Ultra-Narrow Silicon Nanowire Gate-All-Around CMOS Devices: Impact of Diameter, Channel-Orientation and Low Temperature on Device Performance
01 Dec 2006-pp 1-4
TL;DR: Fully CMOS compatible silicon-nanowire (SiNW) gate-all-around (GAA) n- and p-MOS transistors are fabricated with nanowire channel in different crystal orientations and characterized at various temperatures down to 5K as mentioned in this paper.
Abstract: Fully CMOS compatible silicon-nanowire (SiNW) gate-all-around (GAA) n- and p-MOS transistors are fabricated with nanowire channel in different crystal orientations and characterized at various temperatures down to 5K. SiNW width is controlled in 1 nm steps and varied from 3 to 6 nm. Devices show high drive current (2.4 mA/mum for n-FET, 1.3 mA/mum for p-FET), excellent gate control, and reduced sensitivity to temperature. Strong evidences of carrier confinement are noticed in term of Id-Vg oscillations and shift in threshold voltage with SiNW diameter. Orientation impact has been investigated as well
Citations
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TL;DR: In this paper, the authors demonstrate vertical Ge gate-all-around (GAA) nanowire pMOSFETs fabricated with a CMOS compatible top-down approach.
Abstract: In this work, we demonstrate vertical Ge gate-all-around (GAA) nanowire pMOSFETs fabricated with a CMOS compatible top-down approach. Vertical Ge nanowires with diameters down to 20 nm and an aspect ratio of ~11 were achieved by optimized Cl2-based dry etching and self-limiting digital etching. Employing a GAA architecture, post-oxidation passivation and NiGe contacts, high performance Ge nanowire pMOSFETs exhibit low SS of 66 mV/dec, small DIBL of 35 mV/V and a high $\text {I}_{ \mathrm{\scriptscriptstyle ON}}/\text{I}_{ \mathrm{\scriptscriptstyle OFF}}$ ratio of ${2.1}\times {10}^{{6}}$ . The electrical behavior was also studied with temperature-dependent measurements. The deviation between the experimental SS and the ideal kT/q $\cdot $ ln10 values stems from the density of interface traps $(\text {D}_{\text {it}})$ . Our measurements suggest that lowering the top contact resistance is a key to further performance improvement of vertical Ge GAA nanowire transistors.
12 citations
TL;DR: In this article, the analog/RF performance study and analysis of high performance device-D2 (conventional HfO2 spacer SOI FinFET) and devices-D3 (source/drain extended HfN4 spacer SINR SOI finFET), over the low-dimensional simulation process through 3D simulation process is explored.
Abstract: Nowadays FinFET devices have replaced the MOS devices almost in all complex integrated circuits of electronic gadgets like computer peripherals, tablets, and smartphones in portable electronics. The scaling of FinFET is ongoing and the analog/RF performance is most affected by increased SCEs (short channel effects) in sub 22 nm technology nodes. This paper explores the analog/RF performance study and analysis of high performance device-D2 (conventional HfO2 spacer SOI FinFET) and device-D3 (source/drain extended HfO2 spacer SOI FinFET) over the device-D1 (conventional Si3N4 spacer SOI FinFET) at 20 nm technology node through the 3-D (dimensional) simulation process. The major performance parameters like Ion (ON current), Ioff (OFF current), gm (transconductance), gd (output conductance), AV (intrinsic gain), SS (sub-threshold slope), TGF = gm/Id (trans-conductance generation factor), VEA (early voltage), GTFP (gain trans-conductance frequency product), TFP (tans-conductance frequency product), GFP (gain frequency product), and fT (cut-off frequency) are studied for evaluating the analog/RF performance of different flavored SOI FinFET structures. For analog performance evaluation, device-D3 and D2 give better results in terms of gm, ID (drain current) and SS parameters, and for RF performance evaluation device-D1 is better in terms of fT, GTFP, TFP, and GFP parameters both at low and high values of VDS = 0.05 V and VDS = 0.7 V respectively.
