Thermal spreading resistance in multilayered contacts : Applications in thermal contact resistance

TLDR: In this paper, a solution for computing the thermalspreading resistance of planarcircular contact surfaces is presented, where a model is developed to compute the contact conductance between a bare substrate and a coated substrate.

Abstract: Application of highly conductive coatings to contacting surfaces is a commonly employed method to enhance thermal contact conductance. In many applications it is often necessary to apply an intermediate coating such that the conductive coating may be applied to a nonadhering substrate. In these instances, it is desirable to predict the effect that the intermediate and e nal coatings have on the spreading resistance. A solution for computing the thermalspreading resistanceofa planarcircularcontactona doubly coatedsubstrateispresented.Also,a modelis developed to compute the contact conductance between a bare substrate and a coated substrate. Comparisons are made with data obtained in the literature for which no analytical model was available. Solution of the governing equations and numerical computation of the spreading resistance were obtained using computer algebra systems. Nomenclature Ac; At; Aa = area, m 2 Ain; Bin = Fourier‐Bessel coefe cients a;b = two radii with a < b, m CL = spreading correction factor e = natural log base Hc = contact microhardness, MPa hc = contact conductance, W/m 2 K J0.x/