The effect of temperature on the reliability of electronic components
17 Feb 2014-pp 1-6
TL;DR: In this article, the effect of temperature on the reliability of components used in typical electronic systems is discussed with illustrative examples for reliability calculations, and it is shown that suitable methods can be applied to minimize failures of electronic components due to thermal stresses.
Abstract: Reliability of electronic systems for operating in all types of environments has become a necessity. The progressive miniaturization in electronics, packaging of a large number of active devices per unit area of the component due to higher integration levels, higher power density per unit area, need for low- cost and reliable products, and the wide range of applications in specialized commercial, avionics, underground oil exploration, automotive, and other high temperature environments besides the normal commercial applications demands a high degree of reliable operation of the electronics under harsh environmental conditions. In such situations, reliability has to be built into the system by design, choice of suitable components, packaging and cooling techniques. This paper discusses the effect of temperature on the reliability of components used in typical electronic systems. Various models based on the temperature principle are discussed with illustrative examples for reliability calculations.Further, it is shown that by using the principle of cause - effect relationship, suitable methods can be applied to minimize failures of electronic components due to thermal stresses.
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20 Apr 2021
TL;DR: In this article, the heat transfer enhancement of the micro-channel heat sinks (MCHS) is discussed, which is the most suitable heat exchanging devices for electronic cooling applications with high compactness.
Abstract: Thermal management of electronic equipment is the primary concern in the electronic industry. Miniaturization and high power density of modern electronic components in the energy systems and electronic devices with high power density demanded compact heat exchangers with large heat dissipating capacity. Microchannel heat sinks (MCHS) are the most suitable heat exchanging devices for electronic cooling applications with high compactness. The heat transfer enhancement of the microchannel heat sinks (MCHS) is the most focused research area. Huge research has been done on the thermal and hydraulic performance enhancement of the microchannel heat sinks. This chapter’s focus is on advanced heat transfer enhancement methods used in the recent studies for the MCHS. The present chapter gives information about the performance enhancement MCHS with geometry modifications, Jet impingement, Phase changing materials (PCM), Nanofluids as a working fluid, Flow boiling, slug flow, and magneto-hydrodynamics (MHD).
3 citations
Cites background from "The effect of temperature on the re..."
...The performance and the life span of the electronic component with high power density is highly dependent on its heat dissipation capacity [6]....
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TL;DR: In this article , the effect of temperature on the electronic, elastic, and thermodynamic properties of Co-based full-Heusler Co2MnSi and Co2mnGe was investigated.
Abstract: We investigated the effect of temperature on the electronic, elastic, and thermodynamic properties of Co-based full-Heusler Co2MnSi and Co2MnGe. The results show that the alloys are half-metallic ferromagnetic. The spin polarization is 97.90% for Co2MnSi, while for Co2MnGe is more than 85.3% below 1000K. The study of elastic constants and their associated parameters predicted that the two alloys are mechanically stable in the temperature range of 0–1000 K. Both alloys are ductile, anisotropic, and characterized by ionic bonds. In addition, Co2MnGe is less hard than Co2MnSi, but the latter is more sensitive to temperature variations than Co2MnGe. The electronic and vibrational contributions to the thermodynamic properties were computed separately in the temperature range of 0 K to 1000 K. The high spin polarization and mechanical stability make these alloys more appropriate for spintronic applications.
2 citations
14 Aug 2022
TL;DR: This paper describes a study that evaluated how well metareasoning can manage a Raspberry Pi 4B’s central processing unit (CPU) temperature while it is performing image processing (object detection and classification) on the Common Objects in Context (COCO) dataset.
