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Vibration Analysis for Electronic Equipment, 2nd Edition
30 Nov 1988-
About: The article was published on 1988-11-30 and is currently open access. It has received 60 citations till now. The article focuses on the topics: Active vibration control.
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TL;DR: Vibration fatigue test and analysis methodology for flip chip solder joint fatigue life assessment have been developed by performing vibration tests with constant G -level and varying G-level input excitation to predict vibration fatigue life.
81 citations
Cites background or methods from "Vibration Analysis for Electronic E..."
...Electronic equipment can be subjected to many different forms of vibration over wide frequency ranges and acceleration levels [1]....
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...The natural frequency for bare PCB with the clamped–clamped boundary condition can be obtained from the following equation [1]:...
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TL;DR: In this paper, the authors describe the service life of electronic packaging, such as in automotive, airplane, military and mobile electronic devices, and discuss the effects of concurrent vibration and thermal loading.
Abstract: Concurrent vibration and thermal loading is commonly encountered in the service life of electronic packaging, such as in automotive, airplane, military and mobile electronic devices. Solder joint r...
49 citations
Cites background from "Vibration Analysis for Electronic E..."
...As Steinberg addressed: “Solder is so important in this process that many people in the industry claim that the reliability of the electronic equipment amounts to the reliability of the solder joints” [1]....
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TL;DR: The results show that the failure mechanisms of BGA lead-free solder joint vary as the acceleration PSD amplitude increases, which is a concern in microelectronic industry.
45 citations
Proceedings Article•
01 Jan 2007
TL;DR: This paper presents a method for uncertainty analysis of prognostics with a focus on electronics subject to random vibration, and utilizes a sensitivity analysis to identify the dominant input variables that influence the model output.
Abstract: This paper presents a method for uncertainty analysis of prognostics with a focus on electronics subject to random vibration. First we identify uncertainty sources and types: measurement uncertainty, parameter uncertainty, failure criteria uncertainty, and future usage uncertainty. Next, we present an approach to determine the uncertainty in a prognostic analysis. Our approach utilizes a sensitivity analysis to identify the dominant input variables that influence the model output. With information of the input parameter variable distributions, a Monte Carlo simulation provides a distribution of accumulated damage. From the accumulated damage distributions, the remaining life can then be predicted with confidence intervals. A case study is presented whereby prognostics with uncertainty is applied to an electronic circuit board subject to random vibration. The results show that the experimentally measured failure time is within the bounds of the uncertainty analysis prediction.
42 citations
07 Aug 2002
TL;DR: In this paper, the authors address basic modeling issues regarding the mechanical shock and random vibration response of a typical personal computer motherboard and present guidelines for modeling of personal computer motherboards subjected to random base excitation and shock loads.
Abstract: This paper addresses basic modeling issues regarding the mechanical shock and random vibration response of a typical personal computer motherboard. Finite element modeling of an ATX-style motherboard was used to estimate the modal characteristics and dynamic response. Locally stiffened regions, such as sockets and large components, were modeled as simple blocks. The elastic modulus for these regions was determined by performing a 3-point bend tests on samples removed from the motherboard. The mode shapes and natural frequencies of the motherboard were computed and correlated with measurement. The dynamic response, due to random base excitation of the motherboard, was predicted by the model and showed very good correlation with measured acceleration response values. Mechanical shock response analysis was approached using two methods: direct time integration and the shock response spectrum method. Both provided good correlation with the measured peak acceleration response to an applied half-sine shock pulse. In addition, the predicted transient response was well correlated with acceleration time history measurements made during shock loading. It was observed that the shock response was dominated by the fundamental mode of the motherboard. Simple guidelines are presented for modeling of personal computer motherboards subjected to random base excitation and shock loads.
41 citations