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Journal ArticleDOI

The anodic oxidation of GaAs in an oxygen plasma generated by a D.C. electrical discharge

Fusako Koshiga, +1 more
- 01 Jan 1979 - 
- Vol. 56, pp 39-49
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TLDR
In this paper, the anodic oxidation of GaAs was carried out in an oxygen plasma generated by a d.c. glow discharge, and the oxide dissolved easily in most commonly used acids and alkalis.
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This article is published in Thin Solid Films.The article was published on 1979-01-01. It has received 32 citations till now. The article focuses on the topics: Oxide & Glow discharge.

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On the electrical properties of compound semiconductor interfaces in metal/insulator/ semiconductor structures and the possible origin of interface states

TL;DR: In this article, a surface disorder model is proposed to explain all the dynamic anomalies in anodic native oxide/GaAs metal/oxide/semiconductor samples and anodic Al2O3/InP MIS samples.
Journal ArticleDOI

Electrical modeling of compound semiconductor interface for FET device assessment

TL;DR: In this article, a unified model for GaAs and InP metal-insulator-semiconductor (MIS) systems is presented, which involves particular types of U-shaped distributions of interface states, localized and nonlocalized states, and tunneling processes.
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Status of the GaAs metal—oxide—semiconductor technology

TL;DR: A review of recent and current work on GaAs insulated-gate technology is presented in this article, where various techniques for the formation of heteromorphic and homomorphic dielectrics are outlined.
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Semiconductor surface passivation

TL;DR: A review of the current status and the chronological evolution of metal-insulator-semiconductor (MIS) structures including homomorphic surface oxides and synthetic, heteromorphic insulating layers used for the surface passivation of elemental and compound semiconductor surfaces is presented in this paper.
Journal ArticleDOI

Film preparation using plasma or ion activation

Chr. Weissmantel
- 15 Mar 1979 - 
TL;DR: In this paper, the capabilities of these techniques are discussed in connection with results obtained for the following film deposition processes: (1) the formation of silicon layers by plasma-induced chemical vapour deposition (CVD) from SiCl4H2; (2) the synthesis of SixNyHz coatings by plasma induced CVD from SiNH3; and (3) the preparation of hard and transparent (diamond-like) carbon films by the condensation of ionized organic species.
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