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How do you connect a heat sink to a transistor? 

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A synthetic jet-heat sink combination exhibits an identical thermal performance with that obtained with a conventional fan-heat sink mechanism.
Spreading resistance through the base of the heat sink is one major component of the total thermal resistance from the silicon junction to the local ambient, especially if larger volume heat sinks are to be used.
This new design of micro-channel heat sink have the potential to be employed for developing new generations of heat sinks with higher heat rejection capabilities for microelectronic devices.
Compared with conventional heat sink, the novelty of this passive heat transfer device is capable of realizing high heat transport performance.
Furthermore, when operating temperature was controlled at 65 °C, the novel heat sink could still transport heat flux of nearly 400 W, which showed its high heat flux transportation in heat dissipation of compact electronic devices.
The proposed cross-fin heat sink provides a practical alternative to the widely adopted plate-fin heat sinks.
Through some certain niche operation, t the thermal resistance of the partial bypass heat sink may be superior to the conventional heat sink.
The presented compound fin heat sink is capable of effectively enhancing the cooling performance for high-powered electronics.
We show also that the radius of the cylindrical SG drastically changes the temperature and heat flux distributions within the transistor devices.
It is also shown that the spreading resistance encountered when heat flows from a heat source to the base plate of a heat sink, while significant, can be compensated for by making appropriate design modifications to the heat sink.