Journal ArticleDOI
Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates
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TLDR
In this paper, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.Abstract:
While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.read more
Citations
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Book ChapterDOI
Thermal Control of Electronic Equipment and Devices
G. P. Peterson,Alfonso Ortega +1 more
TL;DR: The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones on the thermal control of semiconductor devices, modules, and total systems.
Journal ArticleDOI
The optimal spacing of parallel plates cooled by forced convection
Adrian Bejan,Enrico Sciubba +1 more
TL;DR: In this paper, the optimal board-to-board spacing and maximum total heat transfer rate from a stack of parallel boards cooled by laminar forced convection was reported. But the optimal spacing is not directly related to the surface thermal condition.
Journal ArticleDOI
Chip cooling with integrated carbon nanotube microfin architectures
Krisztian Kordas,Geza Toth,P. Moilanen,M. Kumpumäki,Jouko Vähäkangas,Antti Uusimäki,Robert Vajtai,Pulickel M. Ajayan +7 more
TL;DR: In this paper, an efficient cooling of silicon chips using microfin structures made of aligned multi-walled carbon nanotube arrays is achieved, which enable power dissipation from the heated chips on the level of modern electronics demands.
Journal ArticleDOI
Optimal tree-shaped networks for fluid flow in a disc-shaped body
TL;DR: In this paper, a large number of optimized dendritic flow structures that occupy a disc-shaped area of radius R are presented, where the flow is laminar and fully developed in every tube.
Journal ArticleDOI
Double skin facades (DSF) and building integrated photovoltaics (BIPV): A review of configurations and heat transfer characteristics
TL;DR: In this paper, the state of the knowledge on the thermal analysis of double skin facades with integrated photovoltaic panels called the Building Integrated Photovoltaics (BIPV) in terms of the published studies carried out on these systems is presented.