Journal ArticleDOI
Thermal Design of Immersion Cooling Modules for Electronic Components
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TLDR
In this paper, a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules is presented, with a focus on the operational limits and relations for predicting the performance of submerged condensers.Abstract:
Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.read more
Citations
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Patent
Gas-liquid forced turbulence cooling
TL;DR: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation as mentioned in this paper.
Journal ArticleDOI
Transient Thermal Bubble Formation on Polysilicon Micro-Resisters
Jr-Hung Tsai,Liwei Lin +1 more
TL;DR: In this paper, the authors investigated the transient bubble formation on polysilicon micro-resisters having dimensions of 95 μm in length, 10 μm or 5 µm in width, and 0.5 μm thickness.
Journal ArticleDOI
Single and two-phase pressure drop characteristics in miniature helical channels
R. Scott Downing,Gunol Kojasoy +1 more
TL;DR: In this paper, the authors used forced convective boiling in a cold-plate containing multiple miniature heat exchangers to develop heat transfer and pressure drop correlations valid for the flow conditions expected in miniature coldplate technology, experiments were conducted with R-134a as a working fluid.
Journal ArticleDOI
Film Boiling Incipience at the Departure From Natural Convection on Flat, Smooth Surfaces
TL;DR: In this article, a flat, smooth surface immersed in saturated highly wetting liquids, FC-72 and FC-87, is used as a heat transfer surface, simulating a microelectronic chip surface.
References
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Journal ArticleDOI
Preparation and Performance of Dendritic Heat Sinks
S. Oktay,A. F. Schmeckenbecher +1 more
Journal ArticleDOI
An Evaporative-Gravity Technique for Airborne Equipment Cooling
M. Mark,M. Stephenson,C. Goltsos +2 more
TL;DR: In this article, the development and design of an evaporative system utilizing gravity return flow is discussed, and the test results of such a system are compared with those obtained utilizing a conventional metallic conductive paths technique.
Book ChapterDOI
Operational limits of a submerged condenser
TL;DR: In this article, the operating characteristics of an experimental submerged condenser system are described and related to specific operational modes, and the relevant thermal transport mechanism is examined and shown to accurately define the upper and lower bounds of system operation.
Dissertation
Boiling and condensation in a liquid-filled enclosure,
TL;DR: Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1971 as discussed by the authors, Massachusetts State University, Boston, Massachusetts, U.S.