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These values are the best ones ever reported for GaN-based normally-off transistors
Proceedings ArticleDOI
R. Heald, P. Wang 
07 Nov 2004
131 Citations
Hence, the small transistors in SRAM cells are particularly sensitive to these variations.
This allows the manufacture of many (in this case 11) IGFETs and associated test structures on a single chip with a large number of chips per wafer.
Analysis of fundamental, material, device, circuit, and system limits reveals that silicon technology has an enormous remaining potential to achieve terascale integration (TSI) of more than 1 trillion transistors per chip.
These values far exceed those found in Si MESFETs and are comparable to the best results achieved in GaAs/AlGaAs modulation-doped transistors.<<ETX>>
The fabricated transistors exhibit excellent I-V characteristics.
Journal ArticleDOI
K.I. Lundstrom, Christer Svensson 
136 Citations
These curves are useful in the design of MNOS-memory transistors.
The transistors exhibit high current gains over 200, which is comparable to those in transistors grown on InP substrates.
Open accessJournal ArticleDOI
Augustus K. Uht, V. Sindagi, S. Somanathan 
01 May 1997-IEEE Computer
37 Citations
The hardware required for large scale exploitation is great, but the density of transistors per chip is increasing exponentially, with estimates of 50 to 100 million transistors per chip by the year 2000.
Open accessProceedings ArticleDOI
24 Sep 2005
47 Citations
On the other hand, a further increase in the number of transistors on a single chip enables integrated hardware support for functions that formerly were restricted to the software domain.
To the best of our knowledge, these are the most radiation-hard thin film transistors reported to date.
These are the first reported metal gate transistors in the III‐V materials and the first using a nonepitaxial base and laterally seeded overgrowth.
Measurement of these devices reveals superior thermal characteristic and assures a larger ASO than that of conventional bipolar transistors of the same chip size.
Two transistors next to each other on the chip with exactly the same geometries and strain distributions may have characteristics from each end of a wide statistical distribution.
The chip has a novel wiring structure in which all pixels are connected through the channel of MOS transistors, which simplifies a wiring structure compared with conventional resistive networks.

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How GaN Field-Plate dielectric affect the TDDB?
5 answers
The presence of a field plate in GaN devices significantly impacts Time-Dependent Dielectric Breakdown (TDDB). Field plates enhance breakdown voltage, as evidenced by a GaN HEMT with a field plate exhibiting a breakdown voltage of 292V compared to 98V without a field plate. Additionally, the use of a field plate in GaN MIS-FETs contributes to robust forward gate TDDB stability, allowing for an extrapolated operating gate voltage of 7V or 8.8V after 10 years with 1% failure rate. However, the introduction of a field plate can lead to reduced frequency performance, with field-plated GaN HEMTs showing lower cut-off and maximum frequencies compared to those without field plates. Understanding the impact of field plates on TDDB is crucial for optimizing the reliability and performance of GaN devices.
What is paschen law for AC?
5 answers
Paschen's law for AC is a fundamental principle that describes the breakdown voltage between two electrodes in a gas-filled gap as a function of the product of gas pressure and the distance between the electrodes. This relationship is crucial for understanding electrical discharges in gases. Various studies have explored Paschen's law under different conditions. Experimental investigations have shown deviations from Paschen's law at elevated temperatures, leading to the proposal of theoretical corrections like the Peek and Dumbar corrections. Additionally, studies have highlighted the importance of considering the electrode geometry, such as the d/r ratio, in determining the breakdown voltage, leading to the concept of modified Paschen's law. Furthermore, a novel representation of Paschen's law based on the product of gas mass density and electrode gap distance has been proposed to account for temperature and pressure variations in estimating dielectric strength.
Is paschen law different for AC and DC?
5 answers
Paschen's law, which describes gas breakdown voltage, differs for AC and DC discharges. For DC discharges, Paschen's law relates breakdown voltage to gas pressure and electrode distance, with deviations observed at higher d/R ratios due to plasma-wall interactions. In contrast, for high-pressure gas switches in pulsed power systems, breakdown voltages deviate significantly from theoretical Paschen curves at high pd values, showing inconsistency across different gap spacings and pressures. Additionally, modifications to Paschen's law have been proposed to consider electron diffusion and mobility, as well as plasma-wall interactions, affecting breakdown voltages in different gas types and electrode distances. Therefore, while Paschen's law is fundamental for DC discharges, its application and modifications vary for different experimental setups and gas types.
What is the number of studies on memcapacitor emulator in the literature?
5 answers
There are five studies on memcapacitor emulators in the literature. These studies propose innovative designs for memcapacitor emulators using various components such as current feedback amplifiers, analog multipliers, resistors, and capacitors. The emulators are designed to operate at high frequencies, exhibit non-volatility behavior, and are robust against mismatch and process variations. Additionally, the studies demonstrate the expandability of memcapacitor circuits using memristors and mutators, enabling the construction of complex circuit configurations. The proposed emulators have been validated through simulations, experimental verifications, and post-layout analyses, showcasing their efficiency, low power consumption, and applicability in practical applications like neuromorphic computing.
How field-plate dielectric affect the TDDB of GaN-HEMTs?
