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Journal ArticleDOI

Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers

01 Aug 2013-Composites Part B-engineering (Elsevier)-Vol. 51, pp 140-147
TL;DR: In this paper, the use of these hybrid fillers was found to be effective for increasing the thermal conductivity of the composite, which was probably due to the enhanced connectivity offered by the structuring filler.
Abstract: Aluminum oxide and aluminum nitride with different sizes were used alone or in combination to prepare thermally conductive polymer composites. The composites were categorized into two systems, one including composites filled with large-sized aluminum nitride and small-sized aluminum oxide particles, and the other including composites filled with large-sized aluminum oxide and small-sized aluminum nitride. The use of these hybrid fillers was found to be effective for increasing the thermal conductivity of the composite, which was probably due to the enhanced connectivity offered by the structuring filler. At a total filler content of 58.4 vol.%, the maximum values of both thermal conductivities in the two systems were 3.402 W/mK and 2.842 W/mK, respectively, when the volume ratio of large particles to small particles was 7:3. This result was represented when the composite was filled with the maximum packing density and the minimum surface area at the same volume content. As such, the proposed thermal model predicted thermal conductivity in good agreement with experimental values.
Citations
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Journal ArticleDOI
TL;DR: In this article, the fundamental design principles of highly thermally conductive composites were discussed and the key factors influencing the thermal conductivity of polymers, such as chain structure, crystallinity, crystal form, orientation of polymer chains, and orientation of ordered domains in both thermoplastics and thermosets were addressed.

1,359 citations

Journal ArticleDOI
TL;DR: Special attention is given to the mechanism of thermal transport, the enhancement of thermal conductivity in polymer nanocomposites/fibers, and their potential application as thermal interface materials.
Abstract: Polymers are usually considered as thermal insulators, and their applications are limited by their low thermal conductivity. However, recent studies have shown that certain polymers have surprisingly high thermal conductivity, some of which are comparable to that in poor metals or even silicon. Here, the experimental achievements and theoretical progress of thermal transport in polymers and their nanocomposites are outlined. The open questions and challenges of existing theories are discussed. Special attention is given to the mechanism of thermal transport, the enhancement of thermal conductivity in polymer nanocomposites/fibers, and their potential application as thermal interface materials.

431 citations

Journal ArticleDOI
TL;DR: In this paper, a highly efficient phenylphosphonate-based flame-retardant epoxy resin (FREP) was firstly prepared from PPDCl and allylamine (AA), and functionalized graphite nanoplatelets (fGNPs) fillers were then performed to fabricate the fGNPs/FREP nanocomposites via mixing followed by casting method.

332 citations


Additional excerpts

  • ...To the best of our knowledge, the addition of single thermally conductive fillers (such as SiO2 [6], Al2O3 [10], ZrB2 [11], BN [12e14], AlN [15], SiC [16], Si3N4 [17], Si3N4 nanowire [18], silica nanofibers [19], CNTs [20,21], boron nitride nanotube [22], graphite [23], graphite nanoplatelets [24,25], graphene oxide [26], graphene [27,28], etc.) or hybrid thermally conductive fillers (such as Al2O3/ AlN [29], AlN/BN [30], AlN/MWCNTs [31,32], Cu/MWCNTs [33], SiO2/graphene oxide [34,35], BN/graphene oxide [7], graphite nanoplatelets/SiC [36], graphite nanoplatelets/CNTs [37], nano silica/AgNWs [38], etc.) into epoxy matrix could enhance the thermal conductivities of the epoxy composites....

    [...]

  • ...) or hybrid thermally conductive fillers (such as Al2O3/ AlN [29], AlN/BN [30], AlN/MWCNTs [31,32], Cu/MWCNTs [33], SiO2/graphene oxide [34,35], BN/graphene oxide [7], graphite nanoplatelets/SiC [36], graphite nanoplatelets/CNTs [37], nano silica/AgNWs [38], etc....

    [...]