Abstract:
Resource-constrained electronic systems are present in many semi- and fully-autonomous systems and are tasked with computationally heavy tasks such as neural network image processing. Without sufficient cooling, these tasks often increase device temperature up to a predetermined maximum, beyond which the task is slowed by the device firmware to maintain the maximum. This is done to avoid decreased processor lifespan due to thermal fatigue or catastrophic processor failure due to thermal overstress. This paper describes a study that evaluated how well metareasoning can manage a Raspberry Pi 4B’s central processing unit (CPU) temperature while it is performing image processing (object detection and classification) on the Common Objects in Context (COCO) dataset. We developed and tested two metareasoning approaches: the first maintains constant image throughput, and the second maintains constant expected detection accuracy. The first approach switched between the InceptionV2 and MobileNetV2 image classification networks with a Single Shot Multibox Detector (SSD) attached. The second approach was tested on each network for a range of parameter values. The study also considered cases that used the system’s built-in throttling method to control the temperature. Both metarea-soning approaches were able to stabilize the device temperature without relying on throttling.
2 citations
01 Jan 2018
TL;DR: This thesis focuses on developing the system level dynamic thermal management technique for real-time systems and presents a thermal framework which can evaluate various thermal managements in a fast manner.
Abstract: As the VLSI technology is scaling to deep sub-micron domain, temperature has become an emerging issue of high importance for real-time systems. In this thesis, we focus on developing the system level dynamic thermal management technique for real-time systems. The main contributions are: 1. An offline thermal management is presented for single core real-time systems. 2. Periodic thermal management is extended to pipeline multicore systems. 3. An online adaptive periodic thermal management is proposed. 4. A thermal framework which can evaluate various thermal managements in a fast manner is presented.
2 citations
Cites background from "The effect of temperature on the re..."
...In additional to above mechanisms, high temperature can also accelerate other several failure mechanisms such as solder joint failures, bond-wire fatigue, electrical overstress, and PCB stress [57]....
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...Next, we list several microprocessors failure mechanisms that can be affected by temperature [57]....
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..., drift due to the effect of temperature [57]....
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Dissertation•
20 May 2016
TL;DR: Cette these porte sur le theme general de la fiabilite des circuits microelectroniques en passant par trois grandes etapes traduites par les trois parties of ce manuscrit.
Abstract: Cette these porte sur le theme general de la fiabilite des circuits microelectroniques. Le but de notre travail fut de developper un outil de simulation multi-physiques pour la conception des circuits integres fiables qui possede les caracteristiques innovatrices suivantes : • (i) L’integration dans un environnement de conception microelectronique standard, tel que l’environnement Cadence® ; • (ii) La possibilite de simulation, sur de longues durees, du comportement des circuits CMOS analogiques en tenant compte du phenomene de vieillissement ; • (iii) La simulation de plusieurs physiques (electrique-thermique-mecanique) couplees dans ce meme environnement de CAO en utilisant la methode de simulation directe. Ce travail de these a ete realise en passant par trois grandes etapes traduites par les trois parties de ce manuscrit.
1 citations
Cites background from "The effect of temperature on the re..."
...Les contraintes mécaniques résultantes peuvent engendrer soit la défaillance directe du circuit si les déformations deviennent très importantes [115, 116], soit la dégradation des caractéristiques électriques à cause de la piézorésistivité de certains matériaux comme le silicium : nous parlons dans ce dernier cas d’un couplage mécanique-électrique, (lien 1 du couplage électromécanique dans la figure 8....
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References
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TL;DR: A review of fourteen solder joint fatigue models is presented in this article with an emphasis on summarizing the features and applications of each fatigue model, and two fatigue model application scenarios are discussed.
487 citations
01 Jan 2012
TL;DR: In some applications, cooling may not be possible, or it may be more appealing for the electronics to operate hot to improve system reliability or reduce cost as discussed by the authors, which presents challenges that affect many aspects of the electronic system, including the silicon, packaging, qualification methodology, and design techniques.
Abstract: Introduction Many industries are calling for electronics that can operate reliably in harsh environments, including extremely high temperatures. Traditionally, engineers had to rely on active or passive cooling when designing electronics that must function outside of normal temperature ranges, but in some applications, cooling may not be possible—or it may be more appealing for the electronics to operate hot to improve system reliability or reduce cost. This choice presents challenges that affect many aspects of the electronic system, including the silicon, packaging, qualification methodology, and design techniques.
104 citations