Journal ArticleDOI
Thermal Design of Immersion Cooling Modules for Electronic Components
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TLDR
In this paper, a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules is presented, with a focus on the operational limits and relations for predicting the performance of submerged condensers.Abstract:
Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.read more
Citations
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Proceedings ArticleDOI
Design of a candidate thermal control system for a cryogenically cooled computer
TL;DR: The thermal aspects of an immersion-cooled computer designed to operate at cryogenic temperatures are discussed in detail in this paper, including the selection of a working fluid, the determination of the mode, or modes, of heat transfer to be used, and the selection, or development, of any required heat transfer correlations.
Journal ArticleDOI
Bibliography of Heat Transfer in Electronic Equipment
V. Antonetti,R. Simons +1 more
TL;DR: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented in this paper, covering the period from 1970-1984, although a majority of the papers listed were published in the last three years.
Journal ArticleDOI
Convective Immersion Cooling of Parallel Vertical Plates
A. Bar-Cohen,H. Schweitzer +1 more
TL;DR: In this paper, the authors provide an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.
Proceedings ArticleDOI
The development of advanced cooling methods for high-power electronics
Journal ArticleDOI
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Omidreza Ghaffari,Wei Tong,Yaser Nabavi Larimi,Chady Al Sayed,Alireza Ganjali,Jean-Francois Morissette,Francis Grenier,Simon Jasmin,Luc G. Fréchette,Julien Sylvestre +9 more
TL;DR: In this paper, the authors investigated the effect of heat spreading on the boiling of the Novec 649™ for two-phase immersion cooling of electronics and found that the critical heat flux (CHF) happened at a heat flux of 17.4±0.8 W/cm2.
References
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Journal ArticleDOI
Condensation heat transfer in the presence of noncondensables, interfacial resistance, superheating, variable properties, and diffusion
TL;DR: In this article, a wide-ranging analytical investigation of laminar film condensation is presented, which includes interfacial resistance, superheating, free convection due to both temperature and concentration gradients, mass diffusion and thermal diffusion, and variable properties in both the liquid and the gas-vapor regions.
Journal ArticleDOI
Laminar film condensation on the underside of horizontal and inclined surfaces
Joseph Gerstmann,Peter Griffith +1 more
TL;DR: In this paper, heat transfer rates in laminar film condensation on the underside of horizontal and inclined surfaces are predicted by assuming the condensate flow to be the quasi-steady result of a bounded instability.
Journal ArticleDOI
Critical heat flux of saturated natural convection boiling in a space bounded by two horizontal co-axial disks and heated from below
Yoshiro Katto,Y. Kosho +1 more