scispace - formally typeset
Journal ArticleDOI

The future of wires

R. Ho, +2 more
- Vol. 89, Iss: 4, pp 490-504
Reads0
Chats0
TLDR
Wires that shorten in length as technologies scale have delays that either track gate delays or grow slowly relative to gate delays, which is good news since these "local" wires dominate chip wiring.
Abstract
Concern about the performance of wires wires in scaled technologies has led to research exploring other communication methods. This paper examines wire and gate delays as technologies migrate from 0.18-/spl mu/m to 0.035-/spl mu/m feature sizes to better understand the magnitude of the the wiring problem. Wires that shorten in length as technologies scale have delays that either track gate delays or grow slowly relative to gate delays. This result is good news since these "local" wires dominate chip wiring. Despite this scaling of local wire performance, computer-aided design (CAD) tools must still become move sophisticated in dealing with these wires. Under scaling, the total number of wires grows exponentially, so CAD tools will need to handle an ever-growing percentage of all the wires in order to keep designer workloads constant. Global wires present a more serious problem to designers. These are wires that do not scale in length since they communicate signals across the chip. The delay of these wives will remain constant if repeaters are used meaning that relative to gate delays, their delays scale upwards. These increased delays for global communication will drive architectures toward modular designs with explicit global latency mechanisms.

read more

Content maybe subject to copyright    Report

Citations
More filters
Journal ArticleDOI

Networks on chips: a new SoC paradigm

TL;DR: Focusing on using probabilistic metrics such as average values or variance to quantify design objectives such as performance and power will lead to a major change in SoC design methodologies.
Journal ArticleDOI

Device Requirements for Optical Interconnects to Silicon Chips

TL;DR: The current performance and future demands of interconnects to and on silicon chips are examined and the requirements for optoelectronic and optical devices are project if optics is to solve the major problems of interConnects for future high-performance silicon chips.
Journal ArticleDOI

A survey of research and practices of Network-on-chip

TL;DR: The research shows that NoC constitutes a unification of current trends of intrachip communication rather than an explicit new alternative.
Proceedings ArticleDOI

Modeling the effect of technology trends on the soft error rate of combinational logic

TL;DR: An end-to-end model is described and validated that enables us to compute the soft error rates (SER) for existing and future microprocessor-style designs and predicts that the SER per chip of logic circuits will increase nine orders of magnitude from 1992 to 2011 and at that point will be comparable to the SERper chip of unprotected memory elements.
Book ChapterDOI

StreamIt: A Language for Streaming Applications

TL;DR: The StreamIt language provides novel high-level representations to improve programmer productivity and program robustness within the streaming domain and the StreamIt compiler aims to improve the performance of streaming applications via stream-specific analyses and optimizations.
References
More filters
Journal ArticleDOI

Asymptotic waveform evaluation for timing analysis

TL;DR: Asymptotic waveform evaluation (AWE) provides a generalized approach to linear RLC circuit response approximations and reduces to the RC tree methods.
Journal ArticleDOI

Rationale and challenges for optical interconnects to electronic chips

TL;DR: Optical interconnects to silicon CMOS chips are discussed in this paper, where various arguments for introducing optical interconnections to silicon chips are summarized, and the challenges for optical, optoelectronic, and integration technologies are discussed.
Journal ArticleDOI

Inductance calculations in a complex integrated circuit environment

TL;DR: In this paper, a method for calculating multiloop inductances formed by complicated interconnection conductors is described, where the conductor loops are divided into segments for which so-called partial inductances are calculated.
Journal ArticleDOI

FASTHENRY: a multipole-accelerated 3-D inductance extraction program

TL;DR: Results from examples are given to demonstrate that the multipole acceleration can reduce required computation time and memory by more than an order of magnitude for realistic integrated circuit packaging problems.