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Journal ArticleDOI

Substrate effect on electrodeposited copper morphology and crystal shapes

03 Jun 2018-Surface Engineering (Taylor & Francis)-Vol. 34, Iss: 6, pp 485-492
TL;DR: In this paper, the surface morphology varies with the change in overpotential, but not with change in substrate, and the crystal shape is independent of the applied over-potential but varies with bath chemistry or choice of substrate.
Abstract: Copper has been electrodeposited on copper (FCC) and mild steel (BCC) substrates from acidic sulphate bath with and without cetyl trimethyl ammonium bromide at 0.25, 2, 6 and 9 V. It is found that the surface morphology varies with the change in overpotential, but not with the change in substrate. On the contrary, the crystal shape is found to be independent of the applied overpotential, but varies with the bath chemistry or choice of substrate.
Citations
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Journal ArticleDOI
Y. L. Teng1, L. Li1, W. Zhang1, N. Wang1, C. C. Feng1, J.H. Ren1 
TL;DR: In this paper, electrical discharge machining (EDM) is regarded as the most efficient method for polycrystalline diamond (PCD) processing, but it is difficult to be processed by traditional machining methods.
Abstract: Polycrystalline diamond (PCD) is widely used for its excellent properties but difficult to be processed by traditional machining methods. Electrical discharge machining (EDM) is regarded as...

14 citations


Cites methods from "Substrate effect on electrodeposite..."

  • ...By adjusting the deposition parameters in the electrodeposition, the grain size can be controlled.([23]) In this investigation, the machining characteristics of PCD by EDM in different parameters were studied by using Cu-Ni electrode prepared with electrodeposition and the removal mechanism in EDM was summarized....

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Journal ArticleDOI
TL;DR: In this paper, the authors evaluated the coefficient of friction (CoF), electrical resistivity, and electrical contact resistance (ECR) of the electrodeposited single-layer Cu-SiC nanocomposite coating and five-layered Cu, SiC functionally graded coating (FGC).
Abstract: The present work evaluates the coefficient of friction (CoF), electrical resistivity, and electrical contact resistance (ECR) of the electrodeposited single-layered Cu-SiC nanocomposite coating and five-layered Cu, Cu-SiC functionally graded coating (FGC). Both the coatings have a similar thickness (60 µm) and same composition at the top surface (7 vol.% reinforced SiC nanoparticles), while the FGC has a gradient of composition and microstructure throughout the thickness. The Cu, Cu-SiC FGC has two layers of Cu-SiC with a decrement in the content of SiC nanoparticles from 7 to 2 vol.% followed by three Cu layers with an increasing crystallite size towards the substrate. The electrical resistivity of the Cu, Cu-SiC FGC is measured by the four-wire resistance measurement method and the value is observed to be 50% less than the conventional nanocomposite coating. A linear reciprocating sliding wear test is carried out at 2, 5 and 8 N load at a constant frequency and stroke length of 10 Hz and 2 mm, respectively. The monitored value of CoF is significantly less for the Cu, Cu-SiC FGC than the single-layered coating at 2 and 5 N loads and is nearly equal at 8 N load. It is observed that before wear, the ECR values of both the coatings are higher than the uncoated Cu and after wear the ECR value of Cu, Cu-SiC FGC is the lowest.

9 citations

Journal ArticleDOI
TL;DR: In this paper, anodic aluminum oxide (AAO) template was used to synthesize Sn nanowires, which had a linear growth rate of approximately 2.49μm/min.

8 citations

Journal ArticleDOI
TL;DR: In this article, cyclic voltammetry (CV) and chronoamperometry (CA) features indicated the irreversible behavior of indium discharge on each cathode, and the heterogeneous charge transfer rate constant (k0) has been evaluated on Cu, Ti and Al cathodes and their values were 7.1·10−5 cm/s, 6.2· 10−5cm/s and 5.4·10 −5 cm /s, respectively.

6 citations

Journal ArticleDOI
TL;DR: The electrodeposited Cu, Cu-SiC FGC has the potential to serve as an inexpensive touch surface alternative for the healthcare industries because of its antibacterial and anti-adhesion properties.

