The effect of temperature on the reliability of electronic components
17 Feb 2014-pp 1-6
TL;DR: In this article, the effect of temperature on the reliability of components used in typical electronic systems is discussed with illustrative examples for reliability calculations, and it is shown that suitable methods can be applied to minimize failures of electronic components due to thermal stresses.
Abstract: Reliability of electronic systems for operating in all types of environments has become a necessity. The progressive miniaturization in electronics, packaging of a large number of active devices per unit area of the component due to higher integration levels, higher power density per unit area, need for low- cost and reliable products, and the wide range of applications in specialized commercial, avionics, underground oil exploration, automotive, and other high temperature environments besides the normal commercial applications demands a high degree of reliable operation of the electronics under harsh environmental conditions. In such situations, reliability has to be built into the system by design, choice of suitable components, packaging and cooling techniques. This paper discusses the effect of temperature on the reliability of components used in typical electronic systems. Various models based on the temperature principle are discussed with illustrative examples for reliability calculations.Further, it is shown that by using the principle of cause - effect relationship, suitable methods can be applied to minimize failures of electronic components due to thermal stresses.
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TL;DR: In this article, the authors provide the information about experimental and numerical studies that has been done on the heat transfer and its enhancement in micro-scale cooling devices. But, they mainly concentrate on heat transfer enhancement techniques in microchannel, numerical methods that has also been implemented for the study of micro-channels and the parameters which effects heat transfer rate.
Abstract: Miniaturization of the energy systems and high powered electronic devices necessitates the high capacity compact heat exchangers to dissipate the heat generated. Microchannel heatsinks (MCHS) are modern heat exchangers with the fluid flowing channels of size in microscale. These are very compact heat exchangers with higher ratios of heat transfer area to the volume. Huge research work has been going on to improve the hydraulic and thermal performance of the MCHS. This article provides the information about experimental and numerical studies that has been done on the heat transfer and its enhancement in micro-scale cooling devices. This review mainly concentrate on the heat transfer enhancement techniques in microchannel, numerical methods that has been implemented for the study of micro-channels and the parameters which effects the heat transfer rate. The recent studies on microchannel heat sink to improve its performance by geometry modifications, jet impingement, using Nano fluids, flow boiling and Magneto-hydrodynamics are thoroughly discussed in this article.
61 citations
TL;DR: The implementation of a devised flow to generate the layer-based electrothermal PSpice model of an IPEM and the simulation flow of the model are described and the results are compared with a commercial finite-element-based package used as a benchmark.
Abstract: Integrated power electronics modules (IPEMs) represent an innovative typology of power electronics assemblies able to guarantee several advantages such as increasing of power density, better management of the thermal flows, and a significant reduction of the package sizes. Their characteristics make them suitable for applications like motor drives or power conditioning. IPEM usage in emerging fields like hybrid automotive traction and electric generation from renewable energy sources is continuously increasing. In this paper, we describe the implementation of a devised flow to generate the layer-based electrothermal PSpice model of an IPEM and the simulation flow of the model. The proposed modeling methodology allows reducing an electrothermal multidomain problem to an electrical single one. The general PSpice-like nature of the proposed model makes it suitable for a wide range of simulation frameworks where the integration of heterogeneous multiphysics models could be a difficult task. The outlining of both electrical and thermal PSpice layers is discussed, and the implementation into the final model, by the assistance of custom electronic-design-automation flow, is presented. Moreover, we describe the validation procedure of the proposed approach, and the results are compared with the ones obtained by a commercial finite-element-based package used as a benchmark. Two simulation approaches related to specific conversion systems, and related issues, are presented and discussed.
51 citations
Cites background from "The effect of temperature on the re..."
...Since contexts like automotive often involve very adverse environmental conditions, where the amount of power to be managed is on the order of tens of kilowatts and temperatures can exceed 100 ◦C, the design of modules able to efficiently and robustly manage thermal quantities becomes a necessity in order to guarantee stability and long lifetime to the systems [3], [4]....
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Cites background from "The effect of temperature on the re..."
...To avoid reliability problems [1, 2], it is crucial to effectively discharge the produced heat, thus to transfer high heat fluxes at low wall temperature, or with high heat transfer coefficients, respectively....
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TL;DR: A review of fourteen solder joint fatigue models is presented in this article with an emphasis on summarizing the features and applications of each fatigue model, and two fatigue model application scenarios are discussed.
487 citations
01 Jan 2012
TL;DR: In some applications, cooling may not be possible, or it may be more appealing for the electronics to operate hot to improve system reliability or reduce cost as discussed by the authors, which presents challenges that affect many aspects of the electronic system, including the silicon, packaging, qualification methodology, and design techniques.
Abstract: Introduction Many industries are calling for electronics that can operate reliably in harsh environments, including extremely high temperatures. Traditionally, engineers had to rely on active or passive cooling when designing electronics that must function outside of normal temperature ranges, but in some applications, cooling may not be possible—or it may be more appealing for the electronics to operate hot to improve system reliability or reduce cost. This choice presents challenges that affect many aspects of the electronic system, including the silicon, packaging, qualification methodology, and design techniques.
104 citations