The Development of a New Piezoresistive Pressure Sensor for Low Pressures
TL;DR: Compared to other traditional diaphragm types, a significant increase in sensitivity can be achieved by the proposed sensor, and the membrane deflection and nonlinearity error considerably decrease.
Abstract: This paper presents the design methodology and fabrication process of a novel piezoresistive pressure sensor with a combined cross-beam membrane and peninsula (CBMP) diaphragm structure for micropressure measurements. The sensor is then analyzed through various experiments. The sensor is primarily designed based on the optimized sensitivity, and a finite-element method is used to predict the stresses that are induced in the piezoresistors and the deflection of the membrane under different pressures. Compared to other traditional diaphragm types, a significant increase in sensitivity can be achieved by the proposed sensor, and the membrane deflection and nonlinearity error considerably decrease. The sensor fabrication process is performed on an n-type single-crystal silicon wafer, and photolithography is used with five masks to fabricate the sensing elements. Additionally, piezoresistors are formed by boron implantation. The experimental results indicate that the fabricated sensor with the CBMP membrane yields a high sensitivity of 25.7 mV/kPa and a low nonlinearity of −0.28% full-scale span for a pressure range of 0–5 kPa at room temperature.
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TL;DR: A survey of the state-of-the-art design advances in this research area over the past 20 years is presented and can be helpful to those engaged in the topology optimization of compliant mechanisms who desire to be apprised of the field’s recent state and research tendency.
198 citations
TL;DR: This review summarizes the research progress of flexible pressure sensors, including three kinds of transduction mechanisms and their respective research developments, and applications in the fields of E-skin and wearable devices.
Abstract: Flexible pressure sensors are attracting great interest from researchers and are widely applied in various new electronic equipment because of their distinct characteristics with high flexibility, high sensitivity, and light weight; examples include electronic skin (E-skin) and wearable flexible sensing devices. This review summarizes the research progress of flexible pressure sensors, including three kinds of transduction mechanisms and their respective research developments, and applications in the fields of E-skin and wearable devices. Furthermore, the challenges and development trends of E-skin and wearable flexible sensors are also briefly discussed. Challenges of developing high extensibility, high sensitivity, and flexible multi-function equipment still exist at present. Exploring new sensing mechanisms, seeking new functional materials, and developing novel integration technology of flexible devices will be the key directions in the sensors field in future.
179 citations
Cites background from "The Development of a New Piezoresis..."
...[35] designed a novel piezoresistive micro pressure sensor based on cross-beam film and peninsula (CBMP) diaphragm structure....
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01 Jan 2016
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125 citations
TL;DR: A 213-line MATLAB code for topology optimization of geometrically nonlinear structures developed based on the density method that adopts the ANSYS parametric design language (APDL) that provides convenient access to advanced finite element analysis (FEA).
Abstract: This paper presents a 213-line MATLAB code for topology optimization of geometrically nonlinear structures. It is developed based on the density method. The code adopts the ANSYS parametric design language (APDL) that provides convenient access to advanced finite element analysis (FEA). An additive hyperelasticity technique is employed to circumvent numerical difficulties in solving the material density-based topology optimization of elastic structures undergoing large displacements. The sensitivity information is obtained by extracting the increment of the element strain energy. The validity of the code is demonstrated by the minimum compliance problem and the compliant inverter problem.
63 citations
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TL;DR: An ultra-sensitive resistive pressure sensor based on an elastic, microstructured conducting polymer thin film that enables the detection of pressures of less than 1Pa and exhibits a short response time, good reproducibility, excellent cycling stability and temperature-stable sensing.
Abstract: Pressure sensing is an important function of electronic skin devices. The development of pressure sensors that can mimic and surpass the subtle pressure sensing properties of natural skin requires the rational design of materials and devices. Here we present an ultra-sensitive resistive pressure sensor based on an elastic, microstructured conducting polymer thin film. The elastic microstructured film is prepared from a polypyrrole hydrogel using a multiphase reaction that produced a hollow-sphere microstructure that endows polypyrrole with structure-derived elasticity and a low effective elastic modulus. The contact area between the microstructured thin film and the electrodes increases with the application of pressure, enabling the device to detect low pressures with ultra-high sensitivity. Our pressure sensor based on an elastic microstructured thin film enables the detection of pressures of less than 1Pa and exhibits a short response time, good reproducibility, excellent cycling stability and temperature-stable sensing.
1,199 citations
"The Development of a New Piezoresis..." refers background in this paper
...In other reports, this approach was discovered to improve sensor sensitivity [16]–[18]....
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TL;DR: It is reported that Si nanowires possess an unusually large piezoresistance effect compared with bulk, which may have significant implications in nanowire-based flexible electronics, as well as in nanoelectromechanical systems.
Abstract: The piezoresistance effect of silicon1 has been widely used in mechanical sensors2,3,4, and is now being actively explored in order to improve the performance of silicon transistors5,6. In fact, strain engineering is now considered to be one of the most promising strategies for developing high-performance sub-10-nm silicon devices7. Interesting electromechanical properties have been observed in carbon nanotubes8,9. In this paper we report that Si nanowires possess an unusually large piezoresistance effect compared with bulk. For example, the longitudinal piezoresistance coefficient along the 〈111〉 direction increases with decreasing diameter for p-type Si nanowires, reaching as high as −3,550 × 10−11 Pa–1, in comparison with a bulk value of −94 × 10−11 Pa−1. Strain-induced carrier mobility change and surface modifications have been shown to have clear influence on piezoresistance coefficients. This giant piezoresistance effect in Si nanowires may have significant implications in nanowire-based flexible electronics, as well as in nanoelectromechanical systems.
693 citations
"The Development of a New Piezoresis..." refers background in this paper
...In other reports, this approach was discovered to improve sensor sensitivity [16]–[18]....
[...]
TL;DR: In this paper, the authors reviewed the history of micromachined pressure sensors and examined new developments in the field of pressure sensors, starting from metal diaphragm sensors with bonded silicon strain gauges, and moving to present developments of surface-micromachines, optical, resonant, and smart pressure sensors.
Abstract: Since the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors have been widely produced Micromachining technology has greatly benefited from the success of the integrated circuit industry, borrowing materials, processes, and toolsets Because of this, microelectromechanical systems (MEMS) are now poised to capture large segments of existing sensor markets and to catalyse the development of new markets Given the emerging importance of MEMS, it is instructive to review the history of micromachined pressure sensors, and to examine new developments in the field Pressure sensors will be the focus of this paper, starting from metal diaphragm sensors with bonded silicon strain gauges, and moving to present developments of surface-micromachined, optical, resonant, and smart pressure sensors Considerations for diaphragm design will be discussed in detail, as well as additional considerations for capacitive and piezoresistive devices Results from surface-micromachined pressure sensors developed by the authors will be presented Finally, advantages of micromachined sensors will be discussed
533 citations
TL;DR: An up-to-date review paper on automotive sensors is presented in this article, where the primary sensor technologies in use today are reviewed and classified according to their three major areas of automotive systems application-powertrain, chassis, and body.
Abstract: An up-to-date review paper on automotive sensors is presented. Attention is focused on sensors used in production automotive systems. The primary sensor technologies in use today are reviewed and are classified according to their three major areas of automotive systems application-powertrain, chassis, and body. This subject is extensive. As described in this paper, for use in automotive systems, there are six types of rotational motion sensors, four types of pressure sensors, five types of position sensors, and three types of temperature sensors. Additionally, two types of mass air flow sensors, five types of exhaust gas oxygen sensors, one type of engine knock sensor, four types of linear acceleration sensors, four types of angular-rate sensors, four types of occupant comfort/convenience sensors, two types of near-distance obstacle detection sensors, four types of far-distance obstacle detection sensors, and and ten types of emerging, state-of the-art, sensor technologies are identified.
476 citations
"The Development of a New Piezoresis..." refers background in this paper
...Notably, the sensors have a variety of applications, such as microscale mechatronic systems [2]–[4], automobiles [5], aerodynamics [6], [7], process control [8], [9], and biomedical equipment [10]....
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TL;DR: The fabrication and characterization of bulk micromachined pressure sensors based on individual single-walled carbon nanotubes (SWNTs) as the active electromechanical transducer elements are reported on.
Abstract: We report on the fabrication and characterization of bulk micromachined pressure sensors based on individual single-walled carbon nanotubes (SWNTs) as the active electromechanical transducer elements. The electromechanical sensor device consists of an individual electrically connected SWNT adsorbed on top of a 100-nm-thick atomic layer deposited (ALD) circular alumina (Al2O3) membrane with a radius in the range of 50−100 μm. A white light interferometer (WLI) was used to measure the deflection of the membrane due to differential pressure, and the mechanical properties of the device were characterized by bulge testing. Finally, we performed the first electromechanical measurements on strained metallic SWNTs adhering to a membrane and found a piezoresistive gauge factor of approximately 210 for metallic SWNTs.
343 citations