Journal ArticleDOI
Substrate effect on electrodeposited copper morphology and crystal shapes
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In this paper, the surface morphology varies with the change in overpotential, but not with change in substrate, and the crystal shape is independent of the applied over-potential but varies with bath chemistry or choice of substrate.Abstract:
Copper has been electrodeposited on copper (FCC) and mild steel (BCC) substrates from acidic sulphate bath with and without cetyl trimethyl ammonium bromide at 0.25, 2, 6 and 9 V. It is found that the surface morphology varies with the change in overpotential, but not with the change in substrate. On the contrary, the crystal shape is found to be independent of the applied overpotential, but varies with the bath chemistry or choice of substrate.read more
Citations
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Estimation of Zwitterionic Surfactant Response in Electroless Composite Coating and Properties of Ni–P–CuO (Nano)Coating
R. Muraliraja,R. Muraliraja,J. Sudagar,R. Elansezhian,A. V. Raviprakash,R. Dhinakaran,V.S. Shaisundaram,M. Chandrasekaran +7 more
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Properties and applications of amphoteric surfactant: A concise review
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Electrochemical approaches for selective recovery of critical elements in hydrometallurgical processes of complex feedstocks.
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References
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Journal ArticleDOI
The Growth of Crystals and the Equilibrium Structure of their Surfaces
TL;DR: In this paper, it was shown that the rate of growth of a surface containing dislocations is proportional to the square of the supersaturation for low values and to the first power for high values of the latter.
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Electrocrystallization: Nucleation and growth phenomena
TL;DR: A review of the present status of the problem of metal deposition and electrochemical phase formation and growth is made in this paper, with an overview of the major contributions of different electrochemical schools.
Journal ArticleDOI
The effect of hydrogen codeposition on the morphology of copper electrodeposits. I. The concept of effective overpotential
TL;DR: In this paper, the effect of hydrogen codeposition on the morphology of copper electrodeposits was studied and the dependences of the overall current and the volume of evolved hydrogen on the quantity of electricity used were plotted and the average current efficiencies of the evolved hydrogen were derived from them.
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Morphologies of copper deposits obtained by the electrodeposition at high overpotentials
Abstract: Morphologies of copper deposits obtained at overpotentials belonging to the plateau of the limiting diffusion current density and at higher overpotentials were examined by the scanning electron microscopy (SEM) technique. Copper dendrites are formed at overpotentials belonging to the plateau of the limiting diffusion current density. The shape of copper dendrites depends on the electrodeposition overpotential. At higher overpotentials (800 and 1000 mV) and larger values of current densities, porous and very disperse copper deposits were obtained. These morphologies were a consequence of a very vigorous hydrogen evolution at these electrodeposition overpotentials. Also, the obtained copper structures consisted of agglomerates of copper grains. The size of copper grains is a function of the overpotential of electrodeposition, thus approaching to nano-sized dimensions is achieved when the electrodeposition overpotential is increased.
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Mechanical and structural properties of electrodeposited copper and their relation with the electrodeposition parameters
A. Ibáñez,Enrique Fatás +1 more
TL;DR: In this article, the influence of current density on microhardness through its effect on grain size has been found to obey the Hall-Petch relationship in the nanometer range.