5 answers
Field plates in GaN-HEMTs play a crucial role in enhancing breakdown voltage and reducing parasitic effects. Different field plate techniques, such as gate, source, and gate-source field plates, have been studied to optimize device performance. Optimized field plate structures like T-gate HEMTs with dual discrete field plates (DDFP-HEMT) and single discrete field-plate (SDFP-HEMT) have shown improved breakdown characteristics and current collapse suppression, leading to higher off-state breakdown voltages and reliability enhancement. Additionally, utilizing artificial neural networks (ANN) and particle swarm optimization (PSO) algorithms can efficiently optimize field plate structures like gate-source dual field plates to predict breakdown voltage and improve breakdown performance with high accuracy. These advancements in field plate technology contribute significantly to enhancing the reliability and performance of GaN-HEMTs under electrical stress.
What's the key characteristics of field-plate dielectric that affect the TDDB of GaN-HEMTs?
5 answers
The key characteristics of the field-plate dielectric that significantly impact the Time-Dependent Dielectric Breakdown (TDDB) of GaN-HEMTs include the stress level and composition of the dielectric film. Stress variations in the SiN field-plate dielectric film, ranging from compressive to tensile, influence isolation leakage and gate leakage current in AlGaN/GaN HEMTs. Additionally, the incorporation of a SiO2 pocket around the field plate edge in GaN-HEMTs results in a substantial reduction in electric field intensity, carrier temperature, and self-heating, leading to improved device performance and reliability. Furthermore, optimized field plate structures, such as T-gate AlGaN/GaN HEMTs with dual discrete field plates, demonstrate enhanced breakdown characteristics and current collapse suppression, contributing to improved TDDB behavior in GaN-HEMTs.
How passivation dielectic film which under the field plate of GaN affect the TDDB?
5 answers
Passivation dielectric films underneath the field plate of GaN devices play a crucial role in improving Time-Dependent Dielectric Breakdown (TDDB) characteristics. High-k dielectric passivation, such as a mixed oxide of SiO2 and CeO2 with a high dielectric constant (k = 12.3), reduces the maximum electric field near the p-n junction edges, enhancing breakdown properties. Additionally, using low cure temperature Polybenzoxazole (PBO) as a passivation layer prevents intermixing of metal layers, ensuring device reliability. Incorporating composite passivation layers with Low-K dielectrics below the gate field plate and High-K dielectrics outside the field plate enhances voltage withstand and reduces surface electric leakage, improving device performance. SiN passivation on AlGaN/GaN transistors reduces surface traps, as evidenced by deep level transient spectroscopy measurements, highlighting the significance of passivation in mitigating surface defects.
What is recycle-GAN?
5 answers
Recycle-GAN is a data-driven approach for unsupervised video retargeting that focuses on translating content from one domain to another while maintaining the style specific to each domain. It combines spatial and temporal information, along with adversarial losses, to achieve content translation and style preservation. In the context of recycling gallium nitride (GaN) waste from the LED industry, the physical characteristics of LED waste containing GaN are analyzed, and various leaching methods are explored to extract valuable metals optimally. Acid leaching under high pressure, particularly using hydrochloric acid, is preferred for leaching GaN waste due to its high efficiency, reaching up to 98%. Additionally, GaN substrates coated with ZnO have been successfully reused for multiple growth cycles, showcasing the potential for sustainable reuse in the semiconductor industry.
What are good papers that explain the delta method of minimizing offset thermal EMFs?
5 answers
The delta method for minimizing offset thermal EMFs is well explained in the paper by Rodenbeck et al., where they introduce a technique called "delta modulation" (DM) to improve the sensitivity of RF subsamplers in radar and coherent receiver applications. This method involves feeding the time-average output of a monobit analog-to-digital converter (ADC) back to the ADC input with opposite polarity to correct for aggregate DC offsets, enhancing ADC sensitivity. The paper demonstrates the effectiveness of analog and digital DM circuits in correcting output quantization imbalance, even under varying temperature conditions, and improving baseband spectrum quality for realistic radar applications. The DM technique does not impact ADC linearity, as confirmed through two-tone testing.
Dopin thin fils effects
5 answers
Doping thin films can significantly impact their properties. For instance, iodine doping in polyterpenol thin films reduces the optical band gap, affecting transparency and hydrophilicity. In another study, doping undoped CdO films with elements like F and Sn alters carrier concentration and electron mobility, leading to shifts in fundamental absorption edges. Additionally, femtosecond-laser doping with selenium thin films on silicon substrates modifies surface structuring and dopant incorporation processes, influencing p-n diode behavior. Radiation effects in thin films are complex, involving surface effects, non-stoichiometry, and strain, which differ from bulk materials and impact electronic device performance. Understanding these diverse effects is crucial for tailoring thin film properties for various applications.
How transparent oxides can be used as gate dielectric?
5 answers
Transparent oxides can be utilized as gate dielectrics in various applications. For instance, in the study by Alshammari et al., a novel process was developed to fabricate thin film transistors (TFTs) using a binary oxide, Hf x Zn1- x O2- δ (HZO), for all transistor layers, including the gate and dielectric layers. This approach allowed for tuning the electronic properties of the oxide from conducting to insulating by adjusting the chemical precursors' flow ratio. Additionally, the work by ViolBarbosa et al. demonstrated that ionic liquid gating can induce a metallic phase in insulating films of WO3, altering the material's conductivity while maintaining transparency in the visible range. These studies highlight the versatility of transparent oxides in serving as gate dielectrics with tunable electronic properties for various electronic devices.