Thin Flexible Thermal Ground Planes: Fabrication and Scaling Characterization
25 Sep 2015-IEEE\/ASME Journal of Microelectromechanical Systems (IEEE)-Vol. 24, Iss: 6, pp 2040-2048
TL;DR: In this article, the authors developed flexible thermal ground planes (TGPs) with an ultra-thin thickness of 0.5 mm using copper-cladded polyimide as the encasing material, woven copper mesh as a wick, and electroplated copper pillars to support a vapor core.
Abstract: Thermal ground planes (TGPs) are passive thermal management devices that utilize the latent heat associated with phase change to achieve high effective thermal conductance, similar to heat pipes. In this paper, we develop flexible TGPs with an ultra-thin thickness of 0.5 mm using copper-cladded polyimide as the encasing material, woven copper mesh as a wick, and electroplated copper pillars to support a vapor core. The lowest thermal resistance of one TGP is characterized to be only 1/3 that of an equivalently sized copper heat spreader. The effects of size scaling of evaporator and condenser, and overall TGP sizes on the thermal resistances of TGPs are experimentally characterized. A simple series thermal resistance model, which accounts for vapor core thermal resistance, is developed to predict the measured results. This experimentally validated model can be used for the design of TGPs with varying sizes of evaporator and condenser, and overall size. [2015-0032]
Citations
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References
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01 Jan 1966TL;DR: In this article, the echangeurs de : chaleur, couche de : limite, modeles de : turbulence, transfert de masse reference record created on 2005-11-18, modified on 2016-08-08
Abstract: Keywords: echangeurs de : chaleur ; couche : limite ; modeles de : turbulence ; transfert de masse Reference Record created on 2005-11-18, modified on 2016-08-08
4,465 citations
02 Apr 2007
3,356 citations
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"Thin Flexible Thermal Ground Planes..." refers methods in this paper
...The thermophysical properties of μv , ρv , hfg, and dT/d P can be found as a function of temperature for example by the NIST thermophysical properties calculator REFPROP [24]....
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243 citations
"Thin Flexible Thermal Ground Planes..." refers background in this paper
...Heat pipes have been used as passive thermal management solutions for cooling hot spots in electronic systems since the 1980s [1] ....
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110 citations
"Thin Flexible Thermal Ground Planes..." refers background in this paper
...on a resistance model uses the assumption that the vapor is isothermal [16]....
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...cores and high powers of heat pipes tested in reference [16], but might be incorrect for thin TGPs using low powers....
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