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Journal ArticleDOI

Thermionic trap-assisted tunneling model and its application to leakage current in nitrided oxides and AlGaN∕GaN high electron mobility transistors

D. Mahaveer Sathaiya, +1 more
- 11 May 2006 - 
- Vol. 99, Iss: 9, pp 093701
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TLDR
In this paper, two models of electron tunneling from metal to a semiconductor via traps are proposed, one called generalized thermionic trap-assisted tunneling (GTTT) and the other one called thermionic trapped-assisted tunnelling (TTT).
Abstract
We propose two models of electron tunneling from metal to a semiconductor via traps. In addition to the electrons below the metal Fermi level, the models also include the thermally activated electrons above the Fermi level. The first model is called generalized thermionic trap-assisted tunneling (GTTT), which considers tunneling through both triangular and trapezoidal barriers present in metal insulator semiconductor (MIS) structures. The second model is called thermionic trap-assisted tunneling (TTT), which considers tunneling through triangular barriers present in modern Schottky junctions. The GTTT model is shown to predict the low field leakage currents in MIS structures with nitrided oxide as insulator, and the TTT model is shown to predict the reverse gate leakage in AlGaN∕GaN high electron mobility transistors.

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Citations
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Journal ArticleDOI

Deep-Level Characterization in GaN HEMTs-Part I: Advantages and Limitations of Drain Current Transient Measurements

TL;DR: In this paper, the advantages and limitations of the current-transient methods used for the study of the deep levels in GaN-based high-electron mobility transistors (HEMTs), by evaluating how the procedures adopted for measurement and data analysis can influence the results of the investigation.
Journal ArticleDOI

Ferroelectric polarization-leakage current relation in high quality epitaxial Pb ( Zr , Ti ) O 3 films

TL;DR: Stolichnov et al. as discussed by the authors showed that the voltage behavior of the leakage current has a minor dependence on thickness, which rules out the space-charge limited currents as main leakage source.
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Analysis of metal-oxide-based charge generation layers used in stacked organic light-emitting diodes

TL;DR: In this paper, the authors studied electron and hole injection in MoO3 charge generation layers (CGLs) commonly used for establishing balanced injection in multilayer stacked organic light-emitting diodes (SOLEDs).
Journal ArticleDOI

Temperature-dependent forward gate current transport in atomic-layer-deposited Al2O3/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor

TL;DR: In this article, the mechanisms of the temperature-dependent forward gate current transport in the atomic-layer-deposited Al2O3/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistor (MISHEMT) were investigated.
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a-SiNx:H-based ultra-low power resistive random access memory with tunable Si dangling bond conduction paths

TL;DR: The introduction of hydrogen in the a-SiNx:H layer provides a new way to control the Si dangling bond conduction paths, and thus opens up a research field for ultra-low power Si-based RRAM.
References
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Journal ArticleDOI

Large Gate Leakage Current in AlGaN/GaN High Electron Mobility Transistors

TL;DR: In this paper, a large gate leakage current in AlGaN/GaN high electron mobility transistors (HEMTs) was observed, and ECR plasma treatment before the gate metal deposition was reduced by two to three orders of magnitude.
Journal ArticleDOI

Simplified closed‐form trap‐assisted tunneling model applied to nitrided oxide dielectric capacitors

TL;DR: In this paper, a simplified closed-form trap-assisted tunneling model was employed that produces a fit to the data with a trap depth of 2.1 eV. The difference between this trap model and a model requiring numerical integration was negligibly small (∼2%).
Journal ArticleDOI

A model of the stress induced leakage current in gate oxides

TL;DR: In this article, a new quantitative model of the stress induced leakage current (SILC) in MOS capacitors with thin oxide layers has been developed by assuming the inelastic trap-assisted tunneling as the conduction mechanism.
Journal ArticleDOI

On the resolution of the mechanism for reverse gate leakage in AlGaN/GaN HEMTs

TL;DR: In this paper, the reverse gate leakage mechanism in AlGaN/GaN high-electron mobility transistors (HEMTs) based on two-dimensional (2D) simulation and analysis is resolved.
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