Substrate effect on electrodeposited copper morphology and crystal shapes
TL;DR: In this paper, the surface morphology varies with the change in overpotential, but not with change in substrate, and the crystal shape is independent of the applied over-potential but varies with bath chemistry or choice of substrate.
Abstract: Copper has been electrodeposited on copper (FCC) and mild steel (BCC) substrates from acidic sulphate bath with and without cetyl trimethyl ammonium bromide at 0.25, 2, 6 and 9 V. It is found that the surface morphology varies with the change in overpotential, but not with the change in substrate. On the contrary, the crystal shape is found to be independent of the applied overpotential, but varies with the bath chemistry or choice of substrate.
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TL;DR: In this article, Zwitterionic surfactant was introduced into the composite coating for the first time to increase the suspension of nanoparticles effectively during the coating process, which reduced the intermolecular attraction between the solid and liquid interfaces and eliminated the binding of the nanoparticles with the hydrogen gas bubbles.
Abstract: Electroless Ni–P and Ni–P–CuO coating on mild steel was developed successfully with the addition of Zwitterionic surfactant. The usage of nano-CuO in electroless coating was intermittent though the cost is low with high catalytic activity. Zwitterionic surfactant was introduced into the composite coating for the first time to increase the suspension of nanoparticles effectively during the coating process. Surfactant helps to reduce the intermolecular attraction between the solid and liquid interfaces and hence binding of nanoparticles with the hydrogen gas bubbles was eliminated. Also agglomeration of nanoparticles was controlled by stirring the electrolyte continuously using magnetic stirrer. The characterization and tribological properties were tested for the newly developed composites. Scanning electron microscope micrograph reveals the deposits are produced without any defects and the presence of CuO nanoparticles in the deposit. Energy-dispersive spectroscopy measurement shows the changes of weight percentage of elements available in the substrate. The surface roughness of the deposit was improved with the addition of CuO, it packs the gap between two grains and offers smooth finish and as the result the surface properties are modified. Microhardness of the substrate was improved for the substrate added with nano-CuO. The corrosion resistance of the substrate was improved when compared to the substrate produced using electroless Ni–P binary coating. Zwitterionic surfactant reduces the agglomeration of nanoparticles during chemical reaction and allows the particles to coat only on the target. Similarly, this technique can be implemented in the production of other composites in electroless coatings.
34 citations
26 citations
26 Apr 2021
TL;DR: In this article, the authors compared the properties of copper-based antimicrobial coatings produced by various deposition methods including thermal spray technique, electrodeposition, electroless plating, chemical vapor deposition (CVD), physical vapor deposition, and sputtering techniques.
Abstract: Microbial contamination of medical devices and treatment rooms leads to several detrimental hospital and device-associated infections. Antimicrobial copper coatings are a new approach to control healthcare-associated infections (HAI’s). This review paper focuses on the efficient methods for depositing highly adherent copper-based antimicrobial coatings onto a variety of metal surfaces. Antimicrobial properties of the copper coatings produced by various deposition methods including thermal spray technique, electrodeposition, electroless plating, chemical vapor deposition (CVD), physical vapor deposition (PVD), and sputtering techniques are compared. The coating produced using different processes did not produce similar properties. Also, process parameters often could be varied for any given coating process to impart a change in structure, topography, wettability, hardness, surface roughness, and adhesion strength. In turn, all of them affect antimicrobial activity. Fundamental concepts of the coating process are described in detail by highlighting the influence of process parameters to increase antimicrobial activity. The strategies for developing antimicrobial surfaces could help in understanding the mechanism of killing the microbes.
26 citations
TL;DR: In this review, recent advances in electrochemically mediated technologies for metal recovery are discussed, with a focus on rare earth elements and other key critical materials for the modern circular economy.
25 citations
Cites background from "Substrate effect on electrodeposite..."
...This result indicates that standard reduction potentials alone do not determine the composition of the deposit; other factors, such as metal concentration, pH, ionic strength, additives, the kind of substrate, chelating agents, mode of electrodeposition (chronoamperometry or chronopotentiometry), applied current signal, temperature, and fluid-dynamic conditions, all work together to determine the characteristics of deposition (Banthia et al., 2017; Ibañez and Fatás, 2005; Kim et al., 2018a; Maarof et al., 2017)....
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TL;DR: In this paper, a Cu based functionally graded coating (FGC) has been deposited on an annealed Cu substrate by galvanostatic pulse reverse electrodeposition (PRED) route.
20 citations
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TL;DR: In this article, a room temperature ionic liquid (RTIL) was used to electrodeposite Al coating on copper and mild steel substrates in a glove box having a controlled atmosphere.
Abstract: Coatings of aluminium were electrodeposited on copper and mild steel substrates in a room temperature ionic liquid (RTIL) using [EMIm]Cl (95%) and AlCl3 (98%) in a glove box having a controlled atmosphere. Formation and purity of aluminium were confirmed by X-ray diffraction, X-ray fluorescence and energy dispersive spectroscopy measurements. Microcrystalline grain morphology of deposited Al was observed in scanning electron microscopy. The present study showed that Al coating electrodeposited in an RTIL exhibited similar morphology on copper and mild steel substrates, and cathode current efficiency depended on purity of the electrolyte and also on the deposition current density. There were indications for build-up of tensile stress in the coating even at low deposition current density.
6 citations
TL;DR: In this paper, the synthesis of Fe3O4 films on conducting non-magnetic copper substrate was successfully synthesized in a wide temperature range by a simple hydrothermal method.
Abstract: Magnetite (Fe3O4) films on conducting non-magnetic copper substrate were successfully synthesised in a wide temperature range by a simple hydrothermal method. The synthesis utilised FeSO4.7H2O and hydrazine hydrate as starting materials in the presence of KOH for adjusting the pH value to 10. The synthesis was performed in a wide temperature range of 80 to 200°C. The as prepared Fe3O4 films were characterised by X-ray diffraction (XRD), scanning electron microscopy (SEM) and vibrating sample magnetometer (VSM). The XRD patterns of the films showed pure phase of Fe3O4 accompanied by copper substrate peaks. The SEM images showed firm, compact and uniform Fe3O4 films with thickness of ∼10 μm. The VSM results presented in plane anisotropic magnetic properties, which further confirms the formation of Fe3O4 films on the copper substrate and thus endows their potential applications in the future.
3 citations
TL;DR: A facile growth of chain-like Au nanostructures and their spontaneous transformation to multi-twined nanostructure using a mild reducing agent bisphenol A (BPA) is described in this article.
Abstract: We describe a facile growth of chain-like Au nanostructures and their spontaneous transformation to multi-twined nanostructure using a mild reducing agent bisphenol A (BPA). The growth Au nanostructures involves the chemical reduction of HAuCl4 by BPA in the presence of cetyltrimethylammonium bromide (CTAB) as capping agent in alkaline condition without any seeds. Wire and chain-like Au nano-network structures with diameter in the range of 4 to 9 nm are obtained in the initial stage of the reaction. These chain-like nanostructures undergo spontaneous transformation into multi-twined nanostructures within 24 h. These nanocrystalline multi-twined structures have an average size of 80-90 nm. X-ray and selected area electron diffraction measurements reveal that the Au nanoparticles have (111), (200), (220) and (311) planes of a face centered cubic structure. High resolution transmission electron microscopic measurement shows that the nanostructures are mainly composed of (111) lattice plane with twin boundaries. The concentration of HAuCl4, BPA and CTAB has pronounced effect in the growth of nanostructures. The multi-twined nanostructures are highly stable at room temperature over a period of one month and can be used for catalytic applications.
2 citations