Universal Compact Model for Thin-Film Transistors and Circuit Simulation for Low-Cost Flexible Large Area Electronics
Citations
43 citations
Cites background from "Universal Compact Model for Thin-Fi..."
...[193] developed a universal compact model with a proper balance between the physical and mathematical approaches....
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33 citations
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Additional excerpts
...Both theories indicate the mobility dependency on the gate voltage [8][11]: μ ∝ (VG − Vth) , γ ≥ 0....
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19 citations
19 citations
Cites background from "Universal Compact Model for Thin-Fi..."
...Some studies focus only on modeling the DC behavior [8], which doesn’t support transient simulations....
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References
7,301 citations
"Universal Compact Model for Thin-Fi..." refers background in this paper
...Since the work by Hosono’s group in 2004 [5], amorphous oxide semiconductors (AOS)-based TFTs have attracted wide attention for their advantages of high mobility, small subthreshold swing, low leakage current, and process compatibility with the established a-Si TFT manufacturing facilities [6]....
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1,992 citations
"Universal Compact Model for Thin-Fi..." refers background in this paper
...Stacks of organic semiconductors (OSCs) and dielectrics are materials of choice for making truly flexible electronics by printing, with supermechanical flexibility of the films and stack structures, very low temperature and fast processing, and compatibility with various printing/coating technologies [11], [12]....
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1,130 citations
"Universal Compact Model for Thin-Fi..." refers background in this paper
...As a result of extensive research efforts on material design, process development, and device engineering, the performance of both reported p- and n-type organic TFTs (OTFTs) can outperform a-Si TFTs [13]–[15]....
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881 citations
"Universal Compact Model for Thin-Fi..." refers background in this paper
...With low temperature processibility, AOS TFTs are also regarded as a very promising solution for high performance flexible electronics [7]....
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876 citations
"Universal Compact Model for Thin-Fi..." refers background in this paper
...Beyond vacuum-based processes, printing or coating approaches are considered to be a more ideal solution for low cost and high throughput manufacturing of large area flexible electronics [8]–[10]....
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