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What is the Young's Modulus of Silicon?

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TLDR
In this paper, the authors present the best known elasticity data for silicon, both in depth and in a summary form, so that it may be readily accessible to MEMS designers.
Abstract
The Young's modulus (E) of a material is a key parameter for mechanical engineering design. Silicon, the most common single material used in microelectromechanical systems (MEMS), is an anisotropic crystalline material whose material properties depend on orientation relative to the crystal lattice. This fact means that the correct value of E for analyzing two different designs in silicon may differ by up to 45%. However, perhaps, because of the perceived complexity of the subject, many researchers oversimplify silicon elastic behavior and use inaccurate values for design and analysis. This paper presents the best known elasticity data for silicon, both in depth and in a summary form, so that it may be readily accessible to MEMS designers.

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Microneedles: A smart approach and increasing potential for transdermal drug delivery system.

TL;DR: A new form of delivery system called the microneedles helps to enhance the delivery of the drug through this route and overcoming the various problems associated with the conventional formulations.
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Microneedle arrays as transdermal and intradermal drug delivery systems: Materials science, manufacture and commercial development

TL;DR: In this paper, a review of microneedle arrays can increase the number of compounds amenable to transdermal delivery by penetrating the skin's protective barrier, the stratum corneum, and creating a pathway for drug permeation to the dermal tissue below.
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Monolithic integration of hybrid perovskite single crystals with heterogenous substrate for highly sensitive X-ray imaging

TL;DR: In this paper, hybrid perovskite crystals are integrated onto silicon wafers enabling fabrication of an X-ray linear detector array, which may reduce patient dose in medical imaging applications.
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Nanoelectromechanical contact switches

TL;DR: The potential of NEM-switch technologies to complement or selectively replace conventional complementary metal-oxide semiconductor technology, and the challenges involved in the large-scale manufacture of a representative set of N EM-based devices are reviewed.
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Thin film metallic glasses: Unique properties and potential applications

TL;DR: In this paper, a review of properties and applications of thin-film metallic glasses (TFMGs) is presented, including solid-state amorphization upon annealing, the glass-forming ability improvement due to thin film deposition, and mechanical properties, including residual stress, hardness and microcompression, adhesion, and wear resistance.
References
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Book

Theory of plates and shells

TL;DR: In this article, the authors describe the bending of long RECTANGULAR PLATES to a cycloidal surface, and the resulting deformation of shels without bending the plates.
Book

Physical properties of crystals

John F. Nye
TL;DR: In this paper, the physical properties of crystals systematically in tensor notation are presented, presenting tensor properties in terms of their common mathematical basis and the thermodynamic relations between them.
Book

Acoustic Fields and Waves in Solids

Bert A. Auld
TL;DR: In this article, the authors apply the material developed in the Volume One to various boundary value problems (reflection and refraction at plane surfaces, composite media, waveguides and resonators).
Journal ArticleDOI

Silicon as a mechanical material

TL;DR: This review describes the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures.
Journal Article

Silicon as a mechanical material

TL;DR: In this article, the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures are discussed.
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