Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices
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"Thermal Design and Cooling Performa..." refers background in this paper
...Like other high-power PEDs, the insulated gate bipolar transistor (IGBT) module in dynamic reactive power compensation systems also has thermal design requirements [8, 9]....
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"Thermal Design and Cooling Performa..." refers methods in this paper
...Focusing on the high-power electronic equipment metal–oxide–semiconductor field-effect transistor (MOSFET), Fukue [20] ignored the off-state leakage current loss and drive loss, measured the steady-state power dissipation of the device, and selected the ideal radiator parameters on Simcenter Flotherm....
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"Thermal Design and Cooling Performa..." refers background in this paper
...These trends pose immense challenges to the reliability design of the equipment, and the thermal design and management of the next-generation electronic systems [1-3]....
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1 citations
"Thermal Design and Cooling Performa..." refers background in this paper
...Thus, it is especially important to make a reasonable and effective cooling design for electronic equipment [11-14]....
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