are emerging airflow-generating devices that have no moving parts, work quietly, and are geometry flexible. The curves showing static pressure versus flow rate (PQ curves) represent the characteristics of an airflow-generating device. This article, experimentally and statistically, presents how PQ curves of a wire-rod EHD pump respond to the electrical driving mode with respect to the numbers of the corona and the collector electrodes. The results show that when the EHD pump is driven by constant corona voltage, both the static pressure and the flow rate are sensitive to the number of corona electrodes. On the other hand, when the EHD pump is driven by constant corona current, both the static pressure and the flow rate are highly responsive to the level of the applied corona current.
3 citations
01 Oct 2013
TL;DR: In this article, an attempt has been made to study the effects of the outlet vent area and power dissipation unit location on the natural air-cooled electronic equipment casings.
Abstract: In recent years, the increasing demand of compactness and high-speed performance of electronic equipment had led to an increasing trend of power dissipation density. Therefore, suitable cooling techniques to the thermal designing of electronic equipment need to be developed. Several research reports on electronic equipment cooling are available in the literature sources [1-5]. In these studies it can be observed that air-cooling is getting one of the important cooling techniques, since most of the electronic equipment are cooled by air convection. Although fan cooling is most widely used in the air cooling techniques, the noise generated by the fan is publicly criticized. As a result, cooling on the basis of natural convection is one of the attractive approaches. However, only limited data on natural convection, which can be used in the practical design of electronic equipment, are available. Noronha [6] studied the effect of the component locations in cabinets to achieve maximum natural cooling efficiency. Guglielmini et al [7] have reported on the natural air cooling of electronic cards in ventilated enclosures. Ishizuka et al. [8] proposed an approach using a simplified set of equations which represent the cooling capability through a natural air-cooled electronic equipment casings. However, detailed discussions on derivation of the set of equations were not made in that paper. Therefore, in the present work, an attempt has been made to study the effects of the outlet vent area and power dissipation unit location on the natural air-cooled electronic equipment casings.
2 citations