The effect of temperature on the reliability of electronic components

Electrothermal PSpice Modeling and Simulation of Power Modules

Abstract: Integrated power electronics modules (IPEMs) represent an innovative typology of power electronics assemblies able to guarantee several advantages such as increasing of power density, better management of the thermal flows, and a significant reduction of the package sizes. Their characteristics make them suitable for applications like motor drives or power conditioning. IPEM usage in emerging fields like hybrid automotive traction and electric generation from renewable energy sources is continuously increasing. In this paper, we describe the implementation of a devised flow to generate the layer-based electrothermal PSpice model of an IPEM and the simulation flow of the model. The proposed modeling methodology allows reducing an electrothermal multidomain problem to an electrical single one. The general PSpice-like nature of the proposed model makes it suitable for a wide range of simulation frameworks where the integration of heterogeneous multiphysics models could be a difficult task. The outlining of both electrical and thermal PSpice layers is discussed, and the implementation into the final model, by the assistance of custom electronic-design-automation flow, is presented. Moreover, we describe the validation procedure of the proposed approach, and the results are compared with the ones obtained by a commercial finite-element-based package used as a benchmark. Two simulation approaches related to specific conversion systems, and related issues, are presented and discussed.

Numerical study on heat transfer performance using Al2O3/water nanofluids in six circular channel heat sink for electronic chip

Abstract: In this numerical study, the heat transfer rate, surface temperature, Nusselt number, thermal resistance, power consumption and reliability of electronic chip in the six circular channel heat sink are investigated with water and the Al2O3/water nanofluids as coolants. The performances of electronic chip are studied with the ANSYS (v12) fluent software. It is observed that the Al2O3/water nanofluids decreases the surface temperature, the power consumption, and thermal resistance of electronic chip than water. It is also studied that the Nusselt number increases and the reliability of electronic chip using nanofluids is 70% higher than water as coolant.

Influence of System Pressure on Pool Boiling Regimes on a Microstructured Surface Compared to a Smooth Surface

Abstract: This study focuses on the influence of the system pressure on pool boiling regimes on a microstructured surface compared to a smooth surface. The microstructured surface consists of copper wires wi...

Latest Advancements in Heat Transfer Enhancement in the Micro-channel Heat Sinks: A Review

Abstract: Miniaturization of the energy systems and high powered electronic devices necessitates the high capacity compact heat exchangers to dissipate the heat generated. Microchannel heatsinks (MCHS) are modern heat exchangers with the fluid flowing channels of size in microscale. These are very compact heat exchangers with higher ratios of heat transfer area to the volume. Huge research work has been going on to improve the hydraulic and thermal performance of the MCHS. This article provides the information about experimental and numerical studies that has been done on the heat transfer and its enhancement in micro-scale cooling devices. This review mainly concentrate on the heat transfer enhancement techniques in microchannel, numerical methods that has been implemented for the study of micro-channels and the parameters which effects the heat transfer rate. The recent studies on microchannel heat sink to improve its performance by geometry modifications, jet impingement, using Nano fluids, flow boiling and Magneto-hydrodynamics are thoroughly discussed in this article.

Passive Cooling of mm-Wave Active Integrated 5G Base Station Antennas Using CPU Heatsinks

Abstract: The challenge of cooling in mm-wave chip-integrated base station antenna arrays is addressed. Several approaches in thermal modeling of electronics are revisited and discussed. The two-resistor compact thermal model is applied to predict the junction temperatures of the beamformer chips. Thermal simulations are performed for two fabricated arrays having 16 chips (single-polarized) and 32 chips (dual-polarized). Two commercial passive CPU heatsinks with different capabilities are modeled and attached to the chips. The simulation results are validated through experiments using the temperature sensor readings. The reasons of discrepancies between the simulated and measured results are explained.

Solder joint fatigue models: review and applicability to chip scale packages

Abstract: A review of fourteen solder joint fatigue models is presented here with an emphasis on summarizing the features and applications of each fatigue model. The models are classified into five categories: stress-based, plastic strain-based, creep strain-based, energy-based, and damage-based. Fatigue models falling outside these categories are categorized as ‘other empirical models’. Each model is presented under one category with the relevant parameters and applicable packages. Following each category, common issues such as thermal cycling conditions, solder joint geometry, and coverage are addressed. Two fatigue model application scenarios are discussed. In the first scenario, a set of existing fatigue test data is given to the engineer who must determine how best to interpret the data and which fatigue model(s) best apply. In the second scenario, a test scheme must be devised for a new chip scale package product. The number of cycles to failure (Nf) or fatigue life must be determined. A general procedure is presented for choosing an appropriate fatigue model(s) based on the package conditions and limited Finite Element Analysis time. This procedure is summarized in a flowchart.

High-Temperature Electronics Pose Design and Reliability Challenges

Abstract: Introduction Many industries are calling for electronics that can operate reliably in harsh environments, including extremely high temperatures. Traditionally, engineers had to rely on active or passive cooling when designing electronics that must function outside of normal temperature ranges, but in some applications, cooling may not be possible—or it may be more appealing for the electronics to operate hot to improve system reliability or reduce cost. This choice presents challenges that affect many aspects of the electronic system, including the silicon, packaging, qualification methodology, and design techniques.