11 citations
TL;DR: In this article, random telegraph noise (RTN) in trigate nanowire transistors (NW Trs) was systematically studied with respect to the NW size dependence, which is related to the characteristic of the traps, such as trap energy, is independent of NW size.
Abstract: Random telegraph noise (RTN) in trigate nanowire transistors (NW Tr.) is systematically studied with respect to the NW size dependence. Time to capture and emission, which is related to the characteristic of the traps, such as trap energy, is independent of NW size. On the other hand, noise amplitude increases as the NW size decreases showing the similar size dependence to the reported scaled planar Tr. In addition, RTN after hot-carrier injection (HCI) and negative bias stress (NBS) is studied. HCI and NBS induce additional carrier traps, which generate larger noise signals. Since the degradation by HCI or NBS is larger with narrower width, RTN after these stresses is found to be severer in the NW Tr.
10 citations
TL;DR: According to this study, a high degree of linearity occurs feasible while operating at low supply voltages making low-dimensional systems, and here in particular nanowires, an interesting candidate for portable RF applications.
Abstract: Nanostructures have attracted a great deal of attention because of their potential usefulness for high density applications More importantly, they offer excellent avenues for improved scaling beyond conventional approaches Less attention has been paid to their intrinsic potential for distinct circuit applications Here we discuss how a combination of 1-D transport, operation in the quantum capacitance limit, and ballistic transport can be utilized for certain RF applications In particular this work explores how the above transport properties can provide a high degree of transconductance linearity at the device level The article also discusses how device characteristics can be interpreted and analyzed in terms of device linearity if the above conditions are not ideally fulfilled Using aggressively scaled silicon nanowire field-effect transistors as an example device in this work provides new insights toward the proper choice of channel material to improve linearity through the above-mentioned transpor
10 citations
01 May 2016
TL;DR: In this paper, the authors introduce the device physics, modeling, and technology for the different silicon-based device structures, and the possibility to make use of CMOS fabrication steps for 3D Si die stacking is discussed.
Abstract: This chapter introduces the device physics, modeling, and technology for the different silicon-based device structures. Quantum-mechanical treatment for the device physics is done as well as the different and alternative approaches for advanced device simulation. The last section takes over the potential use that can be given to new materials and device structures. A preliminary set of applications are reviewed, such as Si-based materials with nanostructured properties, amorphous SiGe alloys applications such as thermal and photodetector sensors. Furthermore, the possibility to make use of CMOS fabrication steps for 3D Si die stacking is also reviewed.
10 citations
References
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TL;DR: In this article, a review highlights the recent advances in the field, using work from this laboratory for illustration, and the understanding of general nanocrystal growth mechanisms serves as the foundation for the rational synthetic control of one-dimensional nanoscale building blocks, novel properties characterization and device fabrication based on nanowire building blocks.
Abstract: ▪ Abstract Semiconductor nanowires and nanotubes exhibit novel electronic and optical properties owing to their unique structural one-dimensionality and possible quantum confinement effects in two dimensions. With a broad selection of compositions and band structures, these one-dimensional semiconductor nanostructures are considered to be the critical components in a wide range of potential nanoscale device applications. To fully exploit these one-dimensional nanostructures, current research has focused on rational synthetic control of one-dimensional nanoscale building blocks, novel properties characterization and device fabrication based on nanowire building blocks, and integration of nanowire elements into complex functional architectures. Significant progress has been made in a few short years. This review highlights the recent advances in the field, using work from this laboratory for illustration. The understanding of general nanocrystal growth mechanisms serves as the foundation for the rational sy...
1,407 citations
TL;DR: In this article, gate-all-around (GAA) n-and p-FETs on a silicon-on-insulator with 5-nm-diameter laterally formed Si nanowire channel were demonstrated.