5 citations

References
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Journal ArticleDOI
TL;DR: In this paper, it was shown that the rate of growth of a surface containing dislocations is proportional to the square of the supersaturation for low values and to the first power for high values of the latter.
Abstract: Parts I and II deal with the theory of crystal growth, parts III and IV with the form (on the atomic scale) of a crystal surface in equilibrium with the vapour. In part I we calculate the rate of advance of monomolecular steps (i.e. the edges of incomplete monomolecular layers of the crystal) as a function of supersaturation in the vapour and the mean concentration of kinks in the steps. We show that in most cases of growth from the vapour the rate of advance of monomolecular steps will be independent of their crystallographic orientation, so that a growing closed step will be circular. We also find the rate of advance for parallel sequences of steps. In part II we find the resulting rate of growth and the steepness of the growth cones or growth pyramids when the persistence of steps is due to the presence of dislocations. The cases in which several or many dislocations are involved are analysed in some detail; it is shown that they will commonly differ little from the case of a single dislocation. The rate of growth of a surface containing dislocations is shown to be proportional to the square of the supersaturation for low values and to the first power for high values of the latter. Volmer & Schultze’s (1931) observations on the rate of growth of iodine crystals from the vapour can be explained in this way. The application of the same ideas to growth of crystals from solution is briefly discussed. Part III deals with the equilibrium structure of steps, especially the statistics of kinks in steps, as dependent on temperature, binding energy parameters, and crystallographic orientation. The shape and size of a two-dimensional nucleus (i.e. an ‘island* of new monolayer of crystal on a completed layer) in unstable equilibrium with a given supersaturation at a given temperature is obtained, whence a corrected activation energy for two-dimensional nucleation is evaluated. At moderately low supersaturations this is so large that a crystal would have no observable growth rate. For a crystal face containing two screw dislocations of opposite sense, joined by a step, the activation energy is still very large when their distance apart is less than the diameter of the corresponding critical nucleus; but for any greater separation it is zero. Part IV treats as a ‘co-operative phenomenon’ the temperature dependence of the structure of the surface of a perfect crystal, free from steps at absolute zero. It is shown that such a surface remains practically flat (save for single adsorbed molecules and vacant surface sites) until a transition temperature is reached, at which the roughness of the surface increases very rapidly (‘ surface melting ’). Assuming that the molecules in the surface are all in one or other of two levels, the results of Onsager (1944) for two-dimensional ferromagnets can be applied with little change. The transition temperature is of the order of, or higher than, the melting-point for crystal faces with nearest neighbour interactions in both directions (e.g. (100) faces of simple cubic or (111) or (100) faces of face-centred cubic crystals). When the interactions are of second nearest neighbour type in one direction (e.g. (110) faces of s.c. or f.c.c. crystals), the transition temperature is lower and corresponds to a surface melting of second nearest neighbour bonds. The error introduced by the assumed restriction to two available levels is investigated by a generalization of Bethe’s method (1935) to larger numbers of levels. This method gives an anomalous result for the two-level problem. The calculated transition temperature decreases substantially on going from two to three levels, but remains practically the same for larger numbers.

4,432 citations

Journal ArticleDOI
TL;DR: A review of the present status of the problem of metal deposition and electrochemical phase formation and growth is made in this paper, with an overview of the major contributions of different electrochemical schools.

407 citations

Journal ArticleDOI
TL;DR: In this paper, the effect of hydrogen codeposition on the morphology of copper electrodeposits was studied and the dependences of the overall current and the volume of evolved hydrogen on the quantity of electricity used were plotted and the average current efficiencies of the evolved hydrogen were derived from them.

191 citations

Journal ArticleDOI
Abstract: Morphologies of copper deposits obtained at overpotentials belonging to the plateau of the limiting diffusion current density and at higher overpotentials were examined by the scanning electron microscopy (SEM) technique. Copper dendrites are formed at overpotentials belonging to the plateau of the limiting diffusion current density. The shape of copper dendrites depends on the electrodeposition overpotential. At higher overpotentials (800 and 1000 mV) and larger values of current densities, porous and very disperse copper deposits were obtained. These morphologies were a consequence of a very vigorous hydrogen evolution at these electrodeposition overpotentials. Also, the obtained copper structures consisted of agglomerates of copper grains. The size of copper grains is a function of the overpotential of electrodeposition, thus approaching to nano-sized dimensions is achieved when the electrodeposition overpotential is increased.

172 citations

Journal ArticleDOI
TL;DR: In this article, the influence of current density on microhardness through its effect on grain size has been found to obey the Hall-Petch relationship in the nanometer range.
Abstract: Thin copper-electrodeposited films have been prepared on steel substrates from an additive-free copper sulfate bath by applying different current signals such as rectangular and square wave pulses, triangular waveform and also by direct current with variation of its magnitude. Mechanical properties of these films have been studied by means of dynamic microindentation measurements known as the universal microhardness test. Values of the hardness, plastic component, Young's modulus and percent of elastic recovery have been measured. In order to obtain the preferential orientation and grain size of the electrodeposits, X-ray diffraction studies have been made as well as scanning electron microscopy to evaluate their morphology. All the deposits showed a preferential orientation but without a simple correlation with the mechanical features of the films. The influence of current density on microhardness through its effect on grain size has been found to obey the Hall–Petch relationship in the nanometer range. Finally, correlations between the mechanical properties of the electrodeposits and the electrodeposition parameters have been made. These kinds of studies raise the possibility of tailoring films with good mechanical performance for different technological applications just by selecting the appropriate electrodeposition conditions.

112 citations

Trending Questions (1)
How does the co-deposition of hydrogen with copper affect the crystal structure of the electrodeposited material?

The provided paper does not mention anything about the co-deposition of hydrogen with copper and its effect on the crystal structure of the electrodeposited material.