Journal ArticleDOI
Substrate effect on electrodeposited copper morphology and crystal shapes
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In this paper, the surface morphology varies with the change in overpotential, but not with change in substrate, and the crystal shape is independent of the applied over-potential but varies with bath chemistry or choice of substrate.Abstract:
Copper has been electrodeposited on copper (FCC) and mild steel (BCC) substrates from acidic sulphate bath with and without cetyl trimethyl ammonium bromide at 0.25, 2, 6 and 9 V. It is found that the surface morphology varies with the change in overpotential, but not with the change in substrate. On the contrary, the crystal shape is found to be independent of the applied overpotential, but varies with the bath chemistry or choice of substrate.read more
Citations
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Estimation of Zwitterionic Surfactant Response in Electroless Composite Coating and Properties of Ni–P–CuO (Nano)Coating
R. Muraliraja,R. Muraliraja,J. Sudagar,R. Elansezhian,A. V. Raviprakash,R. Dhinakaran,V.S. Shaisundaram,M. Chandrasekaran +7 more
TL;DR: In this article, Zwitterionic surfactant was introduced into the composite coating for the first time to increase the suspension of nanoparticles effectively during the coating process, which reduced the intermolecular attraction between the solid and liquid interfaces and eliminated the binding of the nanoparticles with the hydrogen gas bubbles.
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Properties and applications of amphoteric surfactant: A concise review
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Coating Technologies for Copper Based Antimicrobial Active Surfaces: A Perspective Review
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Electrochemical approaches for selective recovery of critical elements in hydrometallurgical processes of complex feedstocks.
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Synthesis and characterization of novel Cu, Cu-SiC functionally graded coating by pulse reverse electrodeposition
TL;DR: In this paper, a Cu based functionally graded coating (FGC) has been deposited on an annealed Cu substrate by galvanostatic pulse reverse electrodeposition (PRED) route.
References
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Journal ArticleDOI
How does your crystal grow? A commentary on Burton, Cabrera and Frank (1951) 'The growth of crystals and the equilibrium structure of their surfaces'.
TL;DR: The key ideas presented in the classic paper ‘The growth of crystals and the equilibrium structure of their surfaces’ by W. K. Burton, N. Cabrera and F. C. Frank are summarized and put in the context of both the state of knowledge at the time of publication and the considerable amount of work since that time that built on and developed these ideas.
Journal ArticleDOI
A review of developments in the electrodeposition of tin-copper alloys
TL;DR: The importance of tin-copper electrodeposits is summarised and the scope for plating them is highlighted in this article, where the authors focus on electrochemical voltammetry techniques together with morphological information from SEM imaging.
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Effect of pulse parameter on pulsed electrodeposition of copper on stainless steel
TL;DR: In this paper, the pulsed electrodeposition of copper on stainless steel has been studied in copper sulphate bath and the effect of duty cycle and frequency on the thickness and current efficiencies were compared at 50°C and at room temperature with average current density of 4 A dm−2.
Journal ArticleDOI
Microstructure in electrodeposited copper layers, the role of the substrate
TL;DR: The microstructures of Cu layers, ranging in thickness from 3 to 12 µm, were investigated in this article, where the layers were electrodeposited from an acidic copper electrolyte onto two distinct substrate materials.
Journal ArticleDOI
Structural Accelerating Effect of Chloride on Copper Electrodeposition
Yuriy I. Yanson,M. J. Rost +1 more
TL;DR: In this article, video-rate scanning-tunneling-microscopy imaging during Cu electrodeposition reveals a profound structural accelerating effect of Cl(-) on the deposition process.