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Proceedings ArticleDOI

Vapor chamber in high performance server

01 Oct 2009-pp 364-367
TL;DR: In this article, the thermal performance of the thermal module with the vapor chamber can be determined within several seconds by using the final formula associated with thermal-performance experimental method deduced in this paper.
Abstract: This article describes how to evaluate the thermal-performance of vapor chamber-based thermal module, which has existed in the thermal-module industry for a year or so especially in server application. Thermal-performance of the thermal module with the vapor chamber can be determined within several seconds by using the final formula associated with thermal-performance experimental method deduced in this paper. From the results, the thermal performance of the vapor chamber thermal module is times than that of pure copper base plate. And its thermal performance is closely relate to its dimensions and heat-source flux, in the case of smallarea vapor chamber and small heat-source flux, the thermal performance will be less than that of pure copper material. The maximum heat flux of the vapor chamber is over 800,000 W/m2, its thermal performance will increase with input power increasing, and the calculating error is no more than ±3%.
Citations
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Journal ArticleDOI
TL;DR: In this paper, the authors used experimental analysis with window program VCTM V1.0 to investigate the thermal performance of the vapor chamber and apply to 30 Watt high-power LEDs.

97 citations

Journal ArticleDOI
TL;DR: In this paper, the thermal performance of the LED vapor chamber-based plate is compared with the LED copper based plate with an input power above 5 W. And the experimental thermal resistance values of LED copper and vapor chamber based plate are 0.41°C/W and 0.38°C /W at 6 W respectively.

88 citations

Proceedings ArticleDOI
01 Oct 2010
TL;DR: In this paper, the thermal performance of the LED vapor chamber-based plate was evaluated with VCTM V1.0 and the results showed that the experimental thermal resistance values of LED copper-and vapor chamberbased plate respectively are 0.41°C/W and 0.38°C /W at 6 Watt.
Abstract: The vapor chamber has already been confirmed that its anti-gravity, high effective thermal conductivity and suited on the high heat flux of heat source as the integral heat spreader. This article describes how to evaluate the thermal-performance of LED vapor chamber-based plate with VCTM V1.0, which has existed in the thermal-module industry for a year or so especially in high power LEDs application. There are three kinds of LED based plates utilized to discuss the thermal performance and illumination. From the results, the thermal performance of the LED vapor chamber-based plate is many times than that of LED copper- and aluminum-based plate. And the LED vapor chamber-based plate works out hot-spot problem of 50 Watt high-power LEDs, successfully. The results are shown that the experimental thermal resistance values of LED copper- and vapor chamber-based plate respectively are 0.41°C/W and 0.38°C/W at 6 Watt. And the illumination of 6 Watt LED vapor chamber-based plate is larger 5 % than the 6 Watt. Thus, the LED vapor chamber-based plate has the best thermal performance above 5 Watt.

13 citations


Cites background from "Vapor chamber in high performance s..."

  • ...Wang et al. [13] have applied it in 30 Watt high-power LEDs vapor chamber-based plate and utilize the window program VCTM V1....

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  • ...At present, the thermal module manufacturer conducts the vapor chamber application in the higher order CPU and VGA cooler [11, 12]....

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  • ...According to Wang [12], the empirical equation (5), the equivalent thermal conductivity of the vapor chamber depends on dimensions and heat flux....

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Peer ReviewDOI
TL;DR: In this paper , the authors review thermal management strategies for major power electronics components in electric vehicles as well as their failure modes since high temperatures can be detrimental to the performance of power electronics.
Abstract: The design of the thermal management solution has a significant impact on the reliability and power density of power electronics. As the electric vehicle industry moves towards increasing the efficiency and output power, the cooling system must effectively remove the excess heat dissipated in power electronics. The main heat-generating components are the semiconductor switches, but other components, such as bus bars and power capacitors also dissipate heat and require cooling. Currently, indirect, direct, and double-sided cooling methods are the most common in electric vehicles and account for 14-33% of the total volume of traction inverters. However, power electronic packaging sizes are expected to decrease, while the heat dissipation continues to increase, hence advanced cooling technologies are being investigated. This paper aims to review the thermal management strategies for major power electronics components in electric vehicles as well as their failure modes since high temperatures can be detrimental to the performance of power electronics. Cooling designs that are currently implemented in electric vehicles and future cooling trends for the next generation of power electronics are reviewed as well.

10 citations

Proceedings ArticleDOI
29 Dec 2011
TL;DR: In this paper, the authors compared the thermal performance of a vapor chamber-based thermal module with a traditional Cu metal based plate embedded three heat pipes of 6 mm diameter at high heat flux GPU above 165 Watt.
Abstract: The vapor chamber has been verified the excellent heat transfer efficiency and heat spreading performance utilized particularly in many high-power and small area heat sources. This paper analyzes and compares the thermal performance of a vapor chamber-based thermal module with a traditional Cu metal based plate embedded three heat pipes of 6 mm diameter at high heat flux GPU above 165 Watt. They are estimated and simulated the optimum fin design of aluminum heat sink through computational numerical method and thermal resistance analysis at constant P-Q performance curve of a same commercial blower. These results show that the total thermal resistance value of vapor chamber-based thermal module are under 0.273 °C/W from simulation analytical data and that of heat-pipes and copper based plate thermal module are all over 0.273 °C/W. Therefore, the thermal performance of vapor chamber-based thermal module can be accurately simulated and analyzed by applying the method introduced in this paper. The vapor chamber-based thermal module can achieve the optimum thermal performance and the critical heat flux may exceed 100 Watt/cm2. Consequently, the vapor chamber-based thermal module introduced in this paper is able to cope with future GPU named RV 970 and GTX 590 with high heat flux of more than 60 Watt/cm2.

8 citations

References
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Book
01 Nov 1988
TL;DR: Physical data from the extensive world literature on more than 400 industrially important chemicals are provided in this article, including the NBS steam tables, for liquids and vapors at various temperatures and pressures.
Abstract: Physical data from the extensive world literature on more than 400 industrially important chemicals. Thermodynamic and transport properties for liquids and vapors at various temperatures and pressures are provided. The text also includes excerpts from the latest NBS steam tables. Includes conversion

99 citations

Journal ArticleDOI
TL;DR: In this article, the authors examined the spreading thermal resistance of centrally positioned heat sources and the thermal performance of a water charged, gravity assisted flat vapor chamber to be used for electronic cooling.

93 citations


"Vapor chamber in high performance s..." refers background in this paper

  • ...[9] showed a heat removal capacity of 220Watt/cm2 with a thermal spreading resistance of 0....

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Journal ArticleDOI
Jie Wei1
TL;DR: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed and the development of a new metallic thermal interface technology is introduced.
Abstract: Cooling technologies that address high-density and asymmetric heat dissipation in CPU packages of high-performance servers are discussed. Thermal management schemes and the development of associated technologies are reviewed from a viewpoint of industrial application. Particular attention is directed to heat conduction in the package and heat removal from the package/heat sink module. Power dissipation and package cooling characteristics of high-performance microprocessors are analyzed. The development of a new metallic thermal interface technology is introduced, where thermal and mechanical performance of an indium-silver alloy in the chip/heat spreader assembly was studied. The paper also reports on research on other thermal management materials, such as diamond composite heat-spreading materials. Some actual package designs are described to illustrate the enhanced heat spreading capability of heat pipes and vapor chambers.

83 citations


"Vapor chamber in high performance s..." refers background in this paper

  • ...[6] J. Wei, A. Chan, D. Copeland, Measurement of Vapor Chamber Performance, 19th IEEE semi-thermal symposium, 2003....

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  • ...Jie Wei [12] pointed that the integration of a vapor chamber yields a further improvement; the cooling performance is improved by 20% with a 20% weight reduction application in highperformance servers....

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  • ...[12] Jie Wei, 2008, Challenges in Cooling Design of CPU Packages for High-Performance Servers, Heat Transfer Engineering, Vol.29, No.2, pp.178-187....

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Journal ArticleDOI
TL;DR: In this paper, the authors presented a numerical investigation of a whole set of thermal module, including a plate-fin heat sink embedded with a vapor chamber, subject to the influence of concentrated heat sources.

66 citations


"Vapor chamber in high performance s..." refers background in this paper

  • ...The vapor chamber can reduce the spreading resistances sufficiently by its excellent lateral spreading effect [10]....

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Journal ArticleDOI
TL;DR: In this paper, the authors investigated the thermal performance of a heat sink with one and two pairs of embedded heat pipes and found that two and four heat pipes embedded in the base plate carried 36% and 48% of the total dissipated heat respectively.

38 citations


"Vapor chamber in high performance s..." refers methods in this paper

  • ...[3] Jung-Chang Wang, 2007, Investigation of Vapor Chamber VGA Thermal Module, TAIWAN ANSYS /Fluent USER CONFERENCE....

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  • ...[4] Jung-Chang Wang, 2008, The Best Thermal Performance Design for the Vapor Chamber Thermal Module, Taiwan Thermal Manager Associate and Technology Conference, No.9, pp.24-35....

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  • ...Wang [2] used an aluminum heat sink with embedded two and four heat pipes of 6 mm diameter; they can carry 36% and 48% of the total dissipated heat capacity from CPU and the total thermal resistance is under 0....

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  • ...[2] Jung-Chang Wang, 2009, Superposition Method to Investigate the Thermal Performance of Heat Sink with Embedded Heat Pipes, International Communication in Heat and Mass Transfer Vol.36, Issue 7, pp.686-692....

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