Abstract: This paper demonstrates gate-all-around (GAA) n- and p-FETs on a silicon-on-insulator with /spl les/ 5-nm-diameter laterally formed Si nanowire channel. Alternating phase shift mask lithography and self-limiting oxidation techniques were utilized to form 140- to 1000-nm-long nanowires, followed by FET fabrication. The devices exhibit excellent electrostatic control, e.g., near ideal subthreshold slope (/spl sim/ 63 mV/dec), low drain-induced barrier lowering (/spl sim/ 10 mV/V), and with I/sub ON//I/sub OFF/ ratio of /spl sim/10/sup 6/. High drive currents of /spl sim/ 1.5 and /spl sim/1.0 mA//spl mu/m were achieved for 180-nm-long nand p-FETs, respectively. It is verified that the threshold voltage of GAA FETs is independent of substrate bias due to the complete electrostatic shielding of the channel body.
605 citations
TL;DR: In this paper, a scaling theory for fully-depleted, cylindrical MOSFET's was presented. But the scaling theory was derived from the cylinrical form of Poisson's equation by assuming a parabolic potential in the radial direction.
Abstract: We present a scaling theory for fully-depleted, cylindrical MOSFET's. This theory was derived from the cylindrical form of Poisson's equation by assuming a parabolic potential in the radial direction. Numerical device simulation data for subthreshold slope and DIBL were compared to the model to validate the formula. By employing the scaling theory a comparison with double-gate (DG) MOSFET's was carried out illustrating an improvement of up to 40% in the minimum effective channel length for the cylindrical device.
551 citations
TL;DR: In this paper, the authors describe computer simulations of various SOI MOSFETs with double and triple-gate structures, as well as gate-all-around devices.
Abstract: This paper describes computer simulations of various SOI MOSFETs with double and triple-gate structures, as well as gate-all-around devices. The concept of a triple-gate device with sidewalls extending into the buried oxide (hereby called a "/spl Pi/-gate" or "Pi-gate" MOSFET) is introduced. The Pi-gate device is simple to manufacture and offers electrical characteristics similar to the much harder to fabricate gate-all-around MOSFET. To explore the optimum design space for four different gate structures, simulations were performed with four variable device parameters: gate length, channel width, doping concentration, and silicon film thickness. The efficiency of the different gate structures is shown to be dependent of these parameters. The simulation results indicate that the the Pi-gate device is a very promising candidate for future nanometer MOSFET applications.
477 citations
TL;DR: In this paper, a general approach for the synthesis of a broad range of semiconductor nanowires (NWs) with precisely controlled chemical composition, physical dimension, and electronic, optical properties using a metal cluster-catalyzed vapor-liquid-solid growth mechanism was introduced.
Abstract: Semiconductor nanowires (NWs) represent an ideal system for investigating low- dimensional physics and are expected to play an important role as both interconnects and functional device elements in nanoscale electronic and optoelectronic devices Here we re- view a series of key advances defining a new paradigm of bottom-up assembling integrated nanosystems using semiconductor NW building blocks We first introduce a general ap- proach for the synthesis of a broad range of semiconductor NWs with precisely controlled chemical composition, physical dimension, and electronic, optical properties using a metal cluster-catalyzed vapor-liquid-solid growth mechanism Subsequently, we describe rational strategies for the hierarchical assembly of NW building blocks into functional devices and complex architectures based on electric field or micro-fluidic flow Next, we discuss a vari- ety of new nanoscale electronic device concepts including crossed NW p-n diode and crossed NW field effect transistors (FETs) Reproducible assembly of these scalable crossed NW de- vice elements enables a catalog of integrated structures, including logic gates and computa- tional circuits Lastly, we describe a wide range of photonic and optoelectronic devices, in- cluding nanoscale light-emitting diodes (nanoLEDs), multicolor LED arrays, integrated nanoLED-nanoFET arrays, single nanowire waveguide, and single nanowire nanolaser The potential application of these nanoscale light sources for chemical and biological analyses is discussed
252 citations