The Early History of Microcircuitry: An Overview
TL;DR: By tracing the diverse activities and alternatives they explored-from early printed wiring to semiconductor integrated circuit efforts-this article provides the first comprehensive overview of the early history of microcircuitry.
Abstract: From the 1940s into the early 1960s, hundreds of scientists and engineers worldwide pursued efforts in microcircuitry-miniaturized, integrated electronic circuits By tracing the diverse activities and alternatives they explored-from early printed wiring to semiconductor integrated circuit efforts-this article provides the first comprehensive overview of the early history of microcircuitry
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01 Jan 1998
TL;DR: Mr. Burger, thank you for agreeing to this interview, and first I just wanted to begin by asking you about your childhood, where you were born, where he grew up, things like that.
Abstract: Sokiera: This is an interview for the Oral History and Cultural Heritage Center at The University of Southern Mississippi. It is eleven o’clock on November 8, 2012. My name is Jason Sokiera, and I am at the home of Mr. Richard Burger. Mr. Burger, thank you for agreeing to this interview. And first I just wanted to begin by asking you about your childhood, where you were born, where you grew up, things like that.
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TL;DR: In this paper, the authors present a Table of Table of Contents of the Table of contents of the table. Table 1.1.2.3.4.5.1
Abstract: ......................................................................................................................................... v Table of
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TL;DR: Makers of the microchip: a documentary history of Fairchild Semiconductor, by Christophe Lecuyer and David Brock, Cambridge, MA, MIT Press, 2010, vii++312 pp., illus., £17.95 (hardback), £13.98 (K...
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01 Jan 1998
TL;DR: Mr. Burger, thank you for agreeing to this interview, and first I just wanted to begin by asking you about your childhood, where you were born, where he grew up, things like that.
Abstract: Sokiera: This is an interview for the Oral History and Cultural Heritage Center at The University of Southern Mississippi. It is eleven o’clock on November 8, 2012. My name is Jason Sokiera, and I am at the home of Mr. Richard Burger. Mr. Burger, thank you for agreeing to this interview. And first I just wanted to begin by asking you about your childhood, where you were born, where you grew up, things like that.
356 citations
"The Early History of Microcircuitry..." refers background in this paper
...Only in the late 1960s, as manufacturing technology advanced to meet the precision tolerances required in its analog circuits, did the Bell System refocus to silicon planar ICs.48 IBM followed a similar trajectory to the Bell System and was another enormous closed producer and mass consumer of electronic circuits....
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...However, the movement of silicon microchips into high-volume manufacturing did not spell the end of hybrid ICs....
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...Only in the late 1960s, as manufacturing technology advanced to meet the precision tolerances required in its analog circuits, did the Bell System refocus to silicon planar ICs.(48) IBM followed a similar trajectory to the Bell System and was another enormous closed producer and mass consumer of electronic circuits....
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...Kilby subsequently led a small effort at Centralab in transistor manufacturing and in incorporating transistors into stencil-screened printed circuits: hybrid ICs....
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...Indeed, printed-circuit approaches of the 1940s—wherein the wiring (and often passive components) for electronic circuits was deposited in a batch, integrated fashion on an insulating substrate—were arguably the root from which sprouted two of the earliest approaches to microcircuitry: modular packaging and hybrid ICs....
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TL;DR: The design of two-dimensicn circuit assemblies, a novel design in which ceramic wafers with one to four passive components per wafer were stacked and interconnected with vertical riser wires, was developed.
Abstract: T BACKGROUND HE FIRST electronic equipments were composed of a few dozen components and could readily be asselnbled by hand-soldering techniques. Each component mas manufactured separately by a process optimized for the purpose. As electronic equipment became more complex, shortcomings in this procedure began to appear. The cost of the equipment increased more rapidly than the cornponent count, and equipment reliability suffered a corlesponding decrease. Because of their interest in complex electronic system, the problem was particularly apparent to the militav y. Each B-29 required nearly a thousand vacuum tubes a ~ l d tens of thousands of passive devices. Its electronics equipments were among the most complex systems in being at the time. By the end of World War I1 it was apparent that future systems would be limited by the cost, bulk, and reliability of the electronics. One of the first attempts to simplify the manufacturing process was carried out under National Bureau of Sta’qdards sponsorship. Their proximity fuse requirements necessitated compact rugged electronic subsystems. The Centralab Division of Globe-Union, Inc. proposed a design in which ceramic substrates would carry metal interco:?nections and chip capacitors, with miniaturized vacuum tubes attached. This proposal was developed by Rubenstein, Ehlers, Sherwood, and White of Centralab [l], and was probably the first attempt to form components in sit^ After the war, NBS and Centralab continued to work in this area. The Centralab effort, under R. L. Wolff and A. S. Khouri, developed high-volume screening techniqu(3s for production. Centralab built substantial quantities ~ a f amplifiers for hearing aid applications, with several dozen passive components and three or four tube sockets for active device attachment. They further simplified the concept by the use of a substrate with a high dielectric constant, permitting the fabrication of low cost RC net,works for radio and television applications. About 14.0 million circuits of this type were produced by 1962. The NBS effort, originally led by Brunetti and later by Franklin [2], also continued to develop two-dimensicn (2-D) circuit assemblies. A complete in-house fabricatien capability was established. In the early 1 9 5 0 ’ ~ ~ Robe::t Henry of this group, working under Navy sponsorshila, abandoned the 2-D concept and produced a novel design in which ceramic wafers with one to four passive components per wafer were stacked and interconnected with vertical riser wires. A tube socket was mounted above tk.e
286 citations