Journal ArticleDOI
15 Sep 2017-Polymers
TL;DR: The mechanisms of thermal conduction, the recent advances, and the influencing factors on graphene-polymer composites (GPC) are reviewed and guidance on the preparation of composites with high thermal conductivity is provided.
Abstract: With the integration and miniaturization of electronic devices, thermal management has become a crucial issue that strongly affects their performance, reliability, and lifetime. One of the current interests in polymer-based composites is thermal conductive composites that dissipate the thermal energy produced by electronic, optoelectronic, and photonic devices and systems. Ultrahigh thermal conductivity makes graphene the most promising filler for thermal conductive composites. This article reviews the mechanisms of thermal conduction, the recent advances, and the influencing factors on graphene-polymer composites (GPC). In the end, we also discuss the applications of GPC in thermal engineering. This article summarizes the research on graphene-polymer thermal conductive composites in recent years and provides guidance on the preparation of composites with high thermal conductivity.

265 citations

Journal ArticleDOI
01 Feb 2019-Carbon
TL;DR: In this paper, the authors introduce the thermal conduction mechanism in the bulk polymer, crystalline particles, and carbon-based polymer composites, and review recent studies of carbon nanotube- or graphene-based interfacial thermal materials.

229 citations

References
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Journal ArticleDOI
TL;DR: An idealized experimental study of particle packing was made as mentioned in this paper, where spherical metal shot of several discrete, narrow size ranges was efficiently packed in glass containers by mechanical vibration, and the significance and utility of this work to the ceramic and other industries was discussed.
Abstract: An idealized experimental study of particle packing was made. Spherical metal shot of several discrete, narrow size ranges was efficiently packed in glass containers by mechanical vibration. Packing arrangements and the dynamic process of packing were studied visually. One-size spheres packed in an orthorhombic arrangement with a density 62.5% of theoretical density. Forming of high-density multicomponent packings was shown to require at least a sevenfold difference between sphere sizes of the individual components. A quaternary packing with a density 95.1% of theoretical density was formed from spheres with diameter ratios 1:7:38:316 and volume compositions 6.1:10.2:23.0:60.7%, respectively. Such packings could be poured from their glass containers, thus proving that effective mechanical packing is simply an efficient arrangement of spheres of prescribed sizes and proportions. The significance and utility of this work to the ceramic and other industries is discussed.

869 citations

Journal ArticleDOI
TL;DR: In this paper, various inorganic fillers including aluminum nitride (AlN), wollastonite, silicon carbide whisker (SiC), and boron nitride(BN) with different shape and size were used alone or in combination to prepare thermally conductive polymer composites.
Abstract: This study aims at investigating package materials based on polymer matrix for microelectronics. The next generation package materials are expected to possess high heat dissipation capability in addition to low coefficient of thermal expansion (CTE) as the accumulated heat from high performance electronic devices should be removed for proper operation. In this study, various inorganic fillers including aluminum nitride (AlN), wollastonite, silicon carbide whisker (SiC) and boron nitride (BN) with different shape and size were used alone or in combination to prepare thermally conductive polymer composites. In case of AlN, titanate coupling agent was used for the surface treatment of fillers. The use of hybrid filler was found to be effective in increasing thermal conductivity of the composite probably due to the enhanced connectivity offered by structuring filler with high aspect ratio in hybrid filler. For given filler loading, the use of larger particle and surface treated filler resulted in composite materials with enhanced thermal conductivity. The surface treatment of filler also allowed producing the composites with lower CTE.

733 citations

Journal ArticleDOI
TL;DR: A thermal conductivity of 325 W/mK was achieved for a boron nitride-filled polybenzoxazine at its maximum filler loading of 785% by volume (88% by weight) as discussed by the authors.

445 citations

Journal ArticleDOI
TL;DR: In this paper, the effect of Al2O3 or ZnO fillers on the thermal conductivity and coefficient of thermal expansion (CTE) of the silicone rubber was investigated.

439 citations

Journal ArticleDOI
TL;DR: A new thermally conductive polyimide composite film has been developed based on a dispersion of different particle sizes of boron nitride (BN) in apolyimide (PI) precursor, polyamic acid (PAA).
Abstract: A new thermally conductive polyimide composite film has been developed. It is based on a dispersion of different particle sizes of boron nitride (BN) in a polyimide (PI) precursor, polyamic acid (P...

388 citations