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Journal ArticleDOI

Thermal performance and friction factor of a cylindrical microchannel heat sink cooled by Cu-water nanofluid

TL;DR: In this paper, the effect of nanoparticle mass fraction and Re on local convective heat transfer coefficients, and the local Nusselt number was also studied. But the experimental results showed that increased mass fraction of nanoparticles from 0.05 to 0.3 wt% resulted in lower thermal resistances of up to 21%.
About: This article is published in Applied Thermal Engineering.The article was published on 2016-04-25. It has received 96 citations till now. The article focuses on the topics: Enhanced heat transfer & Heat transfer coefficient.
Citations
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Journal ArticleDOI
TL;DR: In this article, the authors present a critical review of heat transfer applications of nanofluids, including radiators, circular tube heat exchangers, plate heat exchanger, shell and tube heat exchange, and heat sinks.
Abstract: This paper presents a critical review of heat transfer applications of nanofluids. The effects of nanoparticle concentration, size, shape, and nanofluid flow rate on Nusselt number, heat transfer coefficient, thermal conductivity, thermal resistance, friction factor and pressure drop from numerous studies reported recently are presented. Effects of various geometric parameters on heat transfer enhancement of system using nanofluids have also been reviewed. Heat transfer devices covered in this paper include radiators, circular tube heat exchangers, plate heat exchangers, shell and tube heat exchangers and heat sinks. Various correlations used for experimental validation or developed in reviewed studies are also compiled, compared and analyzed. The pros and cons associated to the applications of nanofluids in heat transfer devices are presented in details to determine the future direction of research in this arena.

388 citations

Journal ArticleDOI
TL;DR: In this paper, the authors seek the attention of young scholars and experts working in the field of heat transfer by discussing the applications and challenges of hybrid nanofluids with a concise discussion on its history, synthesis techniques, thermophysical properties, research gaps, future directions, current status, and the leading groups, organizations and countries around the world.

312 citations

Journal ArticleDOI
TL;DR: In this paper, a comprehensive and systematic approach was used to determine toxicity and fate of several Cu nanoparticles (Cu NPs) when used as pesticides in agriculture, using high throughput assays.

265 citations


Cites background from "Thermal performance and friction fa..."

  • ...…Ng, 2015; Kharisov and Kharissova, 2010; Tsai et al., 2015; Gopalan et al., 2016) or heat transfer fluids (Park et al., 2015; Montes et al., 2015; Azizi et al., 2016; Rizwan-ul-Haq et al., 2016), but the use of nano-Cu is rapidly expanding into novel applications such as catalysts in organic…...

    [...]

  • ...The highly conductive elemental copper (Cu(0) or nCu) can promote electron transfers (Azizi et al., 2016; Hussain et al., 2015; Yousef et al., 2015; Kind et al., 2012; Athawale et al., 2005)....

    [...]

Journal ArticleDOI
TL;DR: A comprehensive assessment of nanofluids' applications in various microchannel geometries and shows ever-increasing importance of nan ofluids applications in microchannels.

182 citations


Cites background from "Thermal performance and friction fa..."

  • ...8 Azizi et al. 2016 [67] Experimental Cylinderical Laminar b900 Water CuO 25 0.05–0.3 wt –...

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  • ...2016 [67] Experimental Cylinderical Laminar b900 Water CuO 25 0....

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Journal ArticleDOI
TL;DR: In this paper, a new cooling technique for low concentrated photovoltaic-thermal (LCPV/T) systems is developed using a microchannel heat sink with nanofluids.

165 citations

References
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Book
11 Sep 1985
TL;DR: This paper introduced the physical effects underlying heat and mass transfer phenomena and developed methodologies for solving a variety of real-world problems, such as energy minimization, mass transfer, and energy maximization.
Abstract: This undergraduate-level engineering text introduces the physical effects underlying heat and mass transfer phenomena and develops methodologies for solving a variety of real-world problems.

13,209 citations

Book
01 Jan 2008

11,281 citations

Journal ArticleDOI
TL;DR: The material presented in this paper covers the method of describing the uncertainties in an engineering experiment and the necessary background material, as well as a technique for numerically executing uncertainty analyses when computerized data interpretation is involved.

6,868 citations

Journal ArticleDOI
TL;DR: In this article, an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat-transfer fluids, which are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluid, and they represent the best hope for enhancing heat transfer.
Abstract: Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids that are required in many industrial applications. In this paper we propose that an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat transfer fluids. The resulting {open_quotes}nanofluids{close_quotes} are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluids, and they represent the best hope for enhancement of heat transfer. The results of a theoretical study of the thermal conductivity of nanofluids with copper nanophase materials are presented, the potential benefits of the fluids are estimated, and it is shown that one of the benefits of nanofluids will be dramatic reductions in heat exchanger pumping power.

4,634 citations

Journal ArticleDOI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Abstract: The problem of achieving compact, high-performance forced liquid cooling of planar integrated circuits has been investigated. The convective heat-transfer coefficient h between the substrate and the coolant was found to be the primary impediment to achieving low thermal resistance. For laminar flow in confined channels, h scales inversely with channel width, making microscopic channels desirable. The coolant viscosity determines the minimum practical channel width. The use of high-aspect ratio channels to increase surface area will, to an extent, further reduce thermal resistance. Based on these considerations, a new, very compact, water-cooled integral heat sink for silicon integrated circuits has been designed and tested. At a power density of 790 W/cm2, a maximum substrate temperature rise of 71°C above the input water temperature was measured, in good agreement with theory. By allowing such high power densities, the heat sink may greatly enhance the feasibility of ultrahigh-speed VLSI circuits.

4,214 citations