wall Superheat Excursions in the Boiling incipience of Dielectric Fluids
TL;DR: In this paper, a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions is presented. But the authors do not consider the effect of temperature variations on the nucleation of microelectronic components.
Abstract: Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.
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Cray1
TL;DR: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation as mentioned in this paper.
Abstract: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid and gas and latent heat of vaporization of the cooling liquid also occur in channels through and over the components. The flow of cooling gas propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components such as integrated circuits which exhibit relatively high degree of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components in the computer.
121 citations
TL;DR: In this paper, a two-phase (water-air) circular free-surface jet is used to quench a cylindrical copper specimen, initially at a uniform temperature exceeding the temperature corresponding to maximum heat flux, by injecting small bubbles into the jet upstream of the nozzle exit.
Abstract: A proposed technique for controlling jet impingement boiling heat transfer involves injection of gas into the liquid jet. This paper reports results from an experimental study of boiling heat transfer during quenching of a cylindrical copper specimen, initially at a uniform temperature exceeding the temperature corresponding to maximum heat flux, by a two-phase (water-air), circular free-surface jet. The second phase is introduced as small bubbles into the jet upstream of the nozzle exit. Data are presented for single-phase convective heat transfer at the stagnation point, as well as in the form of boiling curves, maximum heat fluxes, and minimum film boiling temperatures at locations extending from the stagnation point to a radius of ten nozzle diameters. For void fractions ranging from 0.0 to 0.4 and liquid-only velocities between 2.0 and 4.0 m/s (11,300≤Re d,fo ≤22,600), several significant effects are associated with introduction of the gas bubbles into the jet. As well as enhancing single-phase convective heat transfer by up to a factor of 2.1 in the stagnation region, addition of the bubbles increases the wall superheat in nucleate boiling and eliminates the temperature excursion associated with cessation of boiling. The maximum heat flux is unaffected by changes in the void fraction, while minimum film boiling temperatures increase and film boiling heat transfer decreases with increasing void fraction. A companion paper (Hall et al., 2001) details corresponding results from the single-phase jet.
110 citations
TL;DR: In this article, the authors examined the influence of the dynamic solid/liquid contact angle and contact angle hysteresis on the incipience superheat of highly-wetting liquids and found that variations in contact angle induced by changes in the direction and magnitude of the liquid/vapor interface velocity can substantially affect the formation of bubble embryos.
107 citations
TL;DR: In this paper, experiments on pool boiling heat transfer in saturated R-113 at 1 atm pressure were conducted to investigate anomalies associated with the initiation of boiling using horizontal, 0.13 mm diameter chromel wires and a 0.51 mm diameter, platinum thin-film heater.
86 citations
TL;DR: In this article, the feasibility of cooling microelectronic components by means of single-phase and two-phase forced convection was evaluated using a single heat source flush mounted to one wall of a vertical rectangular channel.
Abstract: Experiments have been performed to assess the feasibility of cooling microelectronic components by means of single-phase and two-phase forced convection. Tests were conducted using a single heat source flush mounted to one wall of a vertical rectangular channel. An inert fluorocarbon liquid (FC-72) was circulated upward through the channel at velocities up to 4.1 m/s and with subcooling up to 46 {degree}C. The simulated microelectronic heat sources tested in this study include a smooth surface and three low-profile microstud surfaces of varying stud height, each having a base area of 12.7{times}12.7 mm{sup 2}. Correlations were developed for the single-phase convective heat transfer coefficient over the Reynolds number range from 2800 to 1.5{times}10{sup 5}, where Reynolds number is based on the length of the heater. The results demonstrate that the low thermal resistances required for cooling of microelectronic heat sources may be achieved with single-phase forced convection by using high fluid velocity coupled with surface enhancement. Experiments were also performed to understand better the parametric trends of boiling heat transfer from the simulated microelectronic heat source. It was found that increased velocity and subcooling and the use of microstud surfaces enhance nucleate boiling, increase the critical heat flux, and reduce themore » magnitude of temperature overshoot upon the inception of nucleation.« less
85 citations
References
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Book•
01 Jan 1994
TL;DR: In this paper, the basic models of two-phase flow are discussed and empirical treatments of two phase flow are provided. But the authors focus on convective boiling and condensing.
Abstract: Introduction 1. The basic models 2. Empirical treatments of two-phase flow 3. Introduction to convective boiling 4. Subcooled boiling heat transfer 5. Void fraction and pressure drop in subcooled boiling 6. Saturated boiling heat transfer 7. Critical heat flux in forced convective flow - 1. Vertical uniformly heated tubes 8. Critical heat flux in forced convective flow - 2. More complex situations 9. Condensation 10. Conditions influencing the performance of boiling and condensing systems 11. Multi-component boiling and condensation Appendix Index
2,426 citations
TL;DR: In this article, a regression analysis was applied to the nearly 5000 existing experimental data points for natural convection boiling heat transfer, which can best be represented by subdividing the substances into four groups (water, hydrocarbons, cryogenic fluids and refrigerants) and employing a different set of dimensionless numbers for each group of substances.
710 citations
Book•
01 Jan 1983
TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ
Abstract: Thermal analysis and control of electronic equipment , Thermal analysis and control of electronic equipment , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی
339 citations
TL;DR: A survey of the evolution of surface geometries that promote high-performance nucleate boiling can be found in this paper, where the authors survey the development of a high area density of stable nucleation sites whose performance does not deteriorate with time.
Abstract: This paper surveys the evolution of special surface geometries that promote high-performance nucleate boiling. Early work by Jakob and Fritz in 1931 showed that emery paper roughening or machined grooves provided only temporary performance increase. However, this improvement dissipated after a few days to the flat surface value. There was little sustained interest in this unique, but apparently unuseful, phenomenon until the mid-1950s. During the period 1955-1965, supporting fundamental studies of the character and stability of nucleation sites provided a basis for renewed efforts to develop a high area density of stable, artificially formed nucleation sites whose performance does not deteriorate with time. Beginning in 1968 industrial research produced patented technology that achieved the long-sought goal. In 1980 at least six high-performance nucleate boiling surfaces were commercially available. The technology reported in this paper represents a dramatic advance in the field of heat transfer.
192 citations