Book•
Thin Film Materials: Stress, Defect Formation and Surface Evolution
02 Feb 2004-
TL;DR: The role of stress in mass transport is discussed in this article, where the authors consider anisotropic and patterned films, buckling, bulging, peeling and fracture.
Abstract: 1. Introduction and overview 2. Film stress and substrate curvature 3. Stress in anisotropic and patterned films 4. Delamination and fracture 5. Film buckling, bulging and peeling 6. Dislocation formation in epitaxial systems 7. Dislocation interactions and strain relaxation 8. Equilibrium and stability of surfaces 9. The role of stress in mass transport.
Citations
More filters
TL;DR: In this article, an introduction to TBCs is presented, where complex, multi-layer evolving systems touch on several known phenomena in materials science and engineering, and the major challenges to improved coating development and the rich opportunities for materials research are discussed.
Abstract: Gas-turbine engines used in transportation, energy, and defense sectors rely on high-temperature thermal-barrier coatings (TBCs) for improved efficiencies and power. The promise of still higher efficiencies and other benefits is driving TBCs research and development worldwide. An introduction to TBCs—complex, multi-layer evolving systems—is presented, where these fascinating systems touch on several known phenomena in materials science and engineering. Critical elements identified as being important to the development of future TBCs form the basis for the five articles in this issue of MRS Bulletin. These articles are introduced, together with a discussion of the major challenges to improved coating development and the rich opportunities for materials research they provide.
1,034 citations
TL;DR: In this paper, the effect of biaxial strain on the properties of epitaxial ferroelectric thin films and superlattices is discussed. But the results for single-layer thin films are not discussed.
Abstract: Predictions and measurements of the effect of biaxial strain on the properties of epitaxial ferroelectric thin films and superlattices are reviewed. Results for single-layer ferroelectric films of biaxially strained SrTiO3, BaTiO3, and PbTiO3 as well as PbTiO3/SrTiO3 and BaTiO3/SrTiO3 superlattices are described. Theoretical ap- proaches, including first principles, thermodynamic analysis, and phase-field models, are applied to these biaxially strained materials, the assumptions and limitations of each technique are explained, and the predictions are compared. Measurements of the effect of biax- ial strain on the paraelectric-to-ferroelectric transition temperature (TC) are shown, demonstrating the ability of percent-level strains to shift TC by hundreds of degrees in agreement with the predic- tions that predated such experiments. Along the way, important ex- perimental techniques for characterizing the properties of strained ferroelectric thin films and superlattices, as well as appropriate sub- strates on which to grow them, are mentioned.
957 citations
TL;DR: In this paper, an overview of the principal deformation mechanisms of ultra-strength materials is presented, and the fundamental defect processes that initiate and sustain plastic flow and fracture are described, as well as the mechanics and physics of both displacive and diffusive mechanisms.
701 citations
TL;DR: In this paper, a modified form of the Stoney equation, well known for elastic isotropic substrates, is derived for Si(001) and Si(111) wafers, using the elastic stiffness constants of silicon, cij, instead of the orientation averaged values E and ν, which do not have a meaning for elastically anisotropic single crystal materials.
563 citations
TL;DR: In this paper, in situ measurements of stress evolution in a silicon thin-film electrode during electrochemical lithiation and delithiation by using the multi-beam optical sensor (MOS) technique are reported.
559 citations
Cites methods from "Thin Film Materials: Stress, Defect..."
...ntilever beam-bending method, in which curvature of the JOURNAL OF POWER SOURCES, 195(15), 5062-5066 2010 2 substrate is used to calculate stress in a film deposited on it through the Stoney equation [12,13]. Some of these studies [3,5,7] were conducted on electrode materials for lithium-ion batteries, primarily the cathode. However, none of them have gone beyond reporting stress evolution; and no attemp...
[...]
References
More filters
TL;DR: In this paper, the authors used a Berkovich indenter to determine hardness and elastic modulus from indentation load-displacement data, and showed that the curve of the curve is not linear, even in the initial stages of the unloading process.
Abstract: The indentation load-displacement behavior of six materials tested with a Berkovich indenter has been carefully documented to establish an improved method for determining hardness and elastic modulus from indentation load-displacement data. The materials included fused silica, soda–lime glass, and single crystals of aluminum, tungsten, quartz, and sapphire. It is shown that the load–displacement curves during unloading in these materials are not linear, even in the initial stages, thereby suggesting that the flat punch approximation used so often in the analysis of unloading data is not entirely adequate. An analysis technique is presented that accounts for the curvature in the unloading data and provides a physically justifiable procedure for determining the depth which should be used in conjunction with the indenter shape function to establish the contact area at peak load. The hardnesses and elastic moduli of the six materials are computed using the analysis procedure and compared with values determined by independent means to assess the accuracy of the method. The results show that with good technique, moduli can be measured to within 5%.
22,557 citations
Book•
01 Jan 2000
TL;DR: The Stress Analysis of Cracks Handbook as mentioned in this paper provides a comprehensive, easy-to-access collection of elastic stress solutions for crack configurations, along with other relevant information, such as displacements, crack opening areas, basic stress functions source references, accuracy of solutions, and more.
Abstract: Nearly double the size of the previous edition, the third edition of this classic reference provides a comprehensive, easy-to-access collection of elastic stress solutions for crack configurations. For each configuration, The Stress Analysis of Cracks Handbook present crack tip stress intensity formulas along with other relevant information, such as displacements, crack opening areas, basic stress functions source references, accuracy of solutions, and more. Throughout, it stresses formulas for application to test configurations. The introductory section details the methods of developing the informatio A series of appendices represents special methods and special applications. Now in a hardbound format, the current Handbook offers a number of new features including: * Ne Stress Solutions * Cracked Configurations * Plates with Pinching Loads * Dislocations and Cracks Solutions * Plastic Zone Instability (Expanding a Potentially Interceding "Elastic" Failure Mechanism) * Estimation Methods for Stress Intensity Formulas * J-Integral Methods * Pure Shear Plasticity Solutions. The authors provide 30 new solution pages, plus modifications of older solutions. Contents Include: * Introductory Information Stress Analysis Results for Common Test Specimen Configurations with Cracks * Cracks Along a Single Line * Parallel Cracks * Cracks and Holes or Notches * Curved, Angled, Branched, or Radiating Cracks * Cracks in Reinforced Plates * Three-Dimensional Cracked Configurations * Crack(s) in a Rod or a Plate by Energy Rate Analysis * Strip Yield Model Solutions * Cracks(s) in a Shell * Appendices.
5,374 citations
"Thin Film Materials: Stress, Defect..." refers background or methods in this paper
...In order to provide a mechanistic basis for the e®ect of grain size on ̄lm yield stress, Thompson (1993) suggested that the deposition of segments of a surface-nucleated dislocation loop (such as that described in Section 6....
[...]
...The number ce = 1:1215 is a well-established numerical coe±cient that arises in describing the crack tip singularity of an edge crack in elastic fracture mechanics (Tada et al. 1985)....
[...]
...edge cracks normal to the free edge of a solid under plane strain conditions is given in graphical form by Tada et al. (1985). This result can be ̄t to any desired degree of accuracy by use of elementary functions, and then integrated to obtain Wm according to (4....
[...]
...From elastic fracture mechanics (Tada et al. 1985), it is known that G( ́) is given approximately by...
[...]
5,246 citations
Book•
01 Jan 1973
TL;DR: In this article, the authors apply the material developed in the Volume One to various boundary value problems (reflection and refraction at plane surfaces, composite media, waveguides and resonators).
Abstract: This work, part of a two-volume set, applies the material developed in the Volume One to various boundary value problems (reflection and refraction at plane surfaces, composite media, waveguides and resonators). The text also covers topics such as perturbation and variational methods.
5,211 citations
TL;DR: A model potential-energy function comprising both two- and three-atom contributions is proposed to describe interactions in solid and liquid forms of Si, suggesting a temperature-independent inherent structure underlies the liquid phase, just as for ``simple'' liquids with only pair interactions.
Abstract: A model potential-energy function comprising both two- and three-atom contributions is proposed to describe interactions in solid and liquid forms of Si. Implications of this potential are then explored by molecular-dynamics computer simulation, using 216 atoms with periodic boundary conditions. Starting with the diamond-structure crystal at low temperature, heating causes spontaneous nucleation and melting. The resulting liquid structurally resembles the real Si melt. By carrying out steepest-descent mappings of system configurations onto potential-energy minima, two main conclusions emerge: (1) a temperature-independent inherent structure underlies the liquid phase, just as for ``simple'' liquids with only pair interactions; (2) the Lindemann melting criterion for the crystal apparently can be supplemented by a freezing criterion for the liquid, where both involve critical values of appropriately defined mean displacements from potential minima.
4,345 citations