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Journal ArticleDOI

Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

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TLDR
In this paper, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.
Abstract
While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.

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Book ChapterDOI

Thermal Control of Electronic Equipment and Devices

TL;DR: The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones on the thermal control of semiconductor devices, modules, and total systems.
Journal ArticleDOI

The optimal spacing of parallel plates cooled by forced convection

TL;DR: In this paper, the optimal board-to-board spacing and maximum total heat transfer rate from a stack of parallel boards cooled by laminar forced convection was reported. But the optimal spacing is not directly related to the surface thermal condition.
Journal ArticleDOI

Chip cooling with integrated carbon nanotube microfin architectures

TL;DR: In this paper, an efficient cooling of silicon chips using microfin structures made of aligned multi-walled carbon nanotube arrays is achieved, which enable power dissipation from the heated chips on the level of modern electronics demands.
Journal ArticleDOI

Optimal tree-shaped networks for fluid flow in a disc-shaped body

TL;DR: In this paper, a large number of optimized dendritic flow structures that occupy a disc-shaped area of radius R are presented, where the flow is laminar and fully developed in every tube.
Journal ArticleDOI

Double skin facades (DSF) and building integrated photovoltaics (BIPV): A review of configurations and heat transfer characteristics

TL;DR: In this paper, the state of the knowledge on the thermal analysis of double skin facades with integrated photovoltaic panels called the Building Integrated Photovoltaics (BIPV) in terms of the published studies carried out on these systems is presented.