Journal ArticleDOI
Temperature Prediction on Substrates and integrated Circuit Chips
E. J. Pinto,B. B. Mikić +1 more
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TLDR
In this paper, the authors proposed a method based on a combination of Fourier transform and surface element methods to predict the steady-state temperature on one-layer structures with lead connectors and planar-discrete sources.Abstract:
This work deals with application of semianalytical methods for evaluation of temperature distribution on substrates and integrated circuit chips. This approach is based on a method proposed by Hein and Lenzi in 1969 which is a combination of Fourier transform. Green's function, and surface-element methods. The application of the method has evolved from a model that predicts the steady-state temperature on one-layer structures with lead connectors (modeled as lumped thermal resistances) and planar-discrete sources to a model that includes the effects of multiple layers and anisotropic thermal conductivity. Further generalization of the method to three new cases is presented. The first includes the transient thermal behavior in the one-layer structures with planar-discrete sources and anisotropic conductivity. The second deals with the steady-periodic behavior of two-layer structures with planar-discrete-periodic sources and anisotropic conductivity. The third case solves for the steady-state temperature in...read more
Citations
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Journal ArticleDOI
Thermal analysis of integrated circuit devices and packages
TL;DR: In this article, an analytical solution for the temperature at any location inside and on the boundaries of a four-layer structure is derived using the separation of variables, and several representative device structures were analyzed.
Proceedings ArticleDOI
Extensions of the closed form method for substrate thermal analyzers to include thermal resistances from source-to-substrate and source-to-ambient
TL;DR: In this paper, a method of complementing the basic substrate boundary value problem with lumped thermal resistances is described, in which the thermal interface resistance between a chip package and board, as well as between the same package and a local ambient can be accommodated.
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A semi-analytical method to predict printed circuit board package temperatures
TL;DR: In this article, a fast, easy-to-use method is developed to predict steady state temperatures on printed circuit boards subjected to heating by a single heat source or multiple heat sources.
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Thermal analysis of microelectric packages and printed circuit boards using an analytic solution to the heat conduction equation
TL;DR: In this article, the authors provide an overview of the solution and application of the three-dimensional heat conduction equation for a rectangular-shaped, multilayer structure with discrete surface heat sources.
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Interactive thermal modeling of electronic circuit boards
TL;DR: In this paper, a more systematic and efficient method for determining PCB temperature distributions has been developed and incorporated into a controlling algorithm which utilizes any standard finite-element code, and the main advantages of this decoupling technique are the elimination of repetitive numerical-model generation and the high level of interactive design provided.
References
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Journal ArticleDOI
Spreading Resistance in Cylindrical Semiconductor Devices
TL;DR: In this paper, the potential distribution of the spreading resistance of cylindrical semiconductor components is analyzed in graphical form for a range of geometrical parameters applicable to many practical situations.
Journal ArticleDOI
Computerized Thermal Analysis of Hybrid Circuits
TL;DR: In this article, a computer program was written to perform steady-state analysis for hybrid circuits, where the output of the program gives the temperature of each power dissipating element in the hybrid, based upon solution of Laplace's equation in three dimensions using Fourier